1. CREAM Scholarship Program in Secure Embedded Systems
Providing advanced degrees in cybersecurity
Developing solutions to cyber threats
Producing skilled workforce in cyber
Center for Reverse Engineering and Assured Microelectronics (CREAM) Scholarship Opportunity!
Eligibility Requirements
U.S. Citizen
18 years of age or older by August 1, 2019
Able to participate in summer internships at DoD facilities
Willing to accept post-graduate employment with DoD
Cumulative GPA > 3.2 for undergraduate juniors and seniors
and GPA > 3.5 for graduate applicants
Have interest in secure embedded systems and cybersecurity
Complete CAE Cybersecurity course requirements
Benefits: Awarded Participants receive….
Full tuition and educated related fees
Annual stipend at a rate $20K - $30K
(dependent upon degree pursued and can be prorated)
Summer research internships
Laptop
Book Allowance
Faculty and Professional Mentorship
Employment Placement after graduation
Application Deadline is February 16, :00PM EST
ONLINE Application weblink is
Please contact Dr. Michel Reece via phone: or for more info.
Student Awards are expected to be announced by July 2019