Liaison Report <Month><Year> v<#>

<Region> TC Chapter <Committee Name> Global Technical Committee
Liaison Report <Month><Year> v<#> Please save file name with version number as well (e.g., v1, v2,…) Make sure version number is the same as the file name and on the slide!

Example North America TC Chapter 3D Packaging & Integration Global Technical Committee Liaison Report November 2017 v2

Outline Optional Meeting Information Announcement
Leadership / Leadership Changes Committee Structure Changes Organization Chart Ballot Results Activities Approved via GCS Authorized Activities / Other Activities Authorized Ballots Abolished SNARFs Inactive Status Task Force Highlights Open SNARFs Requests Five-Year Review Staff Contact *Optional* For slides that are “None” – Do not delete the slide, place them after the “Backup” slide or “Hide” the slide, and update list. Optional

Meeting Information Last meeting Next meeting
<Date> at/at the <Event> <Location> Next meeting

Meeting Information Last meeting Next meeting Example
November 7, 2017 at the SEMI Standards NA Fall Meetings SEMI Headquarters in Milpitas, CA Next meeting Thursday, April 26, 2018 at Japan Spring 2018 Meetings @SEMI Japan office, Tokyo Do not need Example

Announcements Use this for high-level announcements (e.g. merging of 3DS-IC and A&P )

Announcement The proposal to transform the 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West. Proposal Details: To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a unified GTC To name the transformed GTCs as "3D Packaging and Integration" GTC Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters Example

Leadership Optional Co-chairs Name – Company *Optional*
Include any leadership changes here and change title to “Leadership Changes” Note: confirm the information here is the same as it is in the Org Chart Or include chart similar to CER with “TF/SC/CFG/TC Name”, “Previous Leader” and “New Leader” Optional

Leadership Changes Example WG/TF/SC/TC Name Previous Leader New Leader
S3 Revision TF Mark Fessler – ASM Glenn Holbrook – ASM Pressure Measurement TF Yanli Joyce Chen (UCT) Jeff Christian (WIKA Instruments) The Committee has moved this Task Force to Inactive Status. Example

Committee Structure Changes
To be used for newly formed or disbanded task forces. <Task Force name> [New] <Add Charter and Scope, or short description of the task force> Or include chart similar to CER with “Previous WG/TF/SC Name” and “New WG/TF/SC Name or Status Change”

Fan-Out Panel Level Packaging (FO-PLP) Panel Task Force [New] Charter Fan-Out Panel Level Processing (FO-PLP) technology is an enhanced wafer-level packaging technology, embedding die in a low-cost substrate which is patterned to allow higher density of IOs than would otherwise be supported by the chip size. A number of different formats – including circular and rectangular (including square) – have been proposed for the substrates into which the die are embedded. In the case of panels, there have been a large number of different rectangular/square sizes. This wide selection is delaying the wider acceptance of FO-PLP technologies, as the tools must be customized for each different aspect ratio. This Task Force will focus on the development of standards for the panels used for FO-PLP, with focus on panel dimensions. The Task Force will consider other parameters as suggested by the wider community as being appropriate for standardization. Scope This Task Force will develop one or more standards focusing on panels for FO-PLP applications, focusing on parameters such as Size ID marking and orientation Edge exclusion Geometric parameters, such as total thickness variation (TTV), bow, warp, etc. Example for New TF

Fiducial Mark Interoperability Task Force The TF was under the Japan TC Chapters of Silicon Wafers, PI&C, I&C, Traceability and former Assembly & Packaging. The TF’s discharge is completed by the agreement of Traceability at the TC Chapter meeting on Dec 15, 2017. Example for disbanded TF To be used for newly formed or disbanded task forces. <Task Force name> [New] <Add Charter and Scope, or short description of the task force> Or include chart similar to CER with “Previous WG/TF/SC Name” and “New WG/TF/SC Name or Status Change”

Previous TF/SC/CFG Name New TF/SC/CFG Name or Status Change None Fan-Out Panel Level Packaging (FO-PLP) Panel TF (new) Example To be used for newly formed or disbanded task forces. <Task Force name> [New] <Add Charter and Scope, or short description of the task force> Or include chart similar to CER with “Previous WG/TF/SC Name” and “New WG/TF/SC Name or Status Change”

<Name of TF> Task Force <Name of TF> Task Force
Organization Chart <Region> TC Chapter of <Committee Name> Global Technical Committee C: <Name> - <Company> C: Please contact Laura if you need help creating your Org Charts. <Name of TF> Task Force L: <Name> - <Company> L: <Name of TF> Task Force L: <Name> - <Company> L:

Current Structure of Japan TC Chapter Organization Chart
Japan TC Chapter of Physical Interfaces & Carriers Global Technical Committee Physical Interfaces & Carriers Japan TC Chapter Tsuyoshi Nagashima (Miraial) Kenji Yamagata (Daifuku) Noriyoshi Toyoda (Hirata Corporation) Technical Architect Shoji Komatsu / Acteon NEXT Japan Electron Microscopy Workflow liaison TF Kyoichiro Asayama (JEOL) Tsuyoshi Onishi (Hitachi High-Technologies) Global PIC Maintenance TF Larry Hartsough (U.A. Associates) Shoji Komatsu (Acteon NEXT) International Activities Fiducial Mark Interoperability TF I&C Committee: M. Matsuda (Hitachi Kokusai Electric) PI&C Committee: S. Mashiro (Tokyo Electron) Silicon Wafer Committee: T. Nakai (SUMCO) Packaging Committee: S. Masuchi (DISCO) Traceability Committee: H. Tsunobuchi (KEYENCE) JA Shipping Box TF Tsuyoshi Nagashima (Mirial) Shoji Komatsu (Acteon NEXT) International 450mm Shipping Box TF Tom Quinn (Intel) Under Silicon Wafer Japan TC Chapter Example – needs minor changes The TF is under the Japan TC Chapters of Silicon Wafers, PI&C, I&C, Traceability and former Assembly & Packaging. The TF’s discharge is completed by the agreement of Traceability at the TC Chapter meeting on Dec 15, 2017.

Current Structure of Japan TC Chapter Organization Chart
Japan TC Chapter of Gases Global Technical Committee Gases Japan TC Chapter Hiromichi Enami (Hitachi High Technologies) Isao Suzuki (MKS Japan) Discharged Live Gas Flow Rate TF Shuji Moriya (Tokyo Electron Yamanashi) Seiji Ishihara (Flow Techno Service) Tetsuo Shimizu (Horiba STEC) Gas Panel Test Method TF Shuji Moriya (Tokyo Electron Yamanashi) Yoshifumi Machii (Fujikin) Example – needs minor changes

Organization Chart Example
NA TC Chapter of Physical Interfaces & Carriers Global Technical Committee C: Matt Fuller - Entegris C: Melvin Jung - Intel Global PIC Maintenance TF L: Larry Hartsough - U.A. Associates NA 450 mm ATDP TF (Inactive) L: Stefan Radloff - Intel International 450 mm PI&C TF L: Melvin Jung - Intel L: Shoji Komatsu - Acteon NEXT NA 450 mm Shipping Box TF L (NA): Tom Quinn - Intel L (JA): Shoji Komatsu - Acteon NEXT International Reticle SMIF Pod and Load Port Interoperability TF L: Jan Rothe - GLOBALFOUNDRIES Electron Microscopy Workflow TF L: Troy Morrison - Thermo Fisher Scientific Disband (pending) Disband Shared with the Japan Silicon Wafer TC Chapter Disband (pending) New Task Force Shared with the Japan Europe, and NA PI&C TC Chapters

Organization Chart Example
NA TC Chapter of 3D Packaging & Integration Global Technical Committee C: Sesh Ramaswami – Applied Materials C: Rich Allen – NIST C: Chris Moore – Frontier Semiconductor 3DP&I Bonded Wafer Stacks Task Force L: Rich Allen – NIST L: Steve Martell – Sonoscan Fan-Out Panel Level Packaging (FO-PLP) Panel Task Force L: Cristina Chu – TEL L: Rich Allen – NIST New Task Force Example 3DP&I Inspection & Metrology Task Force L: Victor Vartanian –GLOBALFOUNDRIES L: Ilona Schmidt – Corning

SEMI Corporate Color Palette
G = 165 B = 28 R = 255 G = 121 B = 0 R = 190 G = 214 B = 0 R = 255 G = 200 B = 46 R = 0 G = 0 B = 187 R = 88 G = 89 B = 91 R = 103 G = 59 B = 184 R = 128 G = 130 B = 133 Stay within standard color palette R = 226 G = 59 B = 48 R = 167 G = 169 B = 172

Ballot Results Doc # Document Title TC Chapter Action 6125A
Line Item Revision to Correct the Title of SEMI F (Reapproved 0712), Particle Specification for Grade 10/0.2 Flammable Specialty Gases Passed, with technical changes; Ratification Ballot to be issued 6211 Reapproval of SEMI F , Guide for Bulk and Specialty Gas Distribution Systems Passed, as balloted 6213 Reapproval of SEMI F (Reapproved 0710), Test Method for the Performance and Evaluation of Metal Seal Designs for Use in Gas Delivery Systems Failed, SNARF abolished 6054 Reapproval of SEMI E , Guide for Temperature Specifications of the Mass Flow Controller Failed R6056B Revision to SEMI E , Guide for Pressure Specifications of the Mass Flow Controller Passed, A&R Cycle SEMI E137 SEMI E (Reapproved 1111), Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment - Editorial Change made independently outside the Letter Ballot process (Delete “NOTE 2:…” after Section 3.1) Passed, to be submitted to ISC A&R SC Correct terms to be used in “TC Chapter Action” column (shall match the CER) Note: Use green font color for “Passed” and red for “Failed” Passed, as balloted Passed, with editorial changes Passed, Ratification Ballot to be issued Failed => Also include when applicable: Ratification Ballots – In the “TC Chapter Action” column, state either passed and what cycle or failed: Example: “Passed, A&R Cycle ” Other activities outside the Letter Ballot process – In the “Doc #” column, put the SEMI Standard Designation # – In the “Doc Title” column, put the full SEMI Standard title and underneath in parenthesis, briefly state what was done (Example: Delete “NOTE 2…” after section 3.1) – In the “TC Chapter Action” column, state either “Passed, submitted to ISC A&R SC” or “Fail” Note 1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review. Note 2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.

Activities Approved via GCS between Meetings
# Type SC/TF/WG Title/Details 6125A SNARF Gases Specification TF Revision to SEMI F (Reapproved 0712), Particle Specification for Grade 10/0.2 Flammable Specialty Gases with title change to Specification for Particle Concentration of Grade 10/0.2 Hydrogen Gas – Revision SNARF distributed for two-week TC Member review – GCS approved revision SNARF and authorized for ballot – Balloted in Voting Cycle 6290 Filters & Purifiers TF New Standard, Test Method for the Determination of Hydrocarbons Present on Wetted Surfaces of Ultra High Purity Gas Delivery Components and Plumbing Systems – TC Member Review took place between 09/11/2017 and 09/25/2017 before approval at the TC Chapter Meeting Correct terms to use: “To be distributed for two-week TC Member review” “TC Member Review took place between MM/DD/YYYY and MM/DD/YYYY before approval at the TC Chapter Meeting” “Approved and authorized for ballot voting Cycle X-20XX by GCS on MM/DD/YYYY”

Authorized Activities
Doc # Type TF Document Title/Details 6312 SNARF Heater Jacket Reapproval of SEMI F , Guide for Heater Systems Requirements – Authorized new SNARF - TFOF FO-PLP Panel Fan-Out Panel Level Packaging (FO-PLP) Panel TF (new) Electron Microscopy Workflow - Revision to TFOF 6311 New Standard, Specification for TEM Lamella Carrier Used in Electron Microscopy Workflows - TC Member Review took place between 10/13/2017 and 10/27/2017 before approval at the TC Chapter Meeting. In Document Title/Details column: <Document Title> Underneath, explain “details”: <bold and italicized> -Authorized new SNARF Note 1: SNARFs and TFOFs are available for review on the SEMI Web site at:

Other Activities Outside the Letter Ballot Process
Editorial change SEMI E (Reapproved 1111), Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment The “NOTE 2:…” is deleted after Section 3.1 To be presented to the TC Chapter at Fall Meeting 2017 Sometimes an approval of editorial changes, related information, and other types is made independently from a Letter Ballot at a TC Chapter meeting – use this slide for these items *remember to include under “Ballot Results” when this activity passes/fails <see slide 19, example for SEMI E137> >>Place slide after “Authorized Activities” Note: When this activity passes/fails, remember to include item under “Ballot Results”

Document Title/Details
Authorized Ballots Doc # When TF Document Title/Details R6125A Cycle Gases Specification TF Revision to SEMI F (Reapproved 0712), Specification for Particle Concentration of Grade 10/0.2 Hydrogen Gas 6291 Filters & Purifiers TF New Standard, Test Method for the Determination of Metallic Elements Present on Wetted Surfaces of Ultra High Purity Gas Delivery Components and Plumbing Systems 6312 Heater Jacket TF Reapproval of SEMI F , Guide for Heater Systems Requirements TBD Cycle HPPM&C TF Reapproval to F40, Practice for Preparing Liquid Chemical Distribution Components for Chemical Testing For “When” column use this format: Cycle X-20XX

Abolished SNARF(s) Doc # TF Title/Details 6111 Materials of Construction of Gas Delivery Systems TF Reapproval of SEMI F6-92, Guide for Secondary Containment of Hazardous Gas Piping Systems – Standard to receive Inactive Status; SNARF retired 6214 Mass Flow Controller TF Reapproval of SEMI F (Reapproved 0412), Test Method for Evaluating the Electromagnetic Susceptibility of Thermal Mass Flow Controllers – Reapproval ballot failed Committee review, new SNARF to be issued to reflect change in scope Include short description to explain why the SNARF was abolished. Correct terms to use: Reapproval ballot failed Committee review, new SNARF to be issued to reflect change in scope Standard to receive Inactive Status; SNARF retired [PM ] Activity discontinued

Standards to receive Inactive Status
Standard Designation Title SEMI F6 Guide for Secondary Containment of Hazardous Gas Piping Systems SEMI F13 Guide for Gas Source Control Equipment SEMI F14 Guide for the Design of Gas Source Equipment Enclosures

New Activities Example
Thermo Fisher Scientific presented the survey results of the TEM Grid Standarization Summary A fair response was obtained with all major IC manufacturers responding to the survey (n = 64) 90% of current sample handling is done manually and 75% of respondents would like to have it automated. > 80% of respondents are in favor of having standard grids for: Further automation (80%), TEM workflow efficiency (75%) Compatibility between tools used in workflow (70%) < 30% of respondents see drawbacks related to costs/compatibility Weigh cost benefit of additional standards i.e. Keep standardized grid costs < 1% value of a grid with lamella > 80% of respondents are in favor of a SEMI standardization effort and 60% of respondents are willing to actively contribute to this effort Electron Microscopy Workflow TF TFOF was approved during the PIC NA TC Chapter meeting at SEMICON West, July 12 Example

Task Force Highlights Use this slide for high-level topics and highlights Correct terms to use: -TC Chapter authorized -Authorized to ballot in Cycle X-20XX -Pending A&R -Approved by A&R -Forward to A&R for procedural review -Publication pending If space allows: *When listing Standards, remember to include the designation number and pubs date code along with reapproval date, if applicable, and title e.g., SEMI S3-1211, Safety Guideline for Process Liquid Heating Systems SEMI E (Reapproved 0512), Specification for 150 mm/200 mm Pod Handles *When listing SNARF Documents, list just the number (the Doc # implies that it is drafting) e.g., 5267A: New Standard, Specification for Microfluidic Port and Pitch Dimensions

Task Force Highlights [1/2]
Japan Electron Microscopy Workflow liaison Task Force Leadership Kyoichiro Asayama / JEOL Tsuyoshi Onishi / Hitachi High-Technologies Consideration about automation of TEM TF had discussions with Material Handling Makers and the participants found End User’s guidance is crucial for developing useful Standards. ESG-J AMHS SG shows its consideration about the automation of TEM as follows at Teleconference on March 22. Details are descried as attached. Q1: What is a “Purpose” of automation? Q2: What is the condition for automation? Showing the idea for TF’s globalization There are several material handling makers in Japan and that may help proceeding the activities for automation If it becomes a global TF, several topics could be handled in multiple local TFs respectively in parallel, so the Standardization for TEM could go faster. Example Use this slide for high-level topics and highlights Correct terms to use: -TC Chapter authorized -Authorized to ballot in Cycle X-20XX -Pending A&R -Approved by A&R -Forward to A&R for procedural review -Publication pending If space allows: *When listing Standards, remember to include the designation number and pubs date code along with reapproval date, if applicable, and title e.g., SEMI S3-1211, Safety Guideline for Process Liquid Heating Systems SEMI E (Reapproved 0512), Specification for 150 mm/200 mm Pod Handles *When listing SNARF Documents, list just the number (the Doc # implies that it is drafting) e.g., 5267A: New Standard, Specification for Microfluidic Port and Pitch Dimensions

Task Force Highlights [2/2]
Proposal for TFOF for Fan-Out Panel Level Packaging (FO-PLP) wide panel FOUP To be proposed at the next PI&C Japan TC Chapter meeting on April 26. To be proposed in response to the formation of Fan-Out Panel Level Packaging (FO-PLP) Panel Task Force under the 3D Packaging & Integration NA TC Chapter. TFOF to be proposed 1. Charter: This TF will focus on the development on Panel FOUP and related physical interface standards for FO-PLP utilizing existing SEMI 450mm standards. The target panel size is assumed as follows; Width 500~650mm x Depth 500~650mm 2. Scope: Develop the requirements for: Panel FOUP Equipment to Panel FOUP interfaces Example Use this slide for high-level topics and highlights Correct terms to use: -TC Chapter authorized -Authorized to ballot in Cycle X-20XX -Pending A&R -Approved by A&R -Forward to A&R for procedural review -Publication pending If space allows: *When listing Standards, remember to include the designation number and pubs date code along with reapproval date, if applicable, and title e.g., SEMI S3-1211, Safety Guideline for Process Liquid Heating Systems SEMI E (Reapproved 0512), Specification for 150 mm/200 mm Pod Handles *When listing SNARF Documents, list just the number (the Doc # implies that it is drafting) e.g., 5267A: New Standard, Specification for Microfluidic Port and Pitch Dimensions

Gases Task Force Reports [1/5]
Materials of Construction of Gas Delivery Systems TF Two ballots (SEMI F22, F74) adjudicated during Fall meetings (Please see previous slides under “Ballot Results”) Work ongoing SEMI F (Reapproved 1111)E, Test Method for Determining Pressure Regulator Performance in Gas Distribution Systems SEMI F4-0211, Specification for Pneumatically Actuated Cylinder Valves SEMI F , Test Method for Determining of Flow Coefficient for High Purity Shutoff Valves Surface Mount Sandwich Component Dimensions TF TF is inactive Example

Open SNARF(s) Bonded Wafer Stacks TF Example Open SNARFs
5173: New Standard, Guide for Describing Silicon Wafers for Use in a 300 mm 3DS-IC Wafer Stack Work ongoing: Granted one year extension at Spring Meetings Expiration date: April 4, 2018 6075 (formerly 5692): New Standard, Guide for Describing Glass-Based Material for Use in 3DS-IC Process Report from activity leader, Ilona Schmidt: Rich will circulate this document in the next few weeks for comments to get approval to ballot at Fall meeting. To be added to the distribution, please contact Rich Allen 6076 (formerly 5174): New Standard, Specification for Identification and Marking for Bonded Wafer Stacks Example Use this slide for ongoing activities not mentioned in the “Authorized Activities” slide For SNARF(s): open, 3-year document development status, and/or SNARF(s) granted one-year extension Include SNARF # only and document title, and summary of title/document depending on space (e.g. 6290: New Standard, Test Method for the Determination of Hydrocarbons Present on Wetted Surfaces of Ultra High Purity Gas Delivery Components and Plumbing Systems)

Open SNARF(s) [1/2] Example Do not need “#”
#6223 SEMI G (Reapproved 0811) Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes #6154 SEMI G10-96 (Reapproved 0811) Standard Method for Mechanical Measurement of Plastic Package Leadframes #6224 SEMI G11-88 (Reapproved 0811) Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds #6225 SEMI G13-88 (Reapproved 0811) Standard Test Method for Expansion Characteristics of Molding Compounds #6226 SEMI G15-93 (Reapproved 0811) Standard Test Method for Differential Scanning Calorimetry of Molding Compounds #6030 SEMI G20-96 Specification for Lead Finishes for Plastic Packages (Active Devices Only) #6227 SEMI G24-89 (Reapproved 0811) Test Method for Measuring the Lead-to- Lead and Loading Capacitance of Package Leads #6228 SEMI G25-89 (Reapproved 0811) Test Method for Measuring the Resistance of Package Leads #6229 SEMI G (Reapproved 0811) Specification for Leadframes for Plastic Molded S.O. Packages #6233 SEMI G E (Reapproved 0811) Test Method for Trace Contaminants in Molding Compounds Example Use this slide for ongoing activities not mentioned in the “Authorized Activities” slide For SNARF(s): open, 3-year document development status, and/or SNARF(s) granted one-year extension Include SNARF # only and document title, and summary of title/document depending on space (e.g. 6290: New Standard, Test Method for the Determination of Hydrocarbons Present on Wetted Surfaces of Ultra High Purity Gas Delivery Components and Plumbing Systems)

Requests from <Region> Chapter to <Region> Chapter
Use this slide if there are requests from one regional chapter to another

Requests [1/2] From Fall Meetings 2015 NA Chapter Request to Regional Counterparts
Request for participation and general comments NA is beginning to describe process defect found in patterned sapphire substrate (PSS) The below documents contain preliminary information Please provide feedback, comments, and any additional information you think is relevant Example

Requests from NA Chapter to Europe Chapter
International Reticle SMIF Pod and Load Port Task Force Disbandment of the International Reticle SMIF Pod and Load Port TF was approved by the NA Spring TC Chapter meeting on April 5, 2017. The NA PIC TC Chapter is requesting the Europe PIC TC Chapter to agree to disband the International Reticle SMIF Pod and Load Port TF in their region. Example

Note: delete empty rows
Five-Year Review Designation Standard Title Action By Assigned to *SEMI F (Reapproved 0613) Test Method for Determination of Filter or Gas System Flow Pressure Drop Curves Spring 2018 Filters & Purifiers TF Example Note: delete empty rows * Nonconforming title needs to be addressed in addition to Five-Year review

Thank you <Staff Contact Information>

Backup For slides with no updates, do not put “None” on the slide. Move slide(s) behind the “Backup” slide for future use.

Example for Joint Committees

North America TC Chapter Facilities & Gases Joint Global Technical Committee
Liaison Report November 2017 v5 Example

Meeting Information Facilities & Gases meet jointly
Last meeting November 7, 2017 at the SEMI Standards NA Fall Meetings SEMI Headquarters in Milpitas, CA Next meeting April 10, 2018 at the SEMI Standards NA Spring Meetings Only need to show this slide once if the meeting information is the same for both TC Chapters.

North America TC Chapter Facilities Global Technical Committee
Use this layout to separate the different Committees.

Questions? >> Does Regs still use WG? Should the tables be updated to CFG? -- Yes, you are correct. They will be updated. >> Should the standard color pallet be used? -- Yes, always stick within the standard colors >> When a TF becomes inactive, is there anything you need to do in Lotus Notes? -- No, updating the TF in Lotus Notes is only used when the TF is disbanded. >> The editorial changes outside the letter ballot process needs additional explanation. -- Yes, you are correct. Updates have been made to the Ballot Results slide. Be sure to add detail on a new line; make sure to begin with a hyphen and bold and italicized the font

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