1. Testing and Packaging of Wavelength Converters
Zhaoyang Hu, Milan Mašanović, Matt Sysak, John Barton,
Vikrant Lal, and Daniel J. Blumenthal
University of California
Santa Barbara, CA
Tel: (805) ;

2. Summary of Work Test work Packaging work Test work at UCSB
Test work at MIT Lincoln Labs
Packaging work
Thermal analysis
Die boding and wire bonding test

3. AOWC Device Testing Work
Test work at MIT Lincoln Lab
Probe station preparation for test work
at MIT Lincoln Lab Including device
mount, platform for DC probe holders, etc.
2.5Gb/s NRZ BER
measurement and
RIN measurement
Regeneration experiment
with AOWC
DARPA review
04/17
04/22
04/25
05/01
05/05
05/06
05/07
05/08
Date
Preliminary measurements
of BER, RIN measurement, etc.
At UCSB.
SFDR, Optical noise figure
and switching speed measurement
Experimental setup buildup
and AOWC measurement by
all-parameter analyzer
Discussion with MIT Lincoln Lab
for equipment list, test work at MIT Lincoln Lab

4. Measurement Setup
RIN measurement
BER measurement
SFDR measurement

5. Cascaded AOWC Test ---------Loop Configuration and Experiment data
Pre-dispersion
AOM
Loop output
10Gb/s
Receiver
Data input
data
EDFA
Driving current
for SGDBR laser
Clock
Recovery
Post-dispersion
OBPF
AOM PC
Constant
power here
OBPF
AOWC
OBPF
’data
Low saturation
EDFA
EDFA
Transmission
Fiber
spool
data
OBPF
data
OBPF
OBPF
EDFA PC
SOA

6. Low Saturation EDFA Buildup
Pump LD
Erbium-doped fibers
Gain-flatten
filter
WDM
WDM
Isolator
Output
Input signal
Fusion splice
Gain-flattening low saturation EDFA

7. Packaging Scheme Using laser-welding machine, cooperated with Teledyne
AuSn solder
(melting point 280oC)
AOWC
Fiber cap
Angled fiber
AlN submount
with Ti/Pt/Au film
Ferrule clip
Angled fiber
Fiber Kovar ferrule
Low-temperature
InSnPb solder
(melting point 95oC)
InSnPb solder
(melting point 118oC)
InSnPb solder
(melting point 118oC)
Butterfly package
Kovar submount
TE Cooler
74.5o angled fiber if SOA 7o tilted
15.5o 7o
23o
74.5o

8. Thermal Analysis device 1. Simulation tools: ANSYS AuSn
2. Without TE-cooler, the temperature of the device is 100oC with 0.5W
heat flux under a uniform ambient temperature of 25oC.
3. A constant temperature of 25oC is assumed at the bottom surface
of copper for 10s while the operation of the device
when TE-cooler is used.
4. A constant power of 0.5W and 1W is fed as a heat flux generated
from the device.
5. The initial condition assumes a uniform ambient temperature of 25oC.
6. The dimensions: device is 4.5mm  0.5mm  0.1mm; copper is
10mm4.5mm  5mm; AlN submount is 10mm 4.5mm 0.5mm;
AuSn solder preform is 4.5mm  0.5mm  0.1mm.
AuSn
solder
ambient
AlN
submount
Copper
heatsink
package
TE-cooler
2-D simulation results
0.5W heat flux
1W heat flux

9. Thermal Analysis 3-D simulation results 0.5W heat flux 1W heat flux
SMX=35.553oC
SMX=30.277oC
SMN=25oC
SMN=25oC

10. Die Bonding and Wire Bonding Test
Hard eutectic solder of Au/Sn (80wt%/20wt%), shows less creep, have higher yield
strengths and fluxless attachment.
Possible any hotspots due to solder voids lead to localized heating between die and
submount. It could be solved through attach a thin solder film at the bottom of the die.
Thin solder film
Solder
Die
AlN submount
Fluxless AuSn solder procesiing
Dummy sample for testing die and wire bonding

11. Chip-on-carrier With Probe Card

12. Future Work
Packaging
Cascaded AOWC test
Analogue characteristic measurement