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Total Development Cost (M$)
45 40 35 Design / Verification & Layout 30 Total Development Cost (M$) 25 20 Software 15 Figure 1 Caption – Increasing costs are limiting access to 90-nm design development. Test & Product Engineering Masks & Wafers 0.18 µm 0.15 µm 0.13 µm 90 nm 65 nm 45 nm
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Minimizing Risks of Custom Silicon
Delay ASIC Investment ASIC HardCopy II Fast Path to Production Low Up-Front Investment TAT in Weeks Stratix II Demonstrate Technology $0 NRE Instant TAT System Volume (Ku) Initial Investment (M$) Figure 2 Caption – Utilizing a structured ASIC such as Altera’s HardCopy allows designers to delay costly ASIC commitment, providing low up-front investment and a quicker production ramp. Time
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ASSP Startups– A New Approach
HDL FPGAStart FPGACust_1 FPGACust_2 FPGACust_3 FPGACust_4 FPGACust_5 FPGASuperset Figure 3 Caption – An ASSP vendor can integrate customer requests, modifications and enhancements into an FPGA-based design; then, after customer validation, the customer can create a HardCopy structured ASIC from the superset FPGA. SUPERSET Customer 5
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