1. North America Compound Semiconductor Materials Technical Committee Chapter
Liaison Report
May 26, 2017

2. Committee Co-chairs Leadership
Russ Kremer / Freiberger Compound Materials
Jim Oliver / Northrop Grumman

3. Current Committee Structure
North America
Compound Semiconductor Materials
Technical Committee Chapter
Silicon Carbide TF
Electrical Properties TF

4. Meeting Information Last meeting Next meeting
May 24 for CS MANTECH at Hyatt Regency Indian Wells
Palm Springs, California
Next meeting
May 9 for CS MANTECH 2018
Austin, Texas
More info at

5. Document Review Summary CS MANTECH 2017 Meeting
* Cycle 1, 2017 *
Doc #
Description
TC Action
6132
Line Item Revision of SEMI M Specification for Round 100 mm Polished Monocrystalline Germanium Wafers for Solar Cell Applications
Passed
6133
Line Item Revision of SEMI M Terminology For Identification Of Structures And Features Seen On Gallium Arsenide Wafers
6134
Reapprovals of SEMI M — Specification For Polished Monocrystalline Indium Phosphide Wafers, SEMI M , SEMI M , SEMI M , SEMI M , and SEMI M

6. Task Force Updates GaN TF Electrical Properties TF Silicon Carbide TF
Document 4979A (New Standard: Specification for Polished Monocrystalline C-Plane Gallium Nitride Wafers) published as SEMI M
TF was disbanded
Electrical Properties TF
ASTM F1.15 Subcommittee on Compound Semiconductors
Exploring GaN reference materials. Survey will be conducted.
Silicon Carbide TF
Liaison with Europe TC Chapter

7. Thank You!
For more information or to participate in any NA CSM activities, please contact Kevin Nguyen at SEMI