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Vertical-flexure CCD module: Thermal and Dynamic FEA

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Presentation on theme: "Vertical-flexure CCD module: Thermal and Dynamic FEA"— Presentation transcript:

1 Vertical-flexure CCD module: Thermal and Dynamic FEA
Bruce C. Bigelow University of Michigan Department of Physics 10/28/04

2 Vertical-flexure CCD module
Objectives: Accommodate Moly-Invar CTE mismatch with vertical flexure Moly CCD mount (see previous presentation) Demonstrate acceptable thermal stresses for package over survival temperature range Demonstrate acceptable modal performance for package

3 CCD module FEA

4 CCD module FEA

5 CCD module FEA

6 Vertical-flexure module FEA
Analyses: Neglect AlN, silicon from models (TZM and Invar only) No pre-stress of package at room temp TZM Flexure geometry (not optimized): Blade thickness = 0.4 mm (0.016”) Blade width = 8 mm (0.32”) Blade effective length = 4 mm (0.16”) Thermal: Simple delta-T = -160K, constant CTEs Frame constrained for zero mounting stress Dynamic: Mounting pads constrained TZM Flexure to Invar joint nodes coupled

7 CCD module FEA - elements

8 Vertical-flexure module FEA
Analyses: Thermal: Simple DT = -160K, constant CTEs Frame constrained for zero base stress at mounting Flexures and Invar base interface nodal deflections coupled at centerline to simulate single screw constraints (very conservative – neglects screw head constraint) Z constraints coupled at top of Invar surface (worst case)

9 CCD module FEA – node couples

10 CCD module FEA – frame stress
Max stress in flexures – 132 MPa – 19,410 PSI (TZM Sy = 860 MPa)

11 CCD module FEA – Invar stress
Max stress in Invar – 5.6 MPa – 812 PSI (Invar Sy = 300 MPa)

12 CCD module FEA - elements
Max distortion of Invar base (CCD mounting surface) is 0.1 micron

13 Vertical-flexure module FEA
Analyses: Dynamic: Modal analysis, reduced (Householder) modal extraction TZM - Invar interface nodal deflections coupled as in thermal case First 10 frequencies: SET TIME/FREQ

14 CCD module FEA - Dynamic

15 CCD module FEA - Dynamic

16 CCD module FEA - Dynamic

17 Vertical flexure CCD module
Conclusions: Thermal and dynamic FEA presented Low thermal stresses demonstrated with non-optimized TZM flexures High resonant frequencies demonstrated with non-optimized TZM flexures Optimal flexure dimensions still TBD for minimal stress and maximum first resonance


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