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Japan Compound Semiconductor Materials Committee Liaison Report

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Presentation on theme: "Japan Compound Semiconductor Materials Committee Liaison Report"— Presentation transcript:

1 Japan Compound Semiconductor Materials Committee Liaison Report
NA Spring Meetings 2012 April 25, 2012 conjunction with CS MANTECH Venue, Location, Date

2 General Information Leadership Meeting Co-chairs
Masayoshi Obara/ Shin-Etsu Handotai Co., Ltd. Compound Semiconductor Materials ommittee representative to the JRSC GCS voting member OPEN Meeting No TC meeting for long time

3 Compound Semiconductor Materials Committee Organization
Japan Compound Semiconductor Materials Committee Masayoshi Obara / SEH TBD International SiC TF Taizo Hoshino/ Nippon Steel 5 year Review TF Leader: Open Sapphire Substrate TF Toshiro Kotaki/ Namiki Precision Jewel Global 200mm GaAs Specification TF Leader: Open

4 Current Status No activity. However, the committee is interested in the activity related to the sapphire wafer specification under HB LED TC. Need to discuss whether or not the following task forces disband or energize Global 200mm GaAs Wafer Specification TF Five-year Review TF

5 Thank you! For more information, please contact:
Junko Collins, SEMI Japan


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