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Silicon Crystal Growth
Lecture 8.0 Silicon Crystal Growth
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Silicon Mfg. - old Produce Silicon metal bar Zone Refining – n times
To get purity Cut off impure end Use pieces to fill crystallization apparatus Grow Mono-Crystal of large size
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Zone Refining 0=x-Ut, k=CS/CL
Co=solute concentration in melt or of solid on first pass Co=0x+L Cs(x)dx - ox-L kCL(x)dx
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Si-Fe Phase Diagram
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Si-O Phase Diagram
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Crystal Growth
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Silicon Mfg. - new Produce ultra pure Silicon cylinder
Use pieces to fill crystallization apparatus Grow Mono-Crystal of large size
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Add Dopants to Silicon Grown
Melt is maintained with a given impurity concentration Melting Point is decreased Solid produced has a given impurity concentation
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Ultra-pure Silicon Production
Si + 3HClSiHCl3 +H2 fluidized bed reactor at 500 to 700K Condense chlorosilane, SiHCl3 Distillation of liquid SiHCl3 SiHCl3+H2Si + 3HCl at 1400K Si vapor Deposits on Si mandrel in a purged fed batch reactor heated to 700K Results Large diameter Si with impurities at 10 ppt or 14-9’s pure
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12” (30 cm) Boule
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Crystal Growth
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Czochralski Crystal Growth Apparatus
Figure 4. Today's Czochralski growth furnace, or crystal puller, is a far more sophisticated apparatus than that built by Gordon Teal nearly 50 years ago. It is however fundamentally identical. A crystal is pulled from a feedstock of molten material by slowly withdrawing it from the melt. Czochralski pullers often possess provisions for adding to the melt during a single pull so that crystals larger than what can be obtained in a single charge of the crucible may be produced. Today crystals of a 12-inch diameter are possible, and the industry will spend billions to adopt this new size in the coming years. This figure was taken directly from the Mitsubishi Semiconductor website: english/index-e.html!
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Czochralski Growing System
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12” (30 cm) Boule
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Crystal Growth Steps Induce Supersaturation Nucleation
Sub cooled melt S=exp[THf/(RT2)dT] Nucleation Growth at different rates on each Crystal Face Results in crystal with a particular Crystal Habit or shape
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Nucleation Free Energy Critical Size Nucleation Rate
GTOT=Gv V + A Critical Size R*=2AVm/(3vRgT lnS) Nucleation Rate J=(2D/d5)exp[- G(R*)/(RgT)] D=diffusion coefficient d= molecular diameter
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Surface Nucleation Surface energy, , is replaced by cos , where is the contact angle between phases Geometric factors changed Units #/(cm2sec) Surface Nucleation Limits growth of flat crystal surfaces
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Crystal Growth Boundary Layer Diffusion Surface Diffusion
Edge Diffusion Kink Site Adsorption Loss of Coordination shell at each step
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Crystal Growth Rate Limiting Steps
Boundary Layer Diffusion Surface Diffusion Surface Nucleation Mono Poly Screw Disslocation Edge Diffusion Kink Site Adsorption Loss of Coordination shell
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Screw Surface Growth
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Fluxes Boundary Layer Surface Edge
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Mass Transfer to Rotating Crystal
Local BL-MT Flux J[mole/(cm2s)] = 0.62 D2/3(Co-Ceq) n-1/6 w1/2 J[mole/(cm2s)] = 0.62 D2/3 Ceq(S-1) n-1/6 w1/2 Franklin, T.C. Nodimele, R., Adenniyi, W.K. and Hunt, D., J. Electrochemical Soc. 135, (1988). Uniform, not a function of radius!! Crystal Growth Rate due to BL-MT as Rate Determining Step
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Heat Transfer to Rotating Crystal
Local BL-HT Flux J[mole/(cm2s)] = h(Teq-T)/Hf J[mole/(cm2s)] = 0.62 k -1/3 n-1/6 w1/2 (Teq-T)/Hf Franklin, T.C. Nodimele, R., Adenniyi, W.K. and Hunt, D., J. Electrochemical Soc. 135, (1988). Uniform, not a function of radius!! Crystal Growth Rate due to BL-HT as Rate Determining Step
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Crystal Habit Equilibrium Shape Kinetic Shape h1/1=h2/2=h3/3
h1=G1(S)*t h2=G2 (S)* t h3=G3 (S)* t
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Crystal Faces Flat Face Stepped Face Kinked Face
Diffusion Distances to Kink sites are shorter on K &S Faces
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Crystal Habit
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Wafers Cut from Boule & Polished
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