1. Department of Physics, University of Michigan
SNAP NIR Detector Packaging Development: Towards a Universal SiC Detector Package
Bruce C. Bigelow
Department of Physics, University of Michigan
28 July 2005

2. SiC NIR Package Design Issues
Neither NIR device vendor is producing a package we want to use for SNAP
SiC is currently favored for SNAP focal plane components
It would be useful to have a common NIR package design for both RSC and RVS detectors
These designs shown here have the center of the sensor areas located at the center of the package, per the new detector ICD
The Hypertronics connector is offset per the new ICD
With the current connector IC, the Rockwell device exceeds the boundaries of the ICD volume
Open questions:
Connector to PCB electrical interface (solder joint?, bottom or side of connector?)
Connector to package mechanical interface (screw to package, not PCB)
Add bolt holes to connector?
7/21/05
B. C. Bigelow -- UM Physics

3. Raytheon and Rockwell Univ. packages
7/21/05
B. C. Bigelow -- UM Physics

4. Raytheon and Rockwell Univ. packages
Aperture mask
Raytheon
Rockwell PCB sticks out…
7/21/05
B. C. Bigelow -- UM Physics

5. SiC prototype pedestal
7/21/05
B. C. Bigelow -- UM Physics

6. SiC package design for quotations
7/21/05
B. C. Bigelow -- UM Physics

7. SiC coupon drawing for quotations
7/21/05
B. C. Bigelow -- UM Physics