1. Interleaver Performance Comparison of Winbond and TGn Sync
September 2004
doc.: IEEE /934r0
October 2004
Interleaver Performance Comparison of Winbond and TGn Sync
(Other documents: /r2, 1026/r0, 1105/r0 )
Jeng-Hong Chen
Pansop Kim
Winbond Wireless Design Center
Torrance, CA, USA
September 2004
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

2. Simulation Parameters (based on 11a)
September 2004
doc.: IEEE /934r0
October 2004
Simulation Parameters (based on 11a)
2X2, 3X3, 4X4 antennas
IEEE 11n Channel Models B and E
(20MHz) 64-pt FFT (48 data tones) and (40MHz) 128-pt FFT (108 data tones)
10% PER over 1000 simulated packets
1000 un-coded bytes per packet
Perfect CSI, Perfect AFC, AGC, ACQ
No pulse shaping filter, no ADC/DAC
CC rates=1/3,1/2, 2/3,3/4,7/8 from ½ CC code (K=7)
16QAM, 64QAM
24, 36, 48, 54,63 Mbps per transmit antenna
MMSE Receiver
TX and RX antenna spacing: 0.5 wavelength
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

3. 3D-A vs. TGn Sync in 20MHz BW 20 MHz (48 data subcarriers)
October 2004
3D-A vs. TGn Sync in 20MHz BW
20 MHz (48 data subcarriers)
3D-A: Ncolumn=16, Nrow=3 subcarriers
TGn Sync
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

4. TGn Sync Interleaver (IEEE 802.11-04/889r0)
October 2004
TGn Sync Interleaver (IEEE /889r0)
Ex. 20 MHz, NBPSC=1, NI=4, NCBPS=48, Ncolumn=16
Note: NSS=4 in the definition of above document. j  1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 … 47
k, OFDM 0 64
128 68
132 72
136 76
140 16 80
144 20
188
k, OFDM 1 61
125
189 65
129 69
133 73
137 77
141 17
185
k, OFDM 2 58
122
186 62
126
190 66
130 70
134 74
138
182
k, OFDM 3 55
119
183 59
123
187 63
127
191 67
131 71
135
179
Adjacent bits (ex. A(0), A(1), …, A(11)) are not evenly distributed over all subcarriers
Adjacent bits (ex. A(3),A(6),A(9),A(12)) are assigned to the same subcarrier.
Winbond proposed 3D Joint Interleaver, NBPSC=1, NI=4, NCBPS=48, Ncolumn=16 j  1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 …
k, OFDM 0 64
128 17 81
145 34 98
162 51
115
179 68
132 21
k, OFDM 1 16 80
144 33 97
161 50
114
178 67
131 20 84
148 37
k, OFDM 2 32 96
160 49
113
117 66
130 19 83
147 36
100
164 53
k, OFDM 3 48
112
176 65
129 18 82
146 35 99
163 52
116
180
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

5. 3D-A Interleaver v.s. TGn Sync, Channel B, 2x2
October 2004
3D-A Interleaver v.s. TGn Sync, Channel B, 2x2
Larger improvement over TGn Sync interleaver especially for more than two Tx.
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

6. 3D-A Interleaver v.s. TGn Sync, Channel B, 3x3
October 2004
3D-A Interleaver v.s. TGn Sync, Channel B, 3x3
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

7. 3D-A Interleaver v.s. TGn Sync, Channel B, 4x4
October 2004
3D-A Interleaver v.s. TGn Sync, Channel B, 4x4
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

8. 3D-A Interleaver v.s. TGn Sync, Channel E, 2x2
September 2004
doc.: IEEE /934r0
October 2004
3D-A Interleaver v.s. TGn Sync, Channel E, 2x2
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

9. 3D-A Interleaver v.s. TGn Sync, Channel E, 3x3
October 2004
3D-A Interleaver v.s. TGn Sync, Channel E, 3x3
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

10. 3D-A Interleaver v.s. TGn Sync, Channel E, 4x4
October 2004
3D-A Interleaver v.s. TGn Sync, Channel E, 4x4
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

11. 3D-A vs. TGn Sync in 40MHz BW 40 MHz (108 data subcarriers)
October 2004
3D-A vs. TGn Sync in 40MHz BW
40 MHz (108 data subcarriers)
3D-A: Ncolumn=12, Nrow=9 subcarriers
TGn Sync
More performance improvements than those of 20MHz comparisons.
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

12. October 2004
2X2, Channel B
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

13. October 2004
3X3, Channel B
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

14. October 2004
4X4, Channel B
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

15. October 2004
2X2, Channel E
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

16. October 2004
3X3, Channel E
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

17. October 2004
4X4, Channel E
Jeng-Hong Chen, Pansop Kim, Winbond Electronics

18. October 2004
The explosive 11n world requires an innovative, systematic structure to explore all available diversities in space, frequency and time—A 3D interleaver fits this purpose in all dimensions!!
Jeng-Hong Chen, Pansop Kim, Winbond Electronics