1. Heat Transfer in common Configuration

5. Dr. Mustafa Nasser

6. Dr. Mustafa Nasser

7. Dr. Mustafa Nasser

8. Dr. Mustafa Nasser

9. Dr. Mustafa Nasser

10. Dr. Mustafa Nasser

11. Dr. Mustafa Nasser

12. Dr. Mustafa Nasser

13. Dr. Mustafa Nasser

14. Transient Conduction Many heat transfer problems are time dependent
Changes in operating conditions in a system cause temperature variation with time, as well as location within a solid, until a new steady state (thermal equilibrium) is obtained.
We will focus on the Lumped Capacitance Method, which can be used for solids within which temperature gradients are negligible
Dr. Mustafa

15. Lumped Capacitance Method
Consider a hot metal that is initially at a uniform temperature, Ti , and at t=0 is quenched by immersion in a cool liquid, of lower temperature
The temperature of the solid will decrease for time t>0, due to convection heat transfer at the solid-liquid interface, until it reaches equilibrium.
Dr. Mustafa

16. Lumped Capacitance Method
If the thermal conductivity of the solid is very high, resistance to conduction within the solid will be small compared to resistance to heat transfer between solid and surroundings.
Temperature gradients within the solid will be negligible, i.e. the temperature of the solid is spatially uniform at any instant.
Dr. Mustafa

17. Lumped Capacitance Method
Starting from an overall energy balance on the solid:
(4.1)
where
Let’s define a thermal time constant
Rt is the resistance to convection heat transfer
Ct is the lumped thermal capacitance of the solid
(4.2)
Dr. Mustafa

18. Transient Temperature Response
From eq.(4.1) the time required for the solid to reach a temperature T is:
(4.3)
The total energy transfer, Q, occurring up to some time t is:
(4.4)

19. Validity of Lumped Capacitance Method
Surface energy balance:
Ts,1
qcond
qconv
Ts,2
(4.5) T

20. Validity of Lumped Capacitance Method
(From 4.5)
What is the relative magnitude of DT solid versus DT solid/liquid for the lumped capacitance method to be valid?
For Bi<<1, DT in the solid is small: The resistance to conduction within the solid is much less than the resistance to convection across the fluid/solid boundary layer.
Dr. Mustafa

21. Biot and Fourier Numbers
The lumped capacitance method is valid when
where the characteristic length: Lc=V/As=Volume of solid/surface area
We can also define a “dimensionless time”, the Fourier number:
where
Eq. (5.1) becomes:
(5.6)
Dr. Mustafa

27. Example (Problem 5.6 Textbook)
The heat transfer coefficient for air flowing over a sphere is to be determined by observing the temperature-time history of a sphere fabricated from pure copper. The sphere, which is 12.7 mm in diameter, is at 66°C before it is inserted into an air stream having a temperature of 27°C. A thermocouple on the outer surface of the sphere indicates 55°C, 69 s after the sphere is inserted in the air stream.
Calculate the heat transfer coefficient, assuming that the sphere behaves as a spacewise isothermal object. Is your assumption reasonable?
Dr. Mustafa

29. Example

30. Solution of thermocouples

32. Summary
The lumped capacitance analysis can be used when the temperature of the solid is spatially uniform at any instant during a transient process
Temperature gradients within the solid are negligible
Resistance to conduction within the solid is small compared to the resistance to heat transfer between the solid and the surroundings
The Biot number must be less than one for the lumped capacitance analysis to be valid.
Transient conduction problems are characterized by the Biot and the Fourier numbers.