1. LEPS Collaboration Meeting in Taiwan Update of TPC Analysis (II)
Jia-Ye Chen

2. Contents Time Projection Chamber Particle Identification
Get Pulses and Form Clusters
Set Hits and Find Track Candidates
Layer-Clustering (0.46-rk) and Wire-Clustering (0.47b)
Wire-Clustering Algorithm
Future Work

3. Time Projection Chamber

4. Particle Identification Algorithm

5. Get Pulses and Form Clusters

6. Set Hits and Find Track Candidates
Hit Position 2D

7. Layer-Clustering and Wire-Clustering

8. Layer Clustering R32273 Event 1 Layer 0

9. Layer Clustering R32273 Event 1 Layer 1

10. Wire Pulses R32273 Event 1

11. Wire Clustering R32273 Event 1
Cross Layer
Same Layer

12. Wire Clustering R32273 Event 1 Wire 50

13. Find Track Candidate

14. 0.46 W/O CorrectHit 0.47 W/O Tracking Raw Hits

15. R32273 Event 1 Raw Hits and Tracking Hitsy y x x
Tracking Hits
Raw Hits

16. Double-Counted Hits y z y z x x
Transverse : x and y
Longitudinal : z

17. Hits Separation dx dy dz
(mm) dy dz dz dx dx dy

18. Pile-up Pulses ΔZ

19. Wire-Clustering Algorithm
High ADC pulse as SEED
Find Time-Overlapped pulses on the same or neighboring layers, if time-overlapped pulses on the same layer, ask for neighboring pads.
A cluster requires that more than 3 pulses and 3 pads.
Hits which their separation, ΔZ, is smaller than 1 mm, are double-counted hits. Small max-ADC hit will be dropped.

20. Tracking Enhancement 1 hit per layer per track
More than 1 hit per layer per track

21. Future Work To merge Layer-Clustering and Wire-Clustering.
To extend tracking algorithm, # of hits per tracks will greater than 14.
Hope : Kick event