1. ITRS 2001 Factory Integration Chapter Model Information
ITRS Factory Integation TWG
2019/4/23
ITRS 2001 Factory Integration Chapter Model Information
1. Fab Ramp Model
2. Fab Capital Cost Model
3. Yield and Profit Model
2019/4/23
ITRS Factory Integration TWG
FITWG 2000

2. ITRS Factory Integation TWG
2019/4/23
Factory Integration Scope and Drivers UI
Factory
Operations
Production
Equipment
Factory Information
& Control Systems
Facilities
AMHS
Si Substrate
Mfg
Wafer
Mfg
Chip
Mfg
Product
Mfg
Distribution
Reticle
Mfg
FEOL
BEOL
Probe/Test
Singulation
Packaging
Test
Increasing cost &
Cycle time implications
The Factory continues to be driven by Cost, Productivity, and Speed
-> Reduce factory capital and operating costs per function remain challenging and important as ASP’s decline and factory are not 100% loaded
-> Customers continue to demand fast delivery of new and volume products. Competition dictates that we more quickly and pervasively qualify leading edge process technologies on new products
-> We continue to see the need to heavily reuse facilities and equipment to maintain or reduce cost even as we change wafer sizes or add more advanced process technology capabilities
Factory is driven by Cost, Productivity, and Speed:
Reduce factory capital and operating costs per function
Faster delivery of new and volume products to the end customer
Efficient high volume production, high reliability, & high equipment reuse
Enable rapid process technology shrinks and wafer size changes
2019/4/23
ITRS Factory Integration TWG
FITWG 2000

3. Manufacturing Strategy Evolution
ITRS Factory Integation TWG
2019/4/23
Manufacturing Strategy Evolution
Throughput
center-minded
Speed and environment center-minded
Specific Tech. Level
TR (Eq., AMHS, FICS)
Effort
Effort
Specific Tech.
Potential Solution
(Eq., AMHS, FICS)
Factory Operation
Requirement
* Manufacturing strategy requires different perspectives to understand requirements, needs, and solutions depending upon which level of the manufacturing hierarchy you look at.
* At the Enterprise level, the requirement is to deliver product to the customer from factories starting at design through delivery which is an end to end delivery concept. Cycle time means something very specific at this level and the systems to support it cast a wider net across the entire enterprise including mulitple factories, design and integration, etc.
At the technology level, we are concerned with products and equipment at the factory floor which support the high level requirements of the enterprise and which enable the enterprise to deliver. So run rate of process equipment and delivery time of AMHS is important
All of this must be integrated to ensure that the enterprise, factory, and equipment/product levels work together and efficiently
Enterprise Level
Requirement
Current values
Next generation Values
Wider coverage needed
FITWG 2000

4. ITRS Factory Integation TWG
2019/4/23
Search for New Metrics
Carrier Delivery Time
ECM
Facility
Technical
Element
Level
Equipment
Control
AMHS T/F Design
AMHS
AMHS MTTR & MCBF
SCM
FICS
Eq. Availability & Utilization
Production
Flexibility
Eq. Process
Speed
X Factor
Factory
Operation
Level
NPW Activity
NPW-Start Usage
Development
Speed
NPW
Control
ES & H
Productivity
Lot Cycle Time
For 2003, we have spent a considerable amount of time to understand which metrics are meaningful to suppliers, the Factory, and to the enterprise. We expect more emphasis in 2004 on the enterprise level of metrics and capabilities within the ITRS since the complexities of this level deal directly with the business and economics of semiconductor.
Productivity and flexibility measure for high mix
Production Methodology and Constraints
Consumables and cost reduction
Enterprise
Level
Line capability strategy
Floor Space Effectiveness
Energy saving
Product Development
FITWG 2000

5. Seek Higher Visibility
ITRS Factory Integation TWG
2019/4/23
Seek Higher Visibility
Newer Requirements
(Difficult Challenges)
More on Speed
Agile manufacturing
More on Environment
Newer visualization scheme needed
Example1: More of fab floor activity for better governance
Example2: of B factor in y=Ax+B equation for B reduction
Exmaple3: More of fab energy consumption for resource consumption reduction
Need newer metrics and domain concept into production CIM frame work
Visualization,
Fab Transparency
We are driving toward higher visability in the ITRS on cause and effect at the various
Potential Implementation
Solution
(System and Contents)
Accomodate various production methodology values in ITRS messages
FITWG 2000

6. What Does a Leading Edge 300mm Fab Look Like Today?
High product mix operations enabled using automation
100% AMHS Storage and Intrabay Transport Systems in place
Aggressive focus on lot cycle time reduction
Pervasive use of Standards for carriers, equipment interfaces, and software systems
FOUP carrier tracking using ID tags at load ports
Some Wafer Level Tracking &
Recipe/Parameter Changes
Very high use of APC and Yield systems
Factory Scheduler
And Material Control
Data
SPC
R2R
FDC
Yield
PCS
EPT
APC, Yield, and E-Manufacturing Capabilities (EEC)
Recipes
E-Diag
Systems Scaled for > 30k wspm
Equipment
Control Systems
Manufacturing
Execution Systems
Most equipment data feed through SECS/GEM communications
All lots and wafers tracked and processed using the MES
Equipment Performance Tracking (EPT) Data
Partner, Customer
Or Supplier
Some use of
E-Diagnostics

7. Some Projected Attributes of a 300mm < 45nm Fab
Wafer Data Standard
For Packaging
Data standards and
Systems for Rapid
Mask Set Creation
Very Fast Cycle time Fabs for Hot & Normal lots
Equipment & Systems designed for High Mix operation
100% Direct Tool Delivery AMHS
Aggressive NPW Reduction & Efficient Spares Mgmt
Full Wafer Level Tracking &
Recipe/Parameter Changes
Systems Scaled for > 50k wspm
Ubiquitous APC; Rapid Process Matching & New Product Qualification
Manufacturing
Execution Systems
Equipment Engineering Capabilities
Equipment
Control Systems
Equipment &
Process Data
SECS Control Line
APC
FDC
SPC
Recipes
Factory Scheduler
And Material Control
Yield
PCS
E-Diag
EPT
Equipment Data Acquisition (EDA) Standards to get Rich Equipment Data
Offline tools to test schedule rules and rapidly put in Mfg
Partner, Customer
Or Supplier
Pervasive
E-Diagnostics
Standard, Detailed Equipment
Performance Tracking (EPT) Data

8. Fab Ramp Model Assumptions
Factory Size
Metrics are driven by high-volume factories: 40K+ WSPM (or ~9.2K WSPW) that are either:
(a) high-mix factories
More than 5 large volume products, with no one product accounting for more than 50% of all wafers in the factory
(b) low-mix factories
Hot lots :
< 2% of all lots for hi-vol/low-mix; and <10% for hi-vol/hi-mix
Avg # of wafers per hot lot: wafers
Ramp rate
Based on leading-edge IC makers first high-volume fab for a major technology node (example 180nm to 130nm)
~20K WSPM
Alpha
tools
Beta
tools
PO for Production
capacity
400 WSPM
Slope ~ 4900wspm/qtr
~170 mm2 die
12 months
12 months
12 months
2019/4/23
ITRS Factory Integration TWG