1. MCMs & Hybrids AKA: Level 1½
IT 318: M11
MCMs & Hybrids
AKA: Level 1½
IT M11

2. Packaging Levels: Chip = 0 Module = 1 Card = 2 Board = 3 MCMs, Hybrids = 1½
IT M11

3. Packaging Levels: Chip = 0 Module = 1 Card = 2 Board = 3 MCMs, Hybrids = 1½
IT M11

4. MCM Examples
IT M11

5. MCM Examples
IT M11

6. MCM Examples
IT M11

7. MCM Examples
IT M11

8. Hybrid Examples
IT M11

9. Hybrid Examples
IT M11

10. Hybrid/MCM Characteristics
Higher frequencies possible
Higher power possible
Higher density possible
Lower failure rates
Lower weight
Lower flexibility
High NRE (Non-Recurring Engineering) costs
KGD (Known-Good Die) issues
Note: Green = Good; Red = Bad
IT M11