1. micro-chevron tip
dark area is bonded interface
crack
unpatterned wafer
patterned wafer
mouth
Force
Figure 1

2. ls = m
ws = m
ch = m
dh = m
Figure 2a

3. Force
micro-chevron tip
dark area is bonded interface
hole for mounting to materials testing machine
Force
Figure 2b

4. crack bonded β B region aj W load line bond plane A0 a H wLL w
unpatterned wafer
bond plane b)
patterned wafer A0 a H
wLL w
Figure 3

5. (a) Successful Test (b) Unsuccessful Test Figure 4
Change caption to read: Typical (a) successful and (b) unsuccessful microchevron tests. The vertical drop-off of the unsuccessful test typically represents the measurement of another failure mechanism, for example if one of the two chips breaks.
(b) Unsuccessful Test
Figure 4