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CMOS Layers n-well process p-well process Twin-tub process ravikishore.

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Presentation on theme: "CMOS Layers n-well process p-well process Twin-tub process ravikishore."— Presentation transcript:

1 CMOS Layers n-well process p-well process Twin-tub process ravikishore

2 MOSFET Layers in an n-well process
p-substrate n+ p+ n-well Gate NMOS PMOS FOX MOSFET Layers in an n-well process ravikishore

3 Layer Types p-substrate n-well n+ p+ Gate oxide Gate (polycilicon)
Field Oxide Insulated glass Provide electrical isolation ravikishore

4 Top view of the FET pattern
PMOS NMOS NMOS PMOS n+ n+ p+ p+ n-well ravikishore

5 Metal Interconnect Layers
Metal layers are electrically isolated from each other Electrical contact between adjacent conducting layers requires contact cuts and vias ravikishore

6 Metal Interconnect Layers
Ox3 Via Metal2 Active contact Ox2 Metal1 Ox1 n+ p-substrate n+ n+ n+ ravikishore

7 CMOS Gate Design A 4-input CMOS NOR gate

8 Complementary CMOS Complementary CMOS logic gates
nMOS pull-down network pMOS pull-up network a.k.a. static CMOS X (crowbar) Pull-down ON 1 Z (float) Pull-down OFF Pull-up ON Pull-up OFF

9 Series and Parallel nMOS: 1 = ON pMOS: 0 = ON Series: both must be ON
Parallel: either can be ON

10 Conduction Complement
Complementary CMOS gates always produce 0 or 1 Ex: NAND gate Series nMOS: Y=0 when both inputs are 1 Thus Y=1 when either input is 0 Requires parallel pMOS Rule of Conduction Complements Pull-up network is complement of pull-down Parallel -> series, series -> parallel

11 Compound Gates Compound gates can do any inverting function
Ex: AND-AND-OR-INV (AOI22)

12 Example: O3AI

13 Example: O3AI

14 Pass Transistors Transistors can be used as switches

15 Pass Transistors Transistors can be used as switches

16 Signal Strength Strength of signal
How close it approximates ideal voltage source VDD and GND rails are strongest 1 and 0 nMOS pass strong 0 But degraded or weak 1 pMOS pass strong 1 But degraded or weak 0 Thus NMOS are best for pull-down network Thus PMOS are best for pull-up network

17 Transmission Gates Pass transistors produce degraded outputs
Transmission gates pass both 0 and 1 well

18 Transmission Gates Pass transistors produce degraded outputs
Transmission gates pass both 0 and 1 well

19 Tristates Tristate buffer produces Z when not enabled 1 Z Y A EN

20 Nonrestoring Tristate
Transmission gate acts as tristate buffer Only two transistors But nonrestoring Noise on A is passed on to Y (after several stages, the noise may degrade the signal beyond recognition)

21 Tristate Inverter Tristate inverter produces restored output
Note however that the Tristate buffer ignores the conduction complement rule because we want a Z output

22 Tristate Inverter Tristate inverter produces restored output
Note however that the Tristate buffer ignores the conduction complement rule because we want a Z output

23 Multiplexers 2:1 multiplexer chooses between two inputs X 1 Y D0 D1 S

24 Multiplexers 2:1 multiplexer chooses between two inputs 1 X Y D0 D1 S

25 Gate-Level Mux Design How many transistors are needed?

26 Gate-Level Mux Design How many transistors are needed? 20

27 Transmission Gate Mux Nonrestoring mux uses two transmission gates

28 Transmission Gate Mux Nonrestoring mux uses two transmission gates
Only 4 transistors

29 Inverting Mux Inverting multiplexer
Use compound AOI22 Or pair of tristate inverters Essentially the same thing Noninverting multiplexer adds an inverter

30 4:1 Multiplexer 4:1 mux chooses one of 4 inputs using two selects

31 4:1 Multiplexer 4:1 mux chooses one of 4 inputs using two selects
Two levels of 2:1 muxes Or four tristates

32 D Latch When CLK = 1, latch is transparent
Q follows D (a buffer with a Delay) When CLK = 0, the latch is opaque Q holds its last value independent of D a.k.a. transparent latch or level-sensitive latch

33 D Latch Design Multiplexer chooses D or old Q Old Q

34 D Latch Operation

35 D Flip-flop When CLK rises, D is copied to Q
At all other times, Q holds its value a.k.a. positive edge-triggered flip-flop, master-slave flip-flop

36 D Flip-flop Design Built from master and slave D latches
A “negative level-sensitive” latch A “positive level-sensitive” latch

37 Holds the last value of NOT(D)
D Flip-flop Operation Inverted version of D Holds the last value of NOT(D) Q -> NOT(NOT(QM))

38 Race Condition Back-to-back flops can malfunction from clock skew
Second flip-flop fires Early Sees first flip-flop change and captures its result Called hold-time failure or race condition

39 Nonoverlapping Clocks
Nonoverlapping clocks can prevent races As long as nonoverlap exceeds clock skew Good for safe design Industry manages skew more carefully instead

40 Gate Layout Layout can be very time consuming
Design gates to fit together nicely Build a library of standard cells Must follow a technology rule Standard cell design methodology VDD and GND should abut (standard height) Adjacent gates should satisfy design rules nMOS at bottom and pMOS at top All gates include well and substrate contacts

41 Example: Inverter

42 Layout using Electric Inverter, contd..

43 Example: NAND3 Horizontal N-diffusion and p-diffusion strips
Vertical polysilicon gates Metal1 VDD rail at top Metal1 GND rail at bottom 32  by 40 

44 NAND3 (using Electric), contd.

45 Interconnect Layout Example
Gate contact Metal1 Metal2 Metal1 MOS Active contact ravikishore

46 Designing MOS Arrays A B C y x A B C y x ravikishore

47 Parallel Connected MOS Patterning
x x A B A B X X X y y ravikishore

48 Alternate Layout Strategy
x x X X A B A B X X y y ravikishore

49 Basic Gate Design Both the power supply and ground are routed using the Metal layer n+ and p+ regions are denoted using the same fill pattern. The only difference is the n-well Contacts are needed from Metal to n+ or p+ ravikishore

50 The CMOS NOT Gate Contact Cut Vp Vp X n-well X X X Gnd Gnd ravikishore

51 Alternate Layout of NOT Gate
Vp Vp X X X X Gnd Gnd ravikishore

52 NAND2 Layout Vp Gnd Vp X X X X X Gnd ravikishore

53 NOR2 Layout Vp Gnd Vp X X X X X Gnd ravikishore

54 NAND2-NOR2 Comparison X Vp Gnd X Vp Gnd MOS Layout Wiring ravikishore

55 General Layout Geometry
Vp Shared drain/ source Individual Transistors Shared Gates Gnd ravikishore

56 Graph Theory: Euler Path
Vp x Vertex b c x a Edge Out y c y Vertex a b Gnd ravikishore

57 Stick Diagram ravikishore

58 Stick Diagrams Cartoon of a layout. Shows all components.
Does not show exact placement, transistor sizes, wire lengths, wire widths, boundaries, or any other form of compliance with layout or design rules. Useful for interconnect visualization, preliminary layout layout compaction, power/ground routing, etc. ravikishore

59 Stick Diagrams Metal poly ndiff pdiff Can also draw in shades of
gray/line style. ravikishore

60 Stick Diagrams Buried Contact Contact Cut ravikishore

61 Stick Diagrams Stick diagrams help plan layout quickly
Need not be to scale Draw with color pencils or dry-erase markers

62 Stick Diagrams Stick diagrams help plan layout quickly
Need not be to scale Draw with color pencils or dry-erase markers Vin Vout VDD GND

63 Wiring Tracks A wiring track is the space required for a wire
4  width, 4  spacing from neighbor = 8  pitch Transistors also consume one wiring track

64 Well spacing Wells must surround transistors by 6 
Implies 12  between opposite transistor flavors Leaves room for one wire track

65 Area Estimation Estimate area by counting wiring tracks
Multiply by 8 to express in 

66 5 V Dep Vout Enh 0V 0 V Vin 5 v 5 v Vin ravikishore

67 Stick Diagram - Example I
NOR Gate OUT B A ravikishore

68 Stick Diagram - Example II
Power A Out C B Ground ravikishore

69 Points to Ponder be creative with layouts sketch designs first
minimize junctions but avoid long poly runs have a floor plan plan for input, output, power and ground locations ravikishore

70 The End ravikishore


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