1. North America Physical Interfaces & Carriers Committee
PI&C Liaison Report
Japan Spring 2009 Standards Meetings

2. Leadership Committee Co-chairs Technical Architect
Mutaz Haddadin / Intel
Stephen Sumner / Entegris
The NA PIC is currently looking for a co-chair to succeed Stephen Sumner.
The committee requests that the candidate be from the supplier community to maintain balance in leadership.
Technical Architect
Open
April 2009
NA PIC Report to JA PIC

3. Current Committee Structure
Physical Interfaces & Carriers Committee
C: Mutaz Haddadin / Intel
C: Stephen Sumner / Entegris
Integrated Measurement
Module - PIC TF
L: Len Kamlet / MKS Instruments
EUV Reticle Handling TF
L: Long He – Sematech / Intel
L: David Halbmaier – Entegris
L: Yoshio Gomei – Canon
L: John Zimmerman – ASML
Global PIC Maintenance TF
L: John Davies / TD Systems
450 mm IPIC TF
L: Mutaz Haddadin / Intel
L: Shoji Komatsu / Acteon
RFID Tag Implementation TF
L: Win Baylies / BayTech Group
Int’l 300 mm Wafer Shipping Box TF
L: Louise Courtois / IBM
L: Harry Lawrence / Entegris
Int’l E84 Revision TF
L: Jan Rothe / AMD
L: Mikio Otani / Asyst Japan
450mm Wafer Shipping Box TF (New)
L: Ram Patel / Intel
L: Eric Olson / Entegris
450mm ATDP TF (New)
L: John Rudolph / Intel
April 2009
NA PIC Report to JA PIC

4. Meeting Information Last meeting Next meeting
2009/04/01 at NA 2009 Spring Meetings Milpitas, CA
Next meeting
2009/07/16 at SEMICON West San Francisco, CA
April 2009
NA PIC Report to JA PIC

5. Ballot Results Summary Cycle 1-09
New Standard: Mechanical Specification of EUV Pod for 150 mm EUVL Reticles
Passed with editorial changes
4570
New Standard: Preliminary Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 Foup) and Kinematic Coupling
Failed and returned to tf
4598
Revision to SEMI E84, Specification for Enhanced Carrier Handoff Parallel I/O Interface
4599
New Standard: Mechanical Interface Specification for 450 mm Load Port
4705
Reapproval of SEMI E110, Guide for Indicator Placement Zone and Switch Placement Volume of Load Port Operation Interface for 300 mm Load Ports
Passed as balloted
4706
Reapproval of SEMI E19.4, 200 mm Standard Mechanical Interface (SMIF)
4707
Reapproval of SEM E92, Specification for 300 mm Light Weight and Compact Box Opener/Loader to Tool-Interoperability Standard (BOLTS/LIGHT)
April 2009
NA PIC Report to JA PIC

6. Upcoming Ballots Cycle 4-09
4570
New Standard: Preliminary Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 Foup) and Kinematic Coupling
450mm IPIC TF
4598
Revision to SEMI E84, Specification for Enhanced Carrier Handoff Parallel I/O Interface
Intl E84 Revision TF
4599
New Standard: Mechanical Interface Specification for 450 mm Load Port
4688
New Standard: Mechanical Specification for 450mm AMHS Stocker to Transport Interface
April 2009
NA PIC Report to JA PIC

7. Task Force Reports E84 Revision TF EUV Reticle Handling TF
EUV Pod ballot (#4466B) passed committee review with editorial changes
E84 Revision TF
E84 Revision ballot (#4598) failed committee review, returned to task force
Follow-up ballot expected for Cycle 4
April 2009
NA PIC Report to JA PIC

8. Task Force Reports [continued]
Global PIC Maintenance Task Force
TF ballot actions for additional PIC standards due for 5-Year Review were approved:
4705: E110 (300mm LP - Indicator Placement Zone & Switch Placement Volume)
4706: E19.4 (200mm SMIF)
4707: E92 (300mm BOLTS Light)
TF will now focus on consolidation of E1 standards
SEMI E1.9 will not be included in consolidation
April 2009
NA PIC Report to JA PIC

9. Task Force Reports [continued]
International 450mm PIC TF
Ballots for 450mm Carrier (4570) and 450mm Loadport (4599) failed and returned to task force; follow-ups expected for cycle 4-09
Info Ballot for 450mm Stocker Interface (4688 blue) issued; tech ballot expected for cycle 4-09
TF asked committee for formal decision on 12mm wafer pitch for 450mm FOUP. The committee approved this value.
Letter sent to ISMI on behalf of the task force
April 2009
NA PIC Report to JA PIC

10. Task Force Reports [continued]
450mm Shipping Box TF
TFOF & SNARF approved by GCS; first face-to-face meeting held at Spring Meetings
450mm Assembly Test Die Prep (ATDP) Task Force
TFOF approved at Spring Meetings
April 2009
NA PIC Report to JA PIC

11. SEMICON West 2009 Meeting Schedule (tentative)
Monday July 13
: Intl 450mm Physical Interfaces & Carriers Task Force
Tuesday July 14
Wednesday July 15
: NA 450mm Shipping Box Task Force
: Global PIC Maintenance Task Force
: Intl E84 Revision Task Force
: NA 450mm Assembly Test Die Prep Task Force
Thursday July 16
: NA PIC Committee Meeting
April 2009
NA PIC Report to JA PIC

12. Thank you! For more information, please contact:
Ian McLeod, SEMI Standards North America
April 2009
NA PIC Report to JA PIC