1. AIDA KICK OFF MEETING WP9
AIDA KICK OFF MEETING WP9.5: FEE sub-task Nathalie Seguin-Moreau Gisèle Martin-Chassard

2. Second generation ASICs for EUDET
Auto-trigger, analog storage, digitization and token-ring readout
Power pulsing : <1 % duty cycle
Optimize commonalities within EUDET (readout, DAQ…)
Dedicated run produced in March 2010
25 wafers received in June
chips packaged in the US
HARDROC2
SDHCAL RPC
64 ch 20 mm2
SKIROC2
ECAL Si
64 ch. 65 mm2
SPIROC2
AHCAL SiPM
36 ch 32 mm2
FLC_PHY3
(2003)
AIDA Kick Off meeting: WP9.5 FEE

3. HaRDROC : ILC (RPC) DHCAL readout
Hadronic Rpc Detector Read Out Chip
64 inputs, preamp + shaper+ 3 discris
Full power pulsing => 7 µW/ch
Fully integrated ILC sequential readout
Chip embedded in detector
chips produced in March to equip ch
HARDROC2B: run 2009
20 mm2= 20 k€
Fully equipped scalable m2 RPC SDHCAL detector built by IPN Lyon
F. Dulucq, G. Martin-Chassard, N. Seguin-Moreau
AIDA Kick Off meeting: WP9.5 FEE

4. SPIROC : ILC AHCAL readout
SPIROC : Silicon Photomultiplier Integrated Readout Chip
36 channels
Internal 12 bit ADC/TDC
Charge measurement (0-300 pC)
Time measurement (1 ns)
Autotrigger on MIP or spe (150 fC)
Sparsified readout compatible with EUDET 2nd generation DAQ
Pulsed power -> 25 µW/ch
(0.36m)2 Tiles + SiPM + SPIROC (144ch)
pedestal
MPV of MIP distribution
©E. Garutti (DESY)
32 mm2
32 k€
S. Callier, F. Dulucq, J. Fleury, L. Raux
AIDA Kick Off meeting: WP9.5 FEE

5. AIDA Kick Off meeting: WP9.5 FEE
SKIROC : ECAL readout
SKIROC2 : Silicon Kalorimeter Integrated Read-Out Chip
64 channels, 65 mm2
Very large dynamic range:
HG for MIP
LG for Mip
Internal 12 bit ADC/TDC
Time measurement (< 1 ns)
Autotrigger on MIP (4 fC)
Sparsified readout compatible
with EUDET 2nd generation DAQ
Pulsed power -> 25 µW/ch
Testability at wafer level
65 mm2 => 65 k€
S. Callier, F. Dulucq, N. Seguin-Moreau
AIDA Kick Off meeting: WP9.5 FEE

6. WP9.5: electronics readout
1st year:
Characterization of the 2nd generation ROC chips
Testbench/testbeam measurements
Prototyping of the 3rd generation of ROC chips.
Main modifications:
New Slow Control with I2C link
For all the ROC chips
New digital part:
Independent channels (all chips ?)
Read-Out, BCID management
New TDC (step=1 ns, no dead time):
For SKIROC3 and SPIROC3
New SCA:
For SPIROC3 and SKIROC3
Circular memory for HARDROC3 ?
Analog part
Preamp modifications for SPIROC3
HARDROC2
SDHCAL RPC
64 ch 20 mm2
SKIROC2
ECAL Si
64 ch. 65 mm2
SPIROC2
AHCAL SiPM
36 ch 32 mm2
AIDA Kick Off meeting: WP9.5 FEE

7. AIDA Kick Off meeting: WP9.5 FEE
Design difficulties
ASIC: design/simulation/layout : 12 ppm
New SCA + new TDC: 6 ppm, areax2
I2C interface :
slave already designed and tested by IPNL
8 extra pads for address
Serial interface but // distribution inside the chip
500 to 1000 SC parameters/chip => 500 to 1000 wires inside the chip
Independent channels :
HR3 : 6 ppm + Area x 1.3
Decrease nb of events stored (127/chip  8/ch)
New custom RAM per ch (+ 6 ppm or + 6K€)
SP3 : new architecture, 12 ppm + Area x 1.5
Decrease depth of SCA (16  8)
AIDA Kick Off meeting: WP9.5 FEE

8. MILESTONES and SCHEDULE
Milestones: Report in 30 months (August 2013)
AIDA budget for 3rd generation of electronics:
78 k€ (equipment) => 2 chip submissions (Hardroc3 and Spiroc3)
30 ppm
Cost:
Multi Project runs (MPW): 1k€/mm2
Packaging: $3500
Test-board: 1500 €
Schedule
1st chip : SPIROC3
Submission March 2012
Reception June 2012
1 year for tests and report
2nd chip : HARDROC3
Submission March 2013
Reception June 2013
1 year for tests
HARDROC2
SDHCAL RPC
64 ch 20 mm2
SKIROC2
ECAL Si
64 ch. 65 mm2
SPIROC2
AHCAL SiPM
36 ch 32 mm2
AIDA Kick Off meeting: WP9.5 FEE

9. AIDA Kick Off meeting: WP9.5 FEE
Backup slides
AIDA Kick Off meeting: WP9.5 FEE

10. Multi Project Run vs Dedicated Run
MPW: 1k€/mm2
25 dies delivered, to be packaged
Hundreds of dies are usually available (no guaranty): about 100 euros/die
Packaging: ~ $3.500
HR2 20 mm2: 20 k€,
SKIROC2 65 mm2: 65 k€
SPIROC2 32 mm2: 32k€
Engineering run:
Wafer 8’’, thinned down to 250 µm
2nd generation chip production: 250 k€
Thinning, Dicing, Packaging: 40 k€
AIDA Kick Off meeting: WP9.5 FEE