1. Module design for B-layer replacement V.1

2. Bare Module dimensions 16.200mm Active area 17.000mm 16.210mm Footprint 18.500mm stack 200um chip 20um bumps 250um sensor Module power load: 1.25W (also consider 1.0W and 1.5W)

3. Stave arrangement Modules abut one against the next (maybe assume 10um nominal gap for modeling) 48 modules per stave for 778mm total length. Readout/power from both ends.

4. Option 1: module with flex cable 14mm 500mm Flex cable 0.075mm 0.97mm Cable power load: 0.4W (uniform over full 50cm)

5. Option 2: cable in stave x (mm) 1mm 0.15mm kapton/glue 0.06mm aluminum Cable power load : 0.1/x 2 W/cm 2 Z=0 Z=+/- 40cm 80/x 2 W/cm 2 Would like to know sensor T vs. x