1. Takayuki Ohgoshi SIA in Japan Shanghai China 21- Feb. 2011
Draft
Regional Association Updates
of ESH Activities
Takayuki Ohgoshi SIA in Japan Shanghai China Feb. 2011

2. Members of ESH Task Force
TF Chair : Takayuki Ohgoshi (Renesas Electronics Corporation)
Energy : Tetsuya Kitagawa (Vice Chair) (SONY Corporation)
PFC : Minoru Kagino (TOSHIBA Corporation)
PFOS : Masanori Kobayashi (Fujitsu Semiconductor Ltd.)
Experts : Hiroyuki Matsukura (Renesas Electronics Corporation)
Secretariat : Akira Takamatsu (JEITA)

3. Organization of JEITA Semiconductor Environmental Committee
Expert Committee on Energy :
Search for the possibility of additional energy saving items
Share of best practice
Liaison council on energy conservation measure
Expert Committee on PFC :
PFC Emissions Reduction, Development of methodology on measuring of PFC emissions
Expert Committee on Chemical Substances :
Chemical usages Management , Reduce PFOS usages
Expert Committee on Resources Utilization :
Resource management & utilization
Waste Management (recycle, reuse, reduce)

4. Energy saving Key Activities
Collect and analyze 2010 energy data
Search the possibility of additional energy saving items
Analyze energy data to find more appropriate energy index than wafer area
Promote energy saving for Semicon-factories
Promote Liaison Council on Energy conservation with SEAJ, SEMI, JACA
Coordinate WSC-SEMI Energy Joint Policy Paper update

5. A Topic of Energy saving Key Activities
Search the possibility of additional energy saving items
JEITA is promoting supply chain (SEMI, SEAJ, JACA) to create a joint proposal to Government with regards to accelerate energy saving activities in which many manufactures are having technical difficulties.

6. Energy Consumption of JEITA Normalized by total area KwHr/cm2
Total Energy CY

7. PFC Key Activities Researching PFC Reduction technology
Continuing study on post 2010 activities and targets
Developing “Guideline for F-GHG Emission Measurement and Management ” and having provided it to SEMI
Studying the management method of Abatement Equipment 7

8. Guideline for GHG Emission Measurement and Management
Purpose
This guideline proposes
The efficient measuring method of the amount of emission of F-GHG, and the management of measurement.
The efficient measuring method of the reaction rate of F-GHG and the abatement efficiency of F-GHG in semiconductor manufacture equipment and liquid crystal manufacture equipment and abatement equipment.
The management method of the time and the frequency of measurement procedure and measurement in order to reduce the number of times and the enforcement cost of measurement.
This guideline provides users with the technical know-how which can be used for the operation management of process and abatement equipment through the series of options and explanatory matters.
Scope
This guideline is applied to the measurement of followings in Semiconductor and Liquid crystal industries
The amount of emission and the reaction rate of F-GHG of the manufacture equipment
The amount of emission and decomposition efficiency of F-GHG of abatement equipment
This guideline is aimed at the following seven kinds of greenhouse gas mainly used by the semiconductor industry among FCs.
(1) CF4, (2)C2F6, (3)C3F8, (4)c-C4F8, (5)CHF3, (6)SF6, (7)NF3 8

9. Emissions in 2010 became 50% to 1995.
PFC Emission of JEITA JEITA internal trend data by IPCC2006,Tier 2C
Emissions in 2010 became 50% to 1995. 9

10. Chemical Substances Key Activities
Collection of 2010 PFOS & PFOA data
The 2010 PFOS consumption decreased less than 8% compared with 2009
Watching the enforcement of relevant regulations
Technical instructions for the treatment of PFOS contained wastes were enforced in Sept by the Ministry of Environment
Submission of the comments to METI on CHINA’ｓ notification to the WTO TBT committee of the proposed management methods on control of pollution from electrical and electronic products

11. Chemical Substances Key Activities

12. Resource Management Key Activities
Promote recycle and reuse of water and waste
Collect and evaluate 2010 data of water and waste
Study on the trend of Effluent / Net Feed Water
Collect and evaluate 2010 “waste to landfill”
Study and share best practices for recycling technologies among member companies, for example, highly-pure recovery and high level recycling of Si polishing powder

13. Trend of Water Data of JEITA Net Feed Water normalized by total area l/cm2
Normalized water decreased smoothly from 2003 to 2010 by increasing total wafer area
In 2009, normalized water increased because of effect of fab. closing
Effluent / Net Feed Water increased slightly from 2001 to 2010 with some fluctuations

14. Trend of Waste Data of JEITA
Trend of Waste Data of JEITA Total Waste normalized by total area gr/cm2
Normalized Total Waste decreased from 2000 to 2010 with some fluctuations
The amount of “landfill waste” is very small compared with total waste, under 1% of total waste
The amount of “landfill waste” should fluctuates significantly year by year