1. AP 5301 / 8301 Instrumental Methods of Analysis
Course Coordinator: Prof. Paul K. Chu
Electronic mail:
Tel:

2. Reference Books
Encyclopedia of Materials Characterization, C. Richard Brundle, Charles A. Evans, Jr., and Shaun Wilson (Editors), Butterworth-Heinemann (1992)
X-Ray Microanalysis in the Electron Microscopy (4th Edition), J. A. Chandler, North Holland (1987)
Methods of Surface Analysis: Techniques and Applications, J. M. E. Walls (Editor), Cambridge University Press (1990)
Secondary Ion Mass Spectrometry, Benninghoven, Rudenauer, and Werner, John Wiley & Sons (1987)
Surface Analytical Techniques, J. C. Riviere, Oxford University Press (1990)
Modern Techniques of Surface Science, D. P. Woodruff and T. A. Delchar, Cambridge University Press (1994)
Analysis of Microelectronic Material Devices, M. Grasserbauer and H. W. Werner (Editors), John Wiley & Sons (1991)
Scanning Electron Microscopy and X-Ray Analysis (3rd Edition), J. Goldstein, D. Newbury, D. Joy, C. Lyman, P. Echlin, E. Lifshin, L. Sawyer, and J. Michael, Kluwer (2003)

3. Course Objectives COURSE OBJECTIVES
Basic understanding of materials characterization techniques
Emphasis on applications

4. Classification of Characterization Techniques
Microscopic techniques
Surface techniques
Depth profiling techniques
Spectroscopic techniques
Electrical techniques

5. Microscopy and Related Techniques
Optical Microscopy
Scanning Electron Microscopy (SEM) / Energy-Dispersive X-Ray Spectroscopy (EDS) / Wavelength-Dispersive X-Ray Spectroscopy (WDS) / X-ray Diffraction (XRD)
Transmission Electron Microscopy (TEM) / Scanning Transmission Electron Microscopy (STEM) / Electron Diffraction (ED)

6. Surface Characterization Techniques
Auger Electron Spectroscopy (AES)
X-ray Photoelectron Spectroscopy (XPS)
Scanning Probe Microscopy (SPM) – Scanning Tunneling Microscopy (STM), Atomic Force Microscopy (AFM), …

7. Depth Profiling Techniques
Auger Electron Spectroscopy (AES)
X-Ray Photoelectron Spectroscopy XPS)
Secondary Ion Mass Spectrometry (SIMS)
Rutherford Backscattering Spectrometry (RBS)
Capacitance-Voltage (CV) Measurement

8. Optical Spectroscopic Techniques
Spectrophotometry
Photoluminescence (PL)
Spectroscopic ellipsometry
Modulation spectroscopy

9. Electrical Techniques
Four-Point Probe
Hall Measurement
Capacitance-Voltage (CV) Measurement
Thermal Probe
Minority Carrier Lifetime Measurement

10. Ion Beam Techniques Rutherford Backscattering Spectroscopy (RBS)
Proton-Induced X-Ray Emission (PIXE)
Channeling

13. Product Yield Enhancement
Understand via modeling and simulation which parameters can improve product yields
Systematically identify these parameters within the process
Control and eliminate these parameters by identifying their root causes
Monitor these parameters to assess the effectiveness of the contamination control efforts

14. Surface Contaminant Identification
Particles – Optical Microscopy, SEM/EDS, AES, XPS, SPM
Residues – SEM/EDS, AES, XPS, SIMS
Stain, discoloration, haze – SPM, SEM, XPS, AES, SEM/EDS
General surface and near-surface contamination – XPS, AES, SEM/EDS, SIMS, RBS, PIXE

15. TiN Grains (SPM)

16. Residues on Integrated Circuit (SEM)

17. Integrated Circuit (SEM)

18. Hard Disk Defects (AES)

19. Depth Profiling

20. Gate Oxide Breakdown (SIMS)