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TGT Conductive Test Environment

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1 TGT Conductive Test Environment
5/14/2019 doc.: IEEE yy/0419r0 May 2005 TGT Conductive Test Environment Date: May 16, 2005 Authors: Notice: This document has been prepared to assist IEEE It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release: The contributor grants a free, irrevocable license to the IEEE to incorporate material contained in this contribution, and any modifications thereof, in the creation of an IEEE Standards publication; to copyright in the IEEE’s name any IEEE Standards publication even though it may include portions of this contribution; and at the IEEE’s sole discretion to permit others to reproduce in whole or in part the resulting IEEE Standards publication. The contributor also acknowledges and accepts that this contribution may be made public by IEEE Patent Policy and Procedures: The contributor is familiar with the IEEE 802 Patent Policy and Procedures < ieee802.org/guides/bylaws/sb-bylaws.pdf>, including the statement "IEEE standards may include the known use of patent(s), including patent applications, provided the IEEE receives assurance from the patent holder or applicant with respect to patents essential for compliance with both mandatory and optional portions of the standard." Early disclosure to the Working Group of patent information that might be relevant to the standard is essential to reduce the possibility for delays in the development process and increase the likelihood that the draft publication will be approved for publication. Please notify the Chair as early as possible, in written or electronic form, if patented technology (or technology under patent application) might be incorporated into a draft standard being developed within the IEEE Working Group. If you have questions, contact the IEEE Patent Committee Administrator at Alexander Tolpin, Intel Alexander Tolpin, Intel

2 5/14/2019 doc.: IEEE yy/0419r0 May 2005 Abstract This document introduces the description of Conductive Test Environment as a part of Recommended Practice for the Evaluation of Wireless Performance. The reason for writing this document is to get feedback from TGT group on “work under progress” in this direction. Alexander Tolpin, Intel Alexander Tolpin, Intel

3 Summary Definitions Purpose Test Equipment Typical setup
5/14/2019 doc.: IEEE yy/0419r0 May 2005 Summary Definitions Purpose Test Equipment Typical setup Examples of specific setups Alexander Tolpin, Intel Alexander Tolpin, Intel

4 Definitions from TGT draft
May 2005 Definitions from TGT draft Test environment: The set of external physical circumstances and conditions surrounding or influencing the wireless performance of the DUT/SUT. Conducted test environment: A test environment where RF test signals are directly injected into and received from the radio of the DUT using a cable. Controlled test environment: Any test environment where the circumstances and conditions surrounding or influencing the DUT/SUT are controlled to provide a known level of uncertainty. Shielded enclosure: A shielded box, screen room, or chamber used to isolate a test environment from outside RF signals. Alexander Tolpin, Intel

5 Definitions from TGT draft (cont.)
May 2005 Definitions from TGT draft (cont.) RF test signal: An RF signal introduced to the DUT/SUT for the purpose of testing its performance under a given set of conditions. Communication test signal: An RF Test signal carrying the communication traffic to or from the DUT or SUT. Interference test signal: An RF Test signal introduced or present at the DUT/SUT producing known levels and types of interference with the communication test signal. Extraneous signal: Any signal external to the test setup Internal interference signals: Platform noise or other similar signals that are internal to the DUT/SUT rather than externally applied as part of the test. This does not include thermal noise. Alexander Tolpin, Intel

6 Purpose of Conductive Test Environment
May 2005 Purpose of Conductive Test Environment Provide good control of test parameters Provide good visibility of test results Minimize an impact of extraneous signals Guarantee high repeatability of test results (1-2%) – over-time and location. Model real-life experience for example, TPT vs. Attenuation correlates with TPT vs. range in LOS. Alexander Tolpin, Intel

7 Main Test Equipment May 2005
DUT – any wireless device (AP or Client) that includes relevant SW running on the specific platform WLCP (WireLess CounterPart) - reference AP or a reference Client or just a RF signal generator depending on test objectives WLCP may be also a source of internal interference signals Shielded enclosure for DUTs and WLCPs in order to isolate from extraneous signals Cables RF-cables – connected to antenna connectors. Wired LAN cables Control cables Attenuators – to control attenuation (which means path loss) and RF signal input power Alexander Tolpin, Intel

8 Main Test Equipment (cont.)
May 2005 Main Test Equipment (cont.) Calibrated combiners, splitters and couplers – to handle different RF path, including antennas entries. Power Meter Devices – to measure RF signal power per packet Traffic Analyzer – to gather and analyze traffic through RF cables Wired Traffic Generator to generate data traffic from DUT to WLCP and from WLCP to DUT on top of layer 2. Wired Traffic Analyzer to gather delivered data payload over time through wired interface on top of layer 2. Alexander Tolpin, Intel

9 Main Test Equipment (cont.)
May 2005 Main Test Equipment (cont.) Test controller includes the following capabilities, likely automated and controlled by dedicated SW: The ability to control TX rates and TX power of WLCP and DUT The ability to control power meters. The ability to control attenuators The ability to control Wired Traffic Analyzer The ability to control Wired Traffic Generator. The ability to control Traffic Analyzer Alexander Tolpin, Intel

10 Typical conductive setup
May 2005 Typical conductive setup Alexander Tolpin, Intel

11 May 2005 Examples of setups Same test equipment may be used for many test setups depending on test objectives Examples: Few DUTs may work together (bandwidth sharing test) Few WLCPs may be used together, some of them, for example, to generate internal interference signals (ACI, Roaming) Different RF cables with different length controlled by attenuators may simulate multi-path effects Alexander Tolpin, Intel

12 TPT vs. Attenuation conductive setup
May 2005 TPT vs. Attenuation conductive setup Alexander Tolpin, Intel

13 Roaming conductive setup
May 2005 Roaming conductive setup Alexander Tolpin, Intel

14 May 2005 ACI conductive setup #1 Alexander Tolpin, Intel

15 May 2005 ACI conductive setup #2 Alexander Tolpin, Intel

16 Bandwidth sharing conductive setup
May 2005 Bandwidth sharing conductive setup Alexander Tolpin, Intel

17 Antenna Diversity conductive setup
May 2005 Antenna Diversity conductive setup Alexander Tolpin, Intel

18 May 2005 References P D0.1 - Draft Recommended Practice for the Evaluation of Wireless Performance Alexander Tolpin, Intel


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