1. Manufacturing Processes
Printed Circuit Board Assembly (PCB): Must specify or account for all components mounted into, onto or attached in some way to a printed circuit board as well as test for same
Electrical Components: Passives, IC’s, Optical, ElecMech, ElecMag, Connectors, Switches, Sensors, Protection Devices, etc
Mechanical Components: Heat Sinks, Thermal Grease, Pullers, Stiffeners, Mounting Hardware, Sensors, Protection Devices, etc
High Level Assembly (HLA): Must specify or account for all elements or parts of an assembly level including testing
Electrical Elements: PCB’s, Cables, Harnesses, Fans, Power Supplies, Sensors, Protection Devices, User Displays, Switches, etc
Mechanical Elements: Enclosures, Feet, Standoffs, Card Guides, Gaskets, Sealants, Fasteners, Hardware, etc

2. Printed Circuit Board Assemblies
Printed Circuit Boards (PCBs):
Convenient form of interconnecting electrical components using industry standard attachment processes
3 Basic Types of PCB-Component Assembly Technology
Thru Hole (TH)
Surface Mount (SMT)
Micro-electronic Multi-Chip-Module (MCM)
3 Basic Types of PCB substrate systems (fabs)
Rigid epoxy including FR4, BT and others
Ceramic, Alumina (Al203), AlNi or other exotics
Flexible Substrate (flex circuit)
Single, Double and Multi-Layered

4. Basic Photo-Etch
PCB Mfg Process
Plated Through Hole
PCB Cross Section

5. Cu PCB Trace Width & Depth
IPC Current Capacity Limitations

6. Cu PCB Trace Conductor
IPC* Spacing vs Voltage Summary (*Simplified)