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CLOUD INNOVATIONS Murugasamy (Sammy) Nachimuthu

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Presentation on theme: "CLOUD INNOVATIONS Murugasamy (Sammy) Nachimuthu"— Presentation transcript:

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2 CLOUD INNOVATIONS Murugasamy (Sammy) Nachimuthu
Sr. Principal Engineer, Intel Corporation

3 Agenda Cloud and OCP Intel® Platforms and Solution Innovations
System Firmware Improvements Summary and Call to Action

4 Cloud and OCP

5 Public Cloud Growth Continues – Driving Greater Infrastructure demands
BY 2021 Surge of data requires greater cloud infrastructure capacity Facility and equipment strained, 2X required over next 4 years  Higher-density compute-storage- networking essential Digital Retail $4.9T1 Digital Advertising $400B2 Digital Video & Media $120B3 Cloud Services $300B4 Digital Retail – eMarketer Jan/March 2018 Digital Ads – eMarketer May 2018 Digital video/media – Juniper Research, Subscription Video on Demand, Dec 2017 Xaas (cloud services) – IDC Public Cloud Services Tracker Forecast 2017H2, May 2018

6 Cloud and OCP Data Center Data Center Facility Rack Rack & Power Mapping Management Hardware Management Firmware Open System Firmware Platform Security Security Project Platform Server, Storage, Networking Cloud DC Solution Stack OCP Project(s) OCP Project(s) well-positioned to satisfy Cloud Solution Requirements

7 Intel® Platforms and Solution Innovations

8 New OCP Compute Platforms This Year
Mount Olympus Next Gen Platform for Cascade Lake Processor Cooper Lake Processor Platforms Multiple vendors offering Mt. Olympus & Tiogo Pass Wiwynn is offering both Mt.Olympus and Tiogo Pass system. We have Quanta, Foxconn, and other shipping the OCP systems 4S (2x 2S) 8S (4x 2S) 2S *Other names and brands may be claimed as property of others.

9 Intel® High-Density, Cloud-Optimized Platform
First Cloud-Optimized Platform 2U 450mm x 780mm 4S Intel ® Xeon® 6xxx VM optimized processors 48 DDR4 memory slots, SATA/SAS/NVMe 2.5” SSD drive bays Available in second half 2019 Key message: For greater cloud infrastructure capacity, We are investing in architecting reference designs for the next generation of cloud-optimized platforms (Crane Mountain) High core-count in a single 2U platform provides increased cloud service revenue opportunity, 80 to 112 cores = high performance VMs *Other names and brands may be claimed as property of others.

10 OCP Cards Support for AI Accelerators
Intel® NERVANATM Neural Network Processor (NNP) FOR TRAINING: FOR INFERENCE: Dedicated deep learning training acceleration Optimized memory and interconnects In production in 2019 Dedicated deep learning inference acceleration 10nm Intel® process node In production in 2019 Intel is a proud partner of the community *Other names and brands may be claimed as property of others.

11 Advancing Network Performance with OCP NIC 3.0 Adapters
25GbE Intel® Ethernet Network Adapters for OCP 2.0 Up to 100 GbE next gen Intel® Ethernet Network Adapter for OCP NIC 3.0 Now: OCP Mezzanine cards 2.0 Intel® Ethernet Network Adapters for OCP - 10GbE, 25GbE and 40GbE are available Q3‘19: OCP NIC 3.0 Adapters Complete OCP NIC 3.0 product family from 1GbE to GbE (1,10, 25, 50, 100) Flexible port configurations Work with us on implementing and validating your solutions 1GbE and 10GbE Intel® Ethernet Network Adapters for OCP NIC 3.0 *Other names and brands may be claimed as property of others.

12 Advancing Common SIPH Connectivity Standards
25T+ Integrated, Co-packaged Optical Switch IC Package 100G CWDM4-OCP Open standard optical hardware leveraging wafer scale manufacturing 100G CWDM4-OCP shipping in volume since 2017, 400G shipping in 2019 Working to standardize electrical interfaces (die-to-die and die-to-optical) for optical I/O and integrated networking/switch solutions

13 CLOUD - Managing at Scale Realities…
SW and FW Updates Errors SW & HW Service Outages @Scale Magnification

14 System Firmware Improvements

15 Cloud Firmware Update Challenges
Today’s OCP system contains many hardware components with firmware System Firmware – BIOS, BMC, etc. Device Firmware – Microcode, Network, Storage, PSU, etc. Over life time of the system, the firmware components are upgraded to address: Security, power, performance, bug fixes, debug/telemetry, etc. In most cases, system is rebooted to activate new firmware Switch Switch RMC I/O I/O - Firmware - What is the system reset means to Cloud availability? Processor Socket BIOS BMC Processor Socket I/O I/O PSU

16 Cloud Demands High Service Availability
Stop All VM and Services Shutdown OS/VMM Reboot System with new firmware Boot OS/VMM Restart VMs and Services Can you migrate workload in all cases in Cloud? System reboot affects the service availability Less Service Interruption Time is better Service Interruption Time Intel® working with partners in OCP on improving FW Upgrades

17 Runtime Firmware Activation Flow
OS Constructs for Runtime Updates Unix/Linux – kexec Windows – Memory Preserving Maintenance Firmware Activation Mechanics Pause/Preserve VMs Invoke Modified Reset flow Activate new FW Modules Load OS (memory contents still valid) Resume services Update FW Module (s) Pause/Preserve VMs Trigger FW Activation Service Blip FW Activation occurs in associated HW OS is Reloaded Services Resume

18 Platform Runtime Mechanism (PRM)
ASL Compute Offload Page table based access restrictions Readable and Auditable OS Level Software / Driver Platform Hardware SCI Opregion based h/w access SMM HW SMI ASL Methods Broadcast- stalling all threads. Black box – Hidden from OS Privileged - Unfretted access to hardware resources and memory Using SMM Using PRM h/w access ACPI Tables ACPI Tables SMM takes system time away from users. How easy to write ASL code? PRM allows to write C based runtime code SW SMI SMM Readable and Auditable PRM aims to reduce runtime SMMs

19 Advancing Cloud Innovations via OCP Projects…
Intel® High-Density, Cloud-Optimized Platform – Joint OCP contribution from Intel and Inspur Data Center Cooling based on Predicting Power - Plan to contribute Whitepaper and Redfish profile to OCP DCF Project Open System Firmware (OSF) Platform Runtime Mechanism (PRM) Multi-socket Firmware Support Package (FSP) & Coreboot Storage Disaggregation using NVMe over Fabrics (TCP/IP or RDMA)

20 Edge Computing Edge Requirements: Intel Innovations that benefit Edge:
Remote management Ease of maintenance Fail in place Failure Resilience   Intel Innovations that benefit Edge: Open Firmware and firmware complexity reduction Firmware resilience Rack & Power management

21 Call to Action Take advantage of Intel platform and solution contributions to OCP Participate and contribute to OCP Projects to enhance server & DC solutions

22 Thank You


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