1. Thermal studies status LAPP ATLAS ID dream team
ATLAS Pixel upgrade
Thermal studies status
Main actions
Current results
Conclusions
LAPP ATLAS ID dream team
Pierre-Yves David, Pierre Delebecque, Sabine Elles, Nicolas Geffroy, Stephane Jézequel, Remi Lafaye, Jessica Leveque, Nicolas Massol, Jean-Marc Nappa, Thibaut Rambure, Andre Rummler, Sébastien Vilalte

2. 1 – Main actions Simulation
Built and compute a « baseline mountain model » to be used as a « reasonable solution », Done
Adapt the baseline model to fit with the one used by Zhan in September 2014 for the ITK general meeting (IBL like model), Done
Built and compute an optimized mountain model to improve thermal performances to fit the thermal requirements. In work
Built and compute a model that represents the sample used for thermal measurement performances on the CO2 cooling setup. To be done
Copper(6mm)
Foam (4mm)
Copper (6mm)
Silicon Heater
To convenience the glue implementation, a mask of 0.1mm was used
2mm
Vacuum Chamber
Ttop
Tbot

3. 1 – Main actions Prototyping - measurements
Built the baseline 3D CAD model to be used by LPSC to produce the first 3 prototypes, Almost done (has to be checked)
Collect all the material needed for the prototypes to give to LPSC. Done
Check the status with LPSC, January Tuesday 20th
Measure the thermal performances of the mountain prototypes, To be done
Measure the thermal performances of the material samples, To be done
Material
Collect the reliable information about the material characteristics and uncertainties, Almost done …(Data base ?)
Find better materials to improve the performances : focus on glue and grease

4. 2 – Current simulation results
Baseline model – geometry and materials

5. 2 – Current simulation results
Baseline model – geometry and materials

6. 2 – Current simulation results
Baseline model
Specifications : (based on 0,7 W/cm2 heat load)
Innermost layers DT < 10,5 °C (TFM<15)
Outermost layers DT < 7,7 °C (TFM<11)

7. 2 – Current simulation results
Baseline model
Specifications : (based on 0,7 W/cm2 heat load)
Innermost layers DT < 10,5 °C (TFM<15)
Outermost layers DT < 7,7 °C (TFM<11)

8. 2 – Current simulation results
IBL like model
Specifications : (based on 0,7 W/cm2 heat load)
Innermost layers DT < 10,5 °C (TFM<15)
Outermost layers DT < 7,7 °C (TFM<11)

9. 3 – Conclusions
We’re not so far from the goal
TPG seems promising
Improvements to be done on glues
Material and interfaces qualification is a key challenge
Simulation results have to be crosschecked with measurements on prototypes