1. Taiwan TC Chapter 3D Packaging & Integration (3DP&I) Global Technical Committee
Liaison Report
March 2019 v1

2. Outline Meeting Information Announcement
Leadership / Leadership Changes
Organization Chart
Ballot Results
Abolished SNARFs
Task Force Highlights
Staff Contact
*Optional*
For slides that have no update – do not delete the slide. Place slides after the “Backup” slide or “Hide” the slide, and update list.

3. Meeting Information Last meeting Next meeting
March 26, 2019 at the SEMI Standards Taiwan Spring 2019 Meetings
SEMI Taiwan Office, Zhubei City, Hsinchu County, Taiwan
Next meeting
June 11, 2019 at the SEMI Standards Taiwan Summer 2019 Meetings
Example:
Last meeting
Tuesday, November 7, 2017 at the SEMI Standards NA Fall Meetings
SEMI Headquarters, Milpitas, CA

4. Announcements
None
To be used for high-level announcements (e.g. merging of 3DS-IC and A&P )

5. Leadership Co-chairs Chien-Chung Lin - ITRI
Wendy Chen - King Yuan Electronics Company
Roger Hwang - ASE
*Optional*
Keep text consistent as shown in Org Chart.
Example “Name – Company”
Note: confirm the information here is the same as Org Chart

6. Organization Chart
Taiwan TC Chapter of 3D Packaging & Integration Global Technical Committee
C: Chien-Chung Lin – ITRI
C: Wendy Chen - KYEC
C: Roger Hwang - ASE
Testing
Task Force
L: Ming-Chin Tsai - KYEC
L: Roger Hwang - ASE
L: Shang-Chun Chen - ITRI
Middle End Process
Task Force
L: Arthur Chen - NTUST
L: Mike Chang - ITRI

7. Ballot Results Doc # Document Title TC Chapter Action 5800A
New Standard: Guide for Wafer Edge Trimming for 3DS-IC Process
Passed, ISC A&R SC on 2018/07/06
6405
Reapproval of SEMI 3D7-0913, GUIDE FOR ALIGNMENT MARK FOR 3DS-IC PROCESS
Passed, ISC A&R SC on 2018/10/19
6411
Line Item Revision of SEMI 3D Guide for CMP and Micro- bump Processes for Frontside Through Silicon Via (TSV) Integration
*Delete rows that are empty*
Correct terms to be used in “TC Chapter Action” column (shall match the CER)
Note: Use green font color for “Passed” and red for “Failed”
Passed, as balloted
Passed, with editorial changes
Passed, Ratification Ballot to be issued
Failed
Failed, SNARF abolished
Also include when applicable:
Ratification Ballots – In the “TC Chapter Action” column, state either passed and what cycle or failed: Example: “Passed, A&R Cycle ”
Other activities outside the Letter Ballot process
– In the “Doc #” column, put the SEMI Standard Designation #
– In the “Doc Title” column, put the full SEMI Standard title
>> Underneath, write a short explanation in bold and italicized what type of change
>> Under that in parenthesis, briefly state what was done
– In the “TC Chapter Action” column, state either “Passed, submitted to ISC A&R SC” or “Fail”
Example:
SEMI E (Reapproved 1111), Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment
- Editorial Change made independently outside the Letter Ballot process
(Delete “NOTE 2:…” after Section 3.1)
Note 1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Note 2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.

8. Abolished SNARF(s)
Doc # TF
Title/Details
Testing Task Force
New Standards: Guideline for Chip ID registering and tracing
– The scope of this SNARF is similar with SEMI T “New Standard: Specification for Single Device Traceability for the Supply Chain” which was submitted by Traceability TC/ Single Device Traceability Task Force
*Delete rows that are empty*
Include short description to explain why the SNARF was abolished.
Correct terms to use:
– Reapproval ballot failed Committee review, new SNARF to be issued to reflect change in scope
– Standard to receive Inactive Status; SNARF retired [PM ]
– Activity discontinued

9. Task Force Highlights (1/2)
3DP&I Middle-End Process Task Force
#5800A: New Standard: Guide for Wafer Edge Trimming for 3DS-IC Process
Approved by A&R on 2018/07/06
Publication pending
#6405: Reapproval of SEMI 3D7-0913, GUIDE FOR ALIGNMENT MARK FOR 3DS-IC PROCESS
Approved by A&R on 2018/10/19
#6411: Line Item Revision of SEMI 3D Guide for CMP and Micro- bump Processes for Frontside Through Silicon Via (TSV) Integration
Use this slide for high-level topics and highlights
*When listing SNARF Documents, list just the number (the Doc # implies that it is drafting)
Example:
5267A: New Standard, Specification for Microfluidic Port and Pitch Dimensions
Correct terms to use:
-TC Chapter authorized
-Authorized to ballot in Cycle X-20XX
-Pending A&R
-Approved by A&R
-Forward to A&R for procedural review
-Publication pending
If space allows:
*When listing Standards, remember to include the designation number and pubs date code along with Reapproval date, if applicable, and title
e.g., SEMI S3-1211, Safety Guideline for Process Liquid Heating Systems
SEMI E (Reapproved 0512), Specification for 150 mm/200 mm Pod Handles

10. Task Force Highlights (2/2)
Testing Task Force
Studying the feedback of SNARF “New Standards: Guideline for Chip ID registering and tracing” from global TC members’ two weeks review
The scope of this SNARF is similar with SEMI T “New Standard: Specification for Single Device Traceability for the Supply Chain” which was submitted by Traceability TC/ Single Device Traceability Task Force
Abolished this SNARF “SNARF “New Standards: Guideline for Chip ID registering and tracing”
Use this slide for high-level topics and highlights
*When listing SNARF Documents, list just the number (the Doc # implies that it is drafting)
Example:
5267A: New Standard, Specification for Microfluidic Port and Pitch Dimensions
Correct terms to use:
-TC Chapter authorized
-Authorized to ballot in Cycle X-20XX
-Pending A&R
-Approved by A&R
-Forward to A&R for procedural review
-Publication pending
If space allows:
*When listing Standards, remember to include the designation number and pubs date code along with Reapproval date, if applicable, and title
e.g., SEMI S3-1211, Safety Guideline for Process Liquid Heating Systems
SEMI E (Reapproved 0512), Specification for 150 mm/200 mm Pod Handles

11. Thank you Staff Contact Name Dean Chang / Tiffany Huang E-mail/
Phone
#510