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Fig. 3 The electrical contact of direct-printed and reconfigured liquid metals.
The electrical contact of direct-printed and reconfigured liquid metals. (A) Schematic illustrations of direct printing (left) and reconfiguration (right). (B) Dependence of total resistance on the length of the channel. Error bars represent the SD. (C) Current-voltage characteristics between Ag pads and direct-printed EGaIn. (D) Current-voltage characteristics between Ag pads and reconfigured EGaIn. (E and F) SEM images of EGaIn on an Ag pad after 7 hours of direct printing. (G and H) SEM images of EGaIn after 7 hours of reconfiguration. Scale bars, 200 μm. Young-Geun Park et al. Sci Adv 2019;5:eaaw2844 Copyright © 2019 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).
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