1. Advanced optical quality assurance of the silicon microstrip sensors of the CBM Silicon Tracking System
Evgeny Lavrik, for the CBM Collaboration
University of Tübingen, Germany
Machine vision and machine learning algorithms to:
recognize
classify
assess severity
extract context
of the surface defects
High precision contactless height measurements with motorized focus or Z-stage with FFT
Allows to reconstruct and inspect 3D structure of the object such as sensor warp
Various other metrology measurements such as:
Edge parallelism
Cut quality
Sensor thickness