1. 3D Circuit Integration Technology for Multiproject Fabrication
Program Kickoff
7 April 2000
L-325, MIT Lincoln Laboratory
Introduction
Original Program Review
New Program Effort
Lisa McIlrath 8:30-10:00
Break and Camera Demonstration
Advanced Photodiode Development:
150mm Wafer Transfer Effort:
Purchase of Wafer Aligner/Bonder:
3-D Via Topologies:
Introduction: New Lincoln Effort:
Schedule:
James Burns 10:45-11:00
Keith Warner 11:00-11:15
Craig Keast 10:30-10:45
Craig Keast 11:50-12:00
Peter Wyatt 11:30-11:50
Andy Loomis 11:15-11:30
Lunch and Discussion:
All 12:00-1:00

2. 3D Circuit Integration Technology for Multiproject Fabrication
TREX Enterprises:
System Integration
New Research in 3D Architectures and Systems
Summary of Prior Results:
Lisa McIlrath 8:40-9:00
Lisa McIlrath 9:00-9:30
New Program Overview:
Steve Hawley 9:30-9:50
High Resolution Camera Design:
Algorithms for Activity Detection
with 3D Sensors:
Victor Lum 9:50-10:05
Break and Camera Demonstration