1. Japan Regional Standards Committee (JRSC) Liaison Report to NARSC/ISC
In conjunction with NA Standards Spring 2019
JRSC Co-chairs:
Kenji Yamagata (Daifuku)
Hidetoshi Sakura (Nuflare Technology)
JRSC Vice chair:
Supika Mashiro (Tokyo Electron)
Staff
Junko Collins

2. Contents JRSC General Information JRSC Organization Chart
Membership Update
Standards Related Programs
TC Chapter Highlights
SEMICON Japan 2018
SEMI Japan Staff Contact Information

3. JRSC General Information
Meetings
Past Meeting:
Tuesday, December 11, Japan
Next Meeting:
Friday, April 19, Japan
JRSC Leadership
Chair-Persons
Kenji Yamagata (Daifuku)
Hidetoshi Sakura (NuFlare Technology)
Vice Chair-Person
Supika Mashiro (Tokyo Electron)

4. JRSC Organization Chart
Co-Chair: Kenji Yamagata (Daifuku)
Co-Chair: Hidetoshi Sakura (NuFlare Technology)
Vice Chair: Supika Mashiro (TEL)
Standardization Process Improvement (SPI)
Supika Mashiro (TEL)
I&C
Takayuki Nishimura (SCREEN)
Mitsuhiro Matsuda
(KOKUSAI ELECTRIC)
Silicon Wafer
Naoyuki Kawai (Meiji Univ.)
Tetsuya Nakai (SUMCO)
EHS
Hidetoshi Sakura (NuFlare Technology)
Supika Mashiro (TEL)
Moray Crawford
(Hatsuta Seisakusho）
Automation Technology
Fumiyasu Ohbuchi (SIEMENS) Teruaki Ito (Mitsubishi Electric)
Terry Asakawa (Vistaideal Consulting)
FPD Meteorology
Ryoichi Watanabe
(Japan Display)
Akira Kawaguchi (Otsuka Electronics)
PI&C
Tsuyoshi Nagashima
(Miraial)
Kenji Yamagata (Daifuku)
Noriyoshi Toyoda
(Hirata Corporation)
Compound
Semiconductor
Materials
Masayoshi Obara (SEH)
TBD
Gases
Hiromichi Enami (Consultant)
Isao Suzuki (Consutant)
Masafumi Kitano (Fujikin)
FPD Materials & Components
Tadahiro Furukawa
(Yamagata Univ.)
Yoshihiko Shibahara (FUJIFILM)
PV Materials
Takashi Ishihara
(Mitsubishi Elec.) Tetsuo Fukuda (Nihon Univ.)
Kazuhiko Kashima
(Consultant)
Facilities
Hiromichi Enami (Consultant)
Isao Suzuki (Consutant)
Masafumi Kitano (Fujikin)
Metrics
Mitch Sakamoto (Zama Consulting)
TBD
3D Packaging & Integration
Kazunori Kato (AiT)
Masahiro Tsuriya (iNEMI)
Haruo Shimamoto　(AIST) PV
Kazuhiko Kashima
(Consultant)
Masaaki Yamamichi
(RTS Corporation)
Liquid Chemicals
Hiroshi Tomita (Toshiba Memory)
Hiroyuki Araki (SCREEN)
Traceability
Yoichi Iga (Toshiba)
Hirokazu Tsunobuchi (Keyence)
As of March 26, 2019

5. RSC Membership Update & Approvals
Masafumi Kitano (Fujikin)
New co-chair of Gases Japan TC Chapter / Facilities Japan TC Chapter
JRSC looks for a candidate of JRSC co-chair, since the second term of Kenji Yamagata (Daifuku) will expire at the end of 2019

6. Standards Related Programs Plan
Tutorial SECS/GEM
June 20, 2019 at SEMI Japan
Tutorial GEM300
June 21, 2019 at SEMI Japan
STEP S2
TBD at SEMI Japan

7. TC Chapter Highlights Automation Technology PI&C
SEMI A Specification for Surface Mount Assembly Smart Hookup (SMASH)
Publication: very soon! (Proof is circulated)
PI&C
Fan-Out Panel Level Packaging (FO-PLP) Panel FOUP Task Force
Panel Level Packaging (PLP) Panel FOUP Task Force
FOUP: Doc.6485 (New Standard), Specification for Panel FOUP for Panel Level Packaging
Loadport: Doc.6486 (New Standard), Specification for Panel FOUP Loadport for Panel Level Packaging
300 mm Tape Frame PI&C Task Force
FOUP: TBD
Loadport: TBD

8. SEMICON Japan 2018

9. SEMI Japan Honor Award Hiromichi Enami, Isao Suzuki, MKS Japan, Inc.
Hitachi High-Technologies Corporation.
Isao Suzuki, MKS Japan, Inc.

10. Traceability Workshop
Standards Meetings and Workshops in Conference Tower during SEMICON Japan 2018
Traceability Workshop
Standards meetings
23 meetings
242 participants
Standards Workshops
Information and Control Committee
EDA Workshop - 26
Traceability Committee
Traceability for IoT and Microelectronics Manufacturing Supply Chain - 15
EDA Workshop

11. Introduction of SEMI Standards Activities
TechSPOT at Show Floor
Introduction of SEMI Standards Activities
3D Packaging & Integration Committee
Automation Technology Committee
Information and Control Committee
3D Packaging & Integration
Automation Technology
Information and Control
Information and Control Committee - 15
3D Packaging & Integration Committee - 37
Automation Technology Committee - 24

12. Deploy SEMI Standards Activities
SEMI Standards Booth
Standards Video Clip (with Japanese subtitle)
Actual Products
Display two size of PLP Panel
Panels
Standards Infographics
3D P&I AT
I&C
PI&C
Traceability

13. Synergy, Inter-Industry Collaboration
SEMI FMF Forum
SMT (Surface Mount Technology) Equipment
PLCs (Programmable logic controller)
Service Application
M2M SEMI Standards
SEMI A1 “Specification for Horizontal Communication (HC) Between Equipment for Factory Automation System”
SEMI A “Specification for Media Interface for a Horizontal Communication (HC) Between Equipment”
SMT EQ and PLC implementing SEMI Standards
Standards Introduction
Standards Presentation
Surface mount technology:
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).
Also, we have a seminar on TechSpot and SEMI Standards Booth, and that increased synergistic effect. + +

14. SEMI Japan Staff Contact
Committee
Staff
PV/PV Materials
Gases/Facilities
Liquid Chemical
I&C
Automation Technology
Mizue Iwamura
Coordinator, Standards & EHS
FPD M&C/FPD Meteorology
PI&C
Metrics
Traceability
EHS
3D Packaging & Integration
Chie Yanagisawa Manager, Standards & EHS
JRSC (including SPI TF)
Compound
Silicon Wafer
Junko Collins
Director, Standards & EHS

15. Thank you!