1. EHT SG formation Motion
November 2013
doc.: IEEE /xxxxr0
July 2018
EHT SG formation Motion
Date:
Authors:
Ron Porat Et Al.
Philip Levis, Stanford University

2. November 2013
doc.: IEEE /xxxxr0
July 2018
Background
In WG Interim meeting in 2018 May, a motion was passed to form an EHT TIG to initiate discussion on new features for bands between 1 and GHz;
Since the formation of EHT TIG, there have been lots of discussions and contributions about EHT features, EHT scope, EHT SG formation motion text, and EHT TG formation timelines, etc.
This contribution will focus on following two items:
EHT TG (Task Group) formation timeline
EHT SG (Study Group) formation motion
Ron Porat Et Al.
Philip Levis, Stanford University

3. EHT TG Formation Timeline Considerations
November 2013
doc.: IEEE /xxxxr0
July 2018
EHT TG Formation Timeline Considerations
In order to provide the needed time for feature harmonization and selection for such an important project, the proposed EHT TG formation timeline is described below:
2019 January: Motion PAR and CSD in the WG closing plenary
2019 March: WG final approval of the PAR and CSD
2019 March: EC approval of the PAR
2019 May: First meeting of the task group
EHT TIG
PAR & CSD development as well as feature selection
PAR & CSD approved
EHT TG Begins
July 2018
September 2018
November 2018
January 2019
March 2019
May 2019
Ron Porat Et Al.
Philip Levis, Stanford University

4. Proposed EHT SG Formation Motion Text
November 2013
doc.: IEEE /xxxxr0
July 2018
Proposed EHT SG Formation Motion Text
Move to approve formation of an EHT SG (Extreme High Throughput Study Group) to develop a Project Authorization Request (PAR) and a Criteria for Standards Development (CSD) for a new amendment for operating in the bands between 1 to GHz, with the primary objectives:
To increase peak throughput and improve efficiency
To support high throughput and low latency applications such as video-over- WLAN, AR and VR
with target approval of the EHT Task Group (TG) PAR and CSD approved in March, 2019.
Ron Porat Et Al.
Philip Levis, Stanford University