1. Welcome to DVCon China!
Bin “Rocker” Liu
General Chair
Intel Corp.

2. Conference Sponsor
Accellera Global Sponsors

3. Introducing the Steering Committee
General Chair Bin “Rocker” Liu Intel Corp.
Vice Chair Henry Chew UNISOC Technologies
TPC Chair Roman Wang
AMD Inc.
Poster Chair Lincoln Lee Mentor, A Siemens Business
TPC Vice Chair Jinhuang Huang Tsinghuaic
Short Workshop Chair Simon Chang Cadence Design Systems
Tutorial Chair Peiyu Liu Qualcomm
DVCon US Representative Dennis Brophy Mentor, A Siemens Business
Finance Chair Lynn Garibaldi Accellera
Accellera Representative Lu Dai Qualcomm

4. Conference Management
Meet the on-site staff that is here to assist you throughout the conference!
Robin Albright
Conference Management
MP Associates, Inc.
Kevin Lepine
Conference Management
MP Associates, Inc.
In partnership with:

5. Join DVCon Across the WORLD!

6. Peiyu Liu
Tutorial Chair

7. Tutorials
Thank you to our Sponsors:
Tutorial 1: Next Gen System Design and Verification for Transportation
1630 – 1800 Ballroom A
Tutorial 2: Open Virtual/Hybrid System Platform Speed-up the Idea to SW and HW Design
1630 – Ballroom B
Tutorial 3: Enabling Continuously Fast HW/SW co-Design and co-Verification -- Virtual Prototyping & Hybrid Emulation
1630 – Pudong

8. Simon Chang
Short Workshop Chair

9. Short Workshops
Thank you to our Sponsors:
Short Workshop 1: Portable Coverage: Integrating Formal and Simulation Coverage for Efficient, Faster Verification Signoff
1315 – 1400 Ballroom A
Short Workshop 2: Using Portable Stimulus to Verify an ARMv8 Sub-System Integration on an SoC
1315 – Ballroom B
Short Workshop 3: Verification Strategy in a Connected World of 5G
1315 – Pudong

10. Short Workshops
Thank you to our Sponsors:
Short Workshop 4: Smart FPGA Prototyping for Fast Bring-up on Billion-gate Design
1530 – 1615 Ballroom A
Short Workshop 5: Billion-cycle Power Estimation using Fast Emulation
1530 – Ballroom B
Short Workshop 6: Using Verification Continuum Platform to Speed PCIe System Verification
1530 – Pudong

11. Roman Wang
Technical Program Committee Chair

12. TPC Committee Stuart Lindsay Advanced Micro Devices, Inc. Bin Liu
Intel Corp.
Ruping Ma
Altran Group
Wei Mao
Horizon Robotics
Libo Meng
Analog Devices, Inc.
Wu Shan
ZTE
Pankaj Singh
Cadence Design Systems, Inc.
Brian Sniderman   
Mike Bartley
Test and Verification Solutions
William Chen
Advanced Micro Devices, Inc.
Malathi Chikkanna
Broadcom Corp.
Leo Fang
Synopsys, Inc.
Harry Foster
Mentor, A Siemens Business
Bill Fu
Realtek Semiconductor Corp.
Shujun Hou
Tsinghuaic
Ajeetha Kumari
CVC Pvt., Ltd.
Jia Tian
Gigadevice
Darko Tomusilovic
Vtool Ltd.
Srinivasan Venkataramanan
CVC Pvt, Ltv.
Alex Wan
NXP Semiconductors
Justin Wang
Media Tek, Inc.
Roman Wang
Advanced Micro Devices, Inc.
Gaoxue Xu
Unisoc Communications, Inc.
Deyoung Yang
Fan Yang
Fudan University
Baodong Yu
Beijing Smartchip Microelectronics Tech.
Alex Zhang
Qualcomm, Inc.
David Zhang
Cadence Design Systems, Inc.
Landy Zhang
DJI
Xiuqin Zhang
Xi’an UnilC Semiconductors
Xufeng Zhang
Unisoc Communications Inc.
Junhao Zheng
Spreadtrum

13. Technical Submissions
Abstract Submissions
51 Extended Abstracts Submitted
12 Papers Accepted for Oral Presentations
23% Acceptance Rate
Poster Session
Additional 15 high quality submissions presented as a poster
Fully reviewed!
Papers & Posters in proceedings online
Total of 53% Acceptance Rate for Oral & Poster Presentations

14. Best Paper & Best Poster Awards
YOU BE THE JUDGE!
Attendees select the outstanding papers and posters.
Voting will close at 16:15
Presentation of Award Recipients will be right before the evening keynote in Ballroom B.

15. Special Thanks to our Sponsors
KEYNOTES
TUTORIALS

16. Special Thanks to our Sponsors
SHORT WORKSHOPS
REGISTRATION
MEDIA PARTNERS

17. Welcome Exhibitors

18. Expo Hours Wednesday, April 17: 10:45 to 18:00
Visit DVCon China’s many interesting exhibitors located in the hall to network with colleagues, collaborate with industry leaders, and hold one on one discussions!

19. Enjoy DVCon China 2019!

20. Driving Digitalization With A Boundary Free Innovation Platform
Keynote 1
Driving Digitalization With A Boundary Free Innovation Platform
Dr. Stefan Jockusch
Vice president of Strategy for Siemens PLM Software
Thank you to our Sponsor:

21. The Race for 5G Leadership is ON: Is Our Verification Up to the Task?
Keynote 2
The Race for 5G Leadership is ON: Is Our Verification Up to the Task?
Susheel Tadikonda
Vice President of Verification Continuum Solutions Engineering in the Verification Group at Synopsys
Thank you to our Sponsor:

22. Keynote 3 Michał Siwiński
Optimizing Verification Throughput for Verification in a Connected World of 5G and AI/ML
Michał Siwiński
Vice President of Product Engineering and Management for the System & Verification Group at Cadence Design Systems
Thank you to our Sponsor: