1. FNAL Bonding
Since our last report we have built and bonded an additional 10 TOB 4-chip modules
3 RMT pitch adapters
7 Planar pitch adapters
By adjusting bonding parameters on a case by case basis for the RMT modules we were able to eliminate all of the sensor-to-PA bond repairs.
Last fall we reported a 2% repair rate
Pull test results for the RMT PA’s were still low (6-8 grams) even with the bond parameter tuning, but with the transition to Planar PA’s this is no longer an issue. See the enclosed histogram.
Bonding time for the Planar modules is typically around 10 minutes. An additional 15 minutes is needed for the sensor-to-PA pull tests and rebonding.
We are assuming that pull tests will not be done for the majority of modules during normal production.
With the change in the way ST sensors are tested data is no longer entered into the DB in a standard way, and this is giving us difficulties in determining bad channel information for wire bond skips and may also lead to difficulties with the Bonding interface.
Bonding meeting
February 2004
Lenny Spiegel, FNAL

2. FNAL Bonding
Average pull strengths from the every 50th wire sen-to-PA pull tests. Modules have RMT PAs; modules have Planar PA’s.
Bonding meeting
February 2004
Lenny Spiegel, FNAL