1. FPGAs For High-Reliability Applications
PRODUCTS
FPGAs For High-Reliability Applications
Defense
Avionics
Space

2. Hi-Rel Market Environment
Total Defense budget decline continues
Defense electronics spending to increase
Fewer new programs being developed
- older systems being rejuvenated with technology updates
Fewer suppliers left to serve the market
Hi-Rel FPGA market is growing, traditional Military business still strong
HI-Rel FPGAs expanding into new applications
- commercial aerospace, automotive

3. Aerospace and Defense Market Dynamics
Large,Growing Electronics Equipment Market
- $ 61B in “Technology Insertion”
Specialized IC and Supply Requirements
- Extended Temperature, Hermeticity
- Supply Longevity
Aerospace
Shift to “Best Commercial Practice”
- Leading Technology, Off-the-shelf “Performance-based”

4. Military/Civil Aerospace Market
WW Electronic Equipment Production

5. Hi-Rel Leadership Xilinx is the Hi-Rel PLD leader
- first to offer military FPGAs (shipping MIL-STD-883
product since 1988)
- active Standard Microcircuit Drawing (SMD) program (XC2000/3000/4000/4000E/4000XL/PROMs)
- first to offer advanced surface mount packages (ceramic quad flat pack with tie bar)
- highest density FPGA
- received QML Certification Nov. 20, 1997
Hundreds of Hi-Rel/Military/Aerospace applications using Xilinx
- electronic warfare, missile guidance and targeting
- radar and sonar
- communications, signal processing and
intelligence
- aerospace, avionics and space

7. The FPGA Advantage
Xilinx FPGAs have become the technology of choice for Hi-Rel applications
No longer the need to use ASICs
- density
- time to market
- design flexibility
- reprogrammability/upgradability
- system feature integration
- no NRE
- standard, off the shelf
- full product line support
- committed supplier

8. Xilinx High Reliability Products QML /Best Commercial Practice
Performance-based
- Electrical and Environmental requirements
- Plastic and Hermetic Devices Pricing
Reliability of Supply
- Process/Mask Control Xilinx Commitment
Off - the - Shelf ASIC solution
QML /Best Commercial Practice
- Leading-edge FPGA Products
- MIL-PRF Compliant

9. Mil/Aero Product/Process Roadmap
25K Gates K Gates M Gates
XC4000E
0.60
XC4005E
XC4010E
XC4013E
XC4025E
XQ4000EX
0.50
XQ4028EX
XQV 100
XQV 300
XQV 600
XQV 1000
XQ4000XL
0.35
XQ4013XL
XQ4036XL
XQ4062XL
XQ4085XL
Virtex
XQV
0.25
Virtex II
Virtex
0.18
1997
1998
1999
2000 1

11. Leadership in Mil/Aero Plastic
Cost-effective alternative where hermiticity is
not required
Processed to QML Flow
- Test at 125°C (Tj)
- Ruggedized to met HAST Testing
- SMDs available
Product “Pedigree”
- Designated mask set(s)
- Stringent change control
- Extensive characterization Mil temperature
range
Mil/Aero Market support infrastructure

12. Plastic Package Qualification
Unbiased Pressure Pot
- 96 hours, 121°C, 2 atmospheres
Temperature Cycling (liquid to liquid)
- 500 Cycles per method 1011, Cond C of Mil-STD-883
Temperature Cycling (air to air) cycles per method 1010, Cond C of MIL-STD-883

13. Plastic Package Qualification
Resistance to Solvents
- Method 2015 of MIL-STD-883
Solderability
- Method 2004 of MIL-STD-883
Lead Fatigue Method 2004 of MIL-STD-883

14. Plastic Reliability Monitor
High Temperature Operating Life(HTOL)
Extended Static Life Test
Temperature Humidity (85/85)
Moisture Test
Thermal Shock
Temperature Cycling
Highly Accelerated Stress Test (HAST)
Solderability
Mark Permanency/Lead Fatigue/Physical Dimension

15. SPROM PRODUCTS

16. PACKAGE OFFERINGS
* Do not use for new designs.

17. PRODUCT OFFERING
* Do not use for new designs.

18. Summary Strong commitment to market Broadest line of Hi-Rel products
Integral part of Corporate product strategy
Continued new product development
Superior product life cycle management