1. Ultra Low Power platform for portable applications
i.MX 7ULP
Ultra Low Power platform for portable applications

2. ULP Family: Market Opportunity in Power Efficiency
i.MX 8 series M4
6QuadPlus
Advanced Graphics and Performance
6Quad
i.MX 8M series M4
6DualPlus
Advanced Audio and Video
6Dual M4
6DualLite
i.MX 8X series
ARM® v8-A
(32-Bit / 64-Bit)
BOM and Energy Efficiency
6Solo
6SoloX M4
ARM® v7-A
(32-Bit)
6SoloLite
i.MX 7 M4
Flexible Efficient Connectivity
6SLL
6UltraLite
i.MX 7ULP M4
6ULL
Ultra Low Power with Graphics
I.MX 7ULP, a solution providing power efficiency for both portable and connected worlds.
ARM® v7-A

3. Ultra-low Power Dynamic & Static Applications Processors
Scalability of Embedded Processing the new normal
Ultra-low Power Dynamic & Static
ARM v8/v8m + GPU/DSP
ARM v7/v7m + 2D/3D
ARM v7m + Audio
Applications Processors
i.MX 7ULP
i.MX 6UL/ULL/ULZ
i.MX RT
MCU
The i.MX 7ULP family of processors represents NXP’s latest achievement in ultra-low-power processing for use cases demanding long battery life.
Targeted towards the growing market of portable devices, the i.MX 7ULP family is built upon the heterogeneous asymmetric architecture utilizing both the ARM® Cortex®-A7 and Cortex-M4 cores, with separate isolated domains. The heterogeneous architecture provides the ultimate flexibility for customers by enabling a single-chip solution that can run sophisticated operating systems and provide real-time responsiveness.

4. HETEROGENEOUS PROCESSING: PROVIDING SOLUTIONS TO MARKET CHALLENGES
OFFLOAD
TASKS
OPTIMIZE
POWER
INCREASE
SECURITY
RICH
GRAPHICS
Right core for the task
Power gate maximum amount of silicon
Allocate H/W access to silicon
3D/2D based rich UIs
The i.MX 7ULP family of processors features a 3D and 2D Graphics Processing Units (GPUs), provides up to 32-bit LPDDR2/LPDDR3 memory interface and a number of other interfaces for connecting peripherals, such as WLAN, Bluetooth, GPS, displays, and camera sensors. The i.MX 7ULP processor is supported by NXP®’s companion power management ICs (PMICs).

5. Efficient 3D & 2D Graphics Heterogeneous Domain Computing
i.MX 7ULP Key Highlights
i.MX 7ULP
Bringing together Apps Processor performance and MCU Low Power
Ultra Low Power
Efficient 3D & 2D Graphics
Heterogeneous Domain Computing
GC7000 nanoULTRA
OpenGL ES 2.0/1.1
OpenVG 1.1
GC320 2D Composition
Offloads tasks from 3D GPU
Stretch/Shrinking, rotation, GUI processing
Multiple software execution:
Powerful processing using Cortex-A7 and Neon co-processor
Real-time performance through Cortex-M4
System integrity and security
Resource Domain Controller
Fast Low Power Boot
Safe Recovery of Application domain
FDSOI
Effective control of the transistor channel through biasing
High Performance/mW extending battery life for portable devices.
Performance on Demand with fast wake up times
The i.MX 7ULP was designed and built with ultra low-power in mind. It is the first qualified processor using FD-SOI technology, so even at the transistor level – power is being managed. By providing low stand-by power and optimizing the run power, the i.MX 7ULP is able to help extend battery life for portable devices.
The i.MX 7ULP family of processors features a 3D and 2D Graphics Processing Units (GPUs). The combination of the 2D and 3D engines provides the most efficient combination of graphics supporting…. 32-bit LPDDR2/LPDDR3 memory interface and a number of The i.MX 7ULP processor is supported by NXP®’s companion power management ICs (PMICs).

6. Target Applications Wearables Home Control Portable Healthcare
Portable Printing
Gaming Accessories
General Embedded Control
IoT Edge
The i.MX 7ULP supports various applications. End applications ranging from wearables to home Control to the IoT Edge. The common factor in the i.MX 7ULP target applications is the requirement for ultra low power consumption. Products then also benefit from the high performance and the rich HMI experience that the i.MX 7ULP can deliver.
The i.MX 7ULP expands the crossover space and truly enables the spectrum from traditional MCU applications to applications historically supported by higher-end MPUs.

7. Cortex-A7 enables power efficiency
This slide shows the logic behind choosing the A7 core for the i.MX 7ULP. Customers may lose a little performance compared to an A9, but the power efficiency improvement is significant.
Source: Arm.com

8. i.MX 7ULP Applications Processor
Specifications:
CPU:
720MHz
200Mhz
Process: 28nm FD-SOI
Package:
14x BGA, 0.5mm pitch: Consumer & Industrial
10x BGA, 0.5mm pitch: Consumer Only
Temp Range (junction):
Industrial: -40C to +105C
Consumer: 0C to +95C
Key Features:
Graphics
GC7000 nanoULTRA GPU: OpenGL 2.0 / OpenVG
GC320 Composition Engine
Ultra Low Power
Independent Real-time domain
Ultra Low Run Current
Memory options
QSPI (on the fly decryption)
32-bit
eMMC 5.0 /SD3.0
Connectivity
USB HS OTG with PHY
USB HS HOST HSIC
I2C X 8, SPI X 4, UART X 8, SDIO X 2, I2S X 2
Security
High Assurance Boot
Crypto Acceleration: AES-128/256, SHA-1, SHA-224, SHA-256
RNG and Tamper Detection
CPU
Cortex-A7 & Cortex-M4
Graphics
GC7000 nanoULTRA GPU: OpenGL 2.0 / OpenVG
GC320 Composition Engine
Ultra-Low Power
Independent Real-time domain
Ultra-Low Run Current
Memory options
QSPI (on the fly decryption)
32-bit
eMMC 5.0 /SD3.0
Connectivity
USB HS OTG with PHY， USB HS HOST HSIC
I2C X 8, SPI X 4, UART X 8, SDIO X 2, I2S X 2
Security
High Assurance Boot
Crypto Acceleration: AES-128/256, SHA-1, SHA-224, SHA-256
RNG and Tamper Detection

9. 28nm FD SOI Power – Performance Benefits
Improved electrostatics enables shorter gate lengths
Reduced device parasitics
Device back bias allows for lower Vdd while maintaining performance
Device tuning with back biasing to compensate process variation
Analog Integration and Performance Benefits
Higher gain, better matching and lower 1/f noise
Gate first integration removes density rules for precision analog
Better SER and Latchup Immunity
10-100x better SER performance versus 28nm bulk alternatives
Thin buried oxide layer makes device immune to latchup
Body Biasing: Faster when required and more energy efficient when performance isn’t as critical
The leakage is lower using 28 nm FD-SOI due to the addition of the ultra-thin, buried oxide layer. Frequency can be increased through forward-body biasing, while leakage can be further reduced through reverse-body biasing.

10. NXP Complete Solutions
i.MX7 ULP Family Processors
PF1550
PMIC
Sensors
ULP EVK
Development Platform + + =
720 MHz Cortex™-A7
NEON™ coprocessor
ARM® Cortex™-M4,
Targeting a broad range of Low Power Applications that rely on a multitude of Low power states to extend battery life to its fullest.
Integration of NXP’s PMIC chip set with i.MX processor for optimization of power efficiency and software/hardware integration
One-stop customer service and support during development phase to enable the design process
MEMS gyroscopes for reliable sensing and measuring
Magnetometers: measuring the magnitude and direction of magnetic fields
Pressure Sensing Devices, composed of single silicon, piezoresistive devices
Development platform:
SOM based evaluation kit
Linux® and Android™ Board Support Packages are available through NXP
A Single Solution for Streamlined Performance
The i.MX 7ULP is supported by a companion PMIC from NXP, as well as a variety of sensors. These attach products are supported in both hardware and software via the EVK and the board support packages that support the EVK.

11. i.MX 7ULP SOM Based Platform
Enables fast use case evaluation through quick builds of of customized base boards.
Allows customers to leverage the critical features of SOM design including DDR and PMIC design/layout.
Design Files provided
Schematics
Layout
BOM
The NXP i.MX 7ULP Evaluation Kit (EVK) provides a platform for rapid evaluation of the i.MX 7ULP.
The EVK enables HDMI output for simple out-of-the-box bring up but allows reconfiguration for MIPI displays. The EVK is designed as a System-On-Module (SOM) board that connects to an associated baseboard. The SOM provides 1 GB LPDDR3, 8 MB Quad SPI flash, Micro SD 3.0 card socket, WiFi/ Bluetooth capability, USB 2.0 OTG with Type C connector and an NXP PF1550 power management IC (PMIC). The baseboard provides additional capabilities including a full SD/MMC 3.0 card socket, audio codec, multiple sensors, an HDMI connector, and an alternate MIPI display connector. Additionally, the EVK facilitates software development with the ultimate goal of faster time to market through the support of both Linux® OS and AndroidTM rich operating systems, as well as FreeRTOS.

12. Planned Part Numbers: i.MX 7ULP Family
All parts are orderable now and shipment is expected to start in Jun 2019 (Consumer) /Q (Industrial)
Part number
Qual tier
Package
Main CPU
On-chip SRAM
Real-time companion CPU
Real-time companion CPU: Tightly-coupled memory
2D & 3D GPU
I2S
SPI
UART
I2C
USB
Temperature range
MCIMX7U5DVP07SC
Consumer
MAPBGA 393
ARM Cortex-A7 720 MHz
256 KB
ARM Cortex-M4 200 MHz Y 4 8
USB 2.0 OTG +PHY, USB 2.0 Host +HSIC
0-95°C
MCIMX7U5DVK07SC
VFBGA 361
MCIMX7U3DVK07SC -
MCIMX7U5CVP06SC
Industrial
ARM Cortex-A7 650 MHz °C
MCIMX7U3CVP06SC
Here is the complete list of part numbers.