1. GIG-Array® High Speed, High Density Mezzanine Connectors
Grace S. Showers – Product Manager
June 1, 2007
Notes

2. GIG-Array® Connector Features & Benefits
Optimized Design For High-Density, High-Speed Mezzanine Applications
Ball Grid Array (BGA) Termination For Process Friendly Attachment
1mm X 0.65mm BGA Grid Optimizes Routing And Electrical Performance
200 and 296 Positions
Stack Heights Of 15mm To 40mm

3. GIG-Array® Features & Benefits
100 Ohm Differential Pair Matched Impedance Assures Consistent High Speed Performance
10 Gb/s Differential Pair Performance Supports High Speed Data Rates
Near End Crosstalk (NEXT) Of Less Than 3% Preserves Signal Integrity
Dual-Beam Receptacle Provides Two Points Of Contact On The Signal Contacts Increasing Product Reliability
Polarized Design Assures Proper Mating Of The Connector

4. Plug Pin Configuration The 200 Position Connector Contains 25 Columns
GIG-Array® Plug
Plug Pin Configuration
Columns
Columns
G = Ground
S = Signal
The 296 Position Connector Contains 37 Columns With 8 Usable Signals In A Row
The 200 Position Connector Contains 25 Columns

5. The 296 Position GIG-ArrayTM Contains 37 Individual Wafers
Integrate Power With The GIG-Array®
Designers Can Choose To Run 18 Amps (Derated) Through Just One Wafer Using The Other 36 Wafers For High Speed Requirements
Discrete contacts offer more flexibility in handling Power or Low-Speed signals
The 296 Position GIG-ArrayTM Contains 37 Individual Wafers
Each Wafer Contains 9 Individual Ground Pins & 8 Individual Signal Pins

6. GIG-Array® Receptacle
Plug
Signal
Ground
Receptacle
Receptacle
Narrower Receptacle Slot Openings and Center Walls to Reduce Risk of Contact Damage from Foreign Objects
2-Points Of Contact On The Signals Increase Reliability Of The End Application

7. GIG-Array® Offering
200 & 296 Positions

8. Mezzanine Applications
Notes

9. Servers & Storage (1U & 3U Rack Server)
PCI Express Card Edge Riser
LGA 775 Sockets
EyeMax® or Densi-Shield I/O™ Link
4X SATA/SAS Plugs & Receptacles
HDD
PCIe CARD
FAN RACK
CPU
MEMORY
HDD
CPU
DDR1, DDR2 or FBD Sockets
HDD
POWER SUPPLY
HDD
POWER SUPPLY
MEG-Array®, GIG-Array®, or BergStak® Board Stacking Systems
PwrBlade® Power Distribution System or Power Card Edge
Vertical SATA or SAS Receptacles

10. Servers & Storage (Blade Server)
Blade Server Board
GIG-Array®
 Server Blade
Blade Center Chassis

11. Switching & Transmission
Switches
Routers

12. BGA Technology

13. Advantages of BGA Technology
Lower application cost then Press Fit terminations
Applied to PCB by standard re-flow soldering processes
Excellent SI performance
Simplified board routing
Eliminates press-fit constraints on via
Can mount on PCB opposite other surface-mount components
BGA
BGA
SMT
PTH
Press Fit

14. FCI’s Ball Grid Array Design (BGA)
FCI’s Patented Design
Alternative Designs
Perfect “Ball True Position” in the X, Y, and Z direction
Solid Pin-to-Ball connection
No ‘guidance’ for ball position in X and Y direction
Doubtful Pin-to-Ball connection

15. Self-Centering in X and Y Directions
Surface Tension Promotes Self-Centering Of The
Connector During Re-flow With A Placement Of
Only 50% Of The Solder Sphere On The Pad
Compensates For Placement Error
0.030” Diameter Solder Sphere
A B C D E F G.

16. Self-Leveling in Z Direction
Solder Spheres Collapse Upon Reflow For Vertical Self-Leveling
Compensates For Warpage Or Mis-match
Cross section prior to soldering
Cross section after soldering

17. FCI’s BGA Reliability
GIG-Array® Connectors Utilize The Exact Same BGA Sphere, Design, And Process As MEG-Array Connectors
FCI 100% Verifies BGA Coplanarity Of Every GIG-Array Connector
Solder Joint Reliability – FCI’s BGA Solder Joint Reliability On The GIG-Array Product In Accordance With IPC-SM-785
GIG-Array Connectors Passed 6000 Thermal Cycles 0 C to +100 C per IPC-SM-785

18. System Advantages In-Process Inspection & Quality Controls
Vision Systems
Verification Of Terminal And BGA Presence
RVSI
100% Laser Inspection – Coplanarity
Acuity
Verification Of Terminal Placement

19. Signal Integrity Testing

20. Test PCB “Stack-Up” PCB Boards Vias (Rogers 4003)
Semi-Rigid Pad Attach Pad
Vias
Connector
System
Strip-line PCB Trace
.062” Typical
Semi-Rigid Pad Attach Pad
PCB Boards
(Rogers 4003)

21. Measurement PCB Configuration
Columns
G = Ground
Q = Quiet
S = Signal

22. GIG-Array® High-Speed Performance
Notes:
* Denotes fully-shielded differential pairs. 79 differential pairs per linear inch can be attained if the differential pairs are continuous
** The acceptance criteria for Eye Patterns are a mask height of 25% and a mask width of 40%.
***Denotes Bandwidth. Frequency at which Insertion Loss reaches 3 dB.
Rise time ( Tr ) is specified from 10% to 90% of the signal amplitude.

23. GIG-Array® 10Gb/s Eye Patterns
25 mm GIG-Array Differential Eye Pattern
10 Gb/s Reference Eye Pattern
20 mm GIG-Array Differential Eye Pattern
Mask Amplitude Was 25% (200 mVp-p) Of The Input Signal And The Mask Width Was Set To 40% (40 ps) Of The Input Signal.

24. Summary Proven Patented BGA Design
Provides 10Gb/s Electrical Performance
Proven Patented BGA Design
FCI Is Recognized As The BGA Expert… Shipping over 10 Billion BGA Contacts
Connectors Provide 2-Points Of Contact for Reliability
Demonstrated > 22 Years Life (IPC-SM-785) Solder Joint Reliability
FCI Worked With Solectron & Universal In Developing The GIG-Array Application Specification Assuring Stable Process Capability During Product Application
Certified Second Source (Tyco)
Intermateable and Interchangeable

25. All Of The Above Information Is Located At: www.fciconnect.com
Product Support
Datasheet
Application Specification GS
Product Specification GS
High-Speed Performance Data
Sample Kit
SPICE Files – Web Site
Drawings – Web Site
3D Models (ProE & IGES) – Web Site
All Of The Above Information Is Located At:

26. Thank You
Notes