1. Components: packaging & assembly technologies for planar interconnects Jianfeng Li, Alberto Castellazzi, Mark Johnson PEMC Group, University of Nottingham Tel: +44 (0)115 846 6890 Email: Jianfeng.Li@nottingham.ac.ukJianfeng.Li@nottingham.ac.uk Industrial partners: MTC, Dynex

2. Work area: new substrate/flex combination and integrated assembly processes  Semi-flexible or CTE-matched laminates that can be used to deliver reliable and cost- effective planar interconnect solution ●Wire bonds and bus bars have high parasitic inductances  Electrically insulating substrates that have high thermal conductivity coupled with low CTE ●Al 2 O 3, AlN and Si 3 N 4 -based substrates have either low thermal conductivity and/or low mechanical strength Schematic of a conventional power module Multiple wire bonds to achieve interconnects  Combined PCB/power module manufacturing processes ●Wire bonding is a time consuming manufacturing process

3. Project Plans & Objectives  March 2014 to January 2015: first evaluation of flex interconnect technologies ●Design optimisation of the semi-flexible or CTE- matched laminates ●Exploration of corresponding substrate materials and technologies ●Demonstration of the manufacturing processes for both the flexible PCB and the planar power modules ●Preliminary evaluation of reliability for the interconnect technologies Cross section of a conventional flexible PCB Flexible PCB in a planar power module (not including all components)

4. Potential Outcomes & Exploitation Plans  Report on the relevant technologies  Support to construct component demonstrators  Publications  Extension of industrial collaboration

5. Input from the PE Community  A Buddy scheme would promote the Cross Theme activities and collaboration  KTN dissemination events would help to introduce the research results to wider PE community