1. Electrical and thermal testing at Glasgow and Liverpool

2. Assume Hybrids tested –thermal cycled –burnt in –electrically tested; operation points provided in the database Detectors fully tested –question: will IV on glued detectors be performed at manchester?

3. Reception tests (1h) Unpack and add paper check sheet (10mins) Visual inspection (30mins) (done by bonder) –check for scratches on detector and quick check of bond wires on hybrid –mount on bonding jig Hybrid check (20mins) - DSP or similar –supply currents + simple electrical tests (Clk/2, L1T) –performed at room temperature or above –(adds extra handling step but required as difficult to spot broken bonds)

4. Bond module (1 day) Bond both sides of module and detector HV Visual inspection of bonds (at time of bonding) Fix in test mount Detector current measurement at 150V and 300V (K237), measured at  20C and 50% relative humidity Basic room temperature operation - DSP (½h) –check that no bonds or hybrid/chips have been damaged during bonding

5. Thermal Cycle (time uncertain) only stage using climate chamber Power hybrid (do we need to clock it, etc? If so need r/o?) +20C to -20C in climate chamber, N 2 flush. Cycle ten times. –How long is each cycle? Time at plateau temperature? Monitor detector and hybrid currents - use bench supplies

6. Thermal (1h) + electrical checks performed in N 2 flushed freezer + Mustard r/o Bias + clock module in cold environment Thermal measurements with IR sensors at predefined positions on the module (Where? Who is to define these?) IR r/o, PT100 temperature monitoring of cooling point/enclosure + humidity monitoring performed via Keithley 2700 DMM Peltier diode to give extra thermal control

7. Thermal + electrical (4h) checks performed in N 2 flushed freezer + Mustard r/o First full electrical tests of module, performed at operating temperature, using optical (or electrical substitute) readout Define time delays and bias settings for each chip Measure trims, gain, offset, noise for each channel Define bad channels, unbonded from noise Check bypassing

8. Burn in tests (100h) requires temperature controlled climate + r/o Is it to accelerate ageing - if so done at high temperature (e.g not cooled or maintained temp)? Clock + monitor currents and module temperature I-t measurements (if performed at operating temp) Repeat electrical measurements at operating temp after burn in (30mins)

9. Laser run (½day) DSP and room temperature Check bonding and detector functionality Don’t see motivation for this –Automated bonding and visual checks to guarantee bonding –Noise response indicates missed bonds –Detectors must work as detectors

10. Tests and duration Reception tests (1h person, 20mins DSP) Bond module (1 day person, ½h DSP) Thermal Cycle (30mins person, ? DSP ?, uncertain time for cycle) Thermal checks (1h Mustard r/o) Electrical checks (4h Mustard r/o) Burn in tests (1h person, 100h operation, ½h Mustard) Laser run (½day DSP)