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ECE555 Lecture 3 Nam Sung Kim University of Wisconsin – Madison
Dept. of Electrical & Computer Engineering
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Implementation Strategy for digital ICs
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Impact of Implementation Choices
Domain-specific processor (e.g. DSP) 10-100 Embedded microprocessor Energy Efficiency (in MOPS/mW) 1-10 Hardwired custom Configurable/Parameterizable 0.1-1 Somewhat flexible Fully flexible Flexibility (or application scope) None
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Implementation Choices
Custom Standard Cells Compiled Cells Ma cro Cells Cell-based Pre-diffused (Gate Arrays) Pre-wired (FPGA's) Array-based Semicustom Digital Circuit Implementation Approaches
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The Custom Approach Intel 4004 Courtesy Intel
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Transition to Automation and Regular Structures
Intel 4004 (‘71) Intel 8080 Intel 8085 Intel 8286 Intel 8486 Courtesy Intel
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Cell-based Design (or standard cells)
Routing channel requirements are reduced by presence of more interconnect layers
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Standard Cell — Example
[Brodersen92]
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Standard Cell – The New Generation
Cell-structure hidden under interconnect layers
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Standard Cell - Example
3-input NAND cell (from ST Microelectronics): C = Load capacitance T = input rise/fall time
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Automatic Cell Generations
Initial transistor geometries Placed transistors Routed cell Compacted cell Finished cell
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A Historical Perspective: the PLA
x 1 2 AND plane Product terms OR f
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Inverting format (NOR-NOR) more effective
Two-Level Logic Every logic function can be expressed in sum-of-products format (AND-OR) minterm Inverting format (NOR-NOR) more effective
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PLA Schematics (Logic-level)
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PLA Schematic (Transistor-level)
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PLA Layout – Exploiting Regularity
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Breathing Some New Life in PLAs
River PLAs A cascade of multiple-output PLAs. Adjacent PLAs are connected via river routing. No placement and routing needed and output buffers and the input buffers of the next stage are shared. Courtesy B. Brayton
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Generated by hard-macro module generator
Macro Modules 25632 (or 8192 bit) SRAM Generated by hard-macro module generator
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“Soft” MacroModules
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“Intellectual Property”
A Protocol Processor for Wireless
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Semicustom Design Flow
HDL Logic Synthesis Floorplanning Placement Routing Tape-out Circuit Extraction Pre-Layout Simulation Post-Layout Simulation Structural Physical Behavioral Design Capture Design Iteration
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The “Design Closure” Problem
Iterative Removal of Timing Violations (white lines)
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Integrating Synthesis w/ Physical Design
RTL (Timing) Constraints Physical Synthesis Macromodules Fixed netlists Netlist with Place-and-Route Info Place-and-Route Optimization Artwork
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Late-Binding Implementation
Pre-diffused (Gate Arrays) Pre-wired (FPGA's) Array-based
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Gate Array — Sea-of-gates
Uncommited Cell Committed Cell (4-input NOR)
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Sea-of-gate Primitive Cells
Using oxide-isolation Using gate-isolation
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Sea-of-gates Random Logic Memory Subsystem LSI Logic LEA300K
(0.6 mm CMOS) Courtesy LSI Logic
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The return of gate arrays?
Via programmable gate array (VPGA) Via-programmable cross-point metal-5 metal-6 programmable via Exploits regularity of interconnect [Pileggi02]
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Prewired Arrays Classification of prewired arrays (or field- programmable devices): Based on Programming Technique Fuse-based (program-once) Non-volatile EPROM based RAM based Programmable Logic Style Array-Based Look-up Table Programmable Interconnect Style Channel-routing Mesh networks
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Open by default, closed by applying current pulse
Fuse-Based FPGA antifuse polysilicon ONO dielectric n + antifuse diffusion 2 l Open by default, closed by applying current pulse
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Array-Based Programmable Logic
5 4 O 3 2 1 Programmable OR array O I 3 2 1 Fixed AND array Programmable OR array I 5 4 O 3 2 1 Fixed OR array Programmable AND array Programmable AND array O O O 3 2 1 O 3 O 2 O 1 PLA PROM PAL Indicates programmable connection Indicates fixed connection
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Programming a PROM f 1 X 2 NA : programmed node
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i inputs, j minterms/macrocell, k macrocells
More Complex PAL i inputs, j minterms/macrocell, k macrocells From Smith97
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Programmable Logic Block
2-input mux Configuration A B S F= X 1 Y XY A F B 1 S
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Logic Cell of Actel Fuse-Based FPGA
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Look-up Table Based Logic Cell
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Array-Based Programmable Wiring
Interconnect Point Programmed interconnection Input/output pin Cell Horizontal tracks Vertical tracks
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Mesh-based Interconnect Network
Switch Box Connect Box Interconnect Point
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Transistor Implementation of Mesh
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RAM-based FPGA Xilinx XC4000ex Courtesy Xilinx
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Design at a Crossroad: System-on-a-Chip
Embedded applications where cost, performance, and energy are the real issues! DSP and control intensive Mixed-mode Combines programmable and application-specific modules Software plays crucial role RAM 500 k Gates FPGA + 1 Gbit DRAM Preprocessing Spectral Multi- Imager system +2 Gbit DRAM Recog- nition mC Analog 64 SIMD Processor Image Conditioning Array + SRAM 100 GOPS
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Backup
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Logic Transistor per Chip
Productivity Logic Transistor per Chip (M) 10,000,000 10,000 1,000 100 10 1 0.1 0.01 0.001 100,000,000 0.01 0.1 1 10 100 1,000 10,000 100,000 Logic Tr./Chip 1,000,000 10,000,000 Tr./Staff Month. 100,000 1,000,000 Complexity 58%/Yr. compounded 10,000 (K) Trans./Staff - Mo. Productivity 100,000 Complexity growth rate 1,000 10,000 x x 100 1,000 x x 21%/Yr. compound x x x Productivity growth rate x 10 100 1 10 2003 1981 1983 1985 1987 1989 1991 1993 1995 1997 1999 2001 2005 2007 2009 Source: Sematech Complexity outpaces design productivity
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A Simple Processor MEMORY INPUT/OUTPUT CONTROL DATAPATH
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A System-on-a-Chip: Example
Courtesy: Philips
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Design Methodology Design process traverses iteratively between three abstractions: behavior, structure, and geometry More and more automation for each of these steps
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PLA Layout – Exploiting Regularity
V DD GND f And-Plane Or-Plane
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