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Asaf SOMEKH, Oct 15 th, 2013 Evolving Peering with a New Router Architecture Jean-David LEHMANN-CHARLEY Compass-EOS RIPE 67, Athens

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Presentation on theme: "Asaf SOMEKH, Oct 15 th, 2013 Evolving Peering with a New Router Architecture Jean-David LEHMANN-CHARLEY Compass-EOS RIPE 67, Athens"— Presentation transcript:

1 Asaf SOMEKH, Oct 15 th, 2013 Evolving Peering with a New Router Architecture Jean-David LEHMANN-CHARLEY Compass-EOS RIPE 67, Athens jd.lehmann@Compass-EOS.com

2 Asaf SOMEKH, Oct 15 th, 2013 Peering Requirements / Challenges Availability – Critical service on limited number of nodes – HA hardware features Scalability – Bandwidth (100G interconnects) – Port density (Nx10G, 100G) – BGP scaling – FIB convergence Dual stack IPv4/IPv6 – MP-BGP to support both AFs – RIB/FIB scaling

3 Asaf SOMEKH, Oct 15 th, 2013 Peering Requirements / Challenges Stable/evolved BGP implementation – Flexible routing policy framework – 4-byte ASN support, capability negotiation route reflectors, confederations Security – Infrastructure filtering – Accounting (Netflow v9, IPFIX) – Control plane protection Colocation Cost control – Space – Power Consumption

4 Asaf SOMEKH, Oct 15 th, 2013 Lessons from the Data Center Market Virtualized Data Center Clustering & Virtualization Brought Efficiency to the Data Center Monolithic Mainframes 4

5 Asaf SOMEKH, Oct 15 th, 2013 Evolution of Industries 5 Data Centers Networks Can Networks Follow The Data Center Evolution?

6 Asaf SOMEKH, Oct 15 th, 2013 So why do we have “Mainframe-like” routers? 6 It’s Electronics and Copper Limitations

7 Asaf SOMEKH, Oct 15 th, 2013 Zooming in on the challenge Chip I/O at speeds of 100G is limited to a few centimeters – Requiring Amplification every 2/3 cm – Requiring MORE electronics – Requiring MORE cooling – Requiring MORE space 7

8 Asaf SOMEKH, Oct 15 th, 2013 Compass-EOS icPhotonics™ World First Chip-to-Chip Optical Interconnect 8

9 Asaf SOMEKH, Oct 15 th, 2013 icPhotonics™ World’s First Chip-to-Chip Optical Interconnect 1.34Tb/s Full Duplex Bandwidth Order of magnitude higher Chip I/O Density. 64Gb/a per mm2 Passive optical links that stretch to Hundreds of Meters vs. Centimeters with Electronics 9 Direct Coupling to CMOS Chip Low energy consumption: 10pJ/bit Dozens of Patents Covering Technology & Processes Flexible form factor Deployed in Production Laser Matrix Photo Detectors Standard I/O Digital CMOS chip Direct optical interface

10 Asaf SOMEKH, Oct 15 th, 2013 Scale-Out Enlarge VCSEL Matrix 12 x 14 Scaling icPhotonics™ to Even Higher Capacities 10 Scale-Up Increase VCSEL Speed 8 Gb/s Per Channel Today: 1.34b/s SHIPPING Over 10Tb/s !

11 Asaf SOMEKH, Oct 15 th, 2013 icPhotonics™ – Inter-Chip Photonics Revolutionizing Backplane Connectivity The Traditional Way: Multi-Layer Midplane and Switching Fabric The Compass-EOS Way: icPhotonics™ Passive Optical Mesh 11 Complex High Costs High Power Larger Systems Limited BW/Slot Complex High Costs High Power Larger Systems Limited BW/Slot Simple Lower Costs Lower Power Smaller Footprint Unlimited BW/Slot Simple Lower Costs Lower Power Smaller Footprint Unlimited BW/Slot

12 Asaf SOMEKH, Oct 15 th, 2013 Enabling a simplified routing building-block 12

13 Asaf SOMEKH, Oct 15 th, 2013 Enabling the Vision of Network Virtualization Simplifying the Network with Routing Building Blocks & SDN 13

14 Asaf SOMEKH, Oct 15 th, 2013 How icPhotonics plays 14 RequirementSolution Colocation Cost Efficiency Optical backplane reduces the routers physical foot print and power consuptions Efficient port density and scale Congestion free optical mesh enables dense 100G solutions Availability Higher MTBF with passive optical backplane replaces active electronics based fabric boards Security No “Security Vs. Capacity” Compromises – Full mesh based centralized policing Enabled by Compass-EOS icPhotonics™

15 Asaf SOMEKH, Oct 15 th, 2013 Asaf.Somekh@Compass-EOS.com


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