1. Dry Etch and Thin films & Process Integration Jan 6th, 2015 NNfC monthly admin committee meeting

2. Dry Etch– Tool status Update Dec 2014 RIE – AMC 2014 – Etch rate optimization post AMC Etch rates were same as before except SiO 2, SiO 2 etch rate decreased by 20nm/min. –Installation of Thermocouple for RIE-Cl has to be done. –DC bias interlock is installed in RIE-Cl (Max 500V). Al 2 O 3 and ITO recipes are optimized accordingly. (No etch rate and profile variation) PECVD – AMC 2014 – Post AMC deposition rates were checked- Same results as before with good uniformity. – Issue with Wafer Lift Bellow Assembly- Wafer transfer is done in manual mode. Spare part acquired and need to be installed. – SiO 2 High deposition rate recipe optimization in process.

3. Tool issues – Nov-Dec 2014. 3 eBeam deposition:  Issue with GOLD deposition … seeing “gold balls” on surface of the films on the order od 1-2 microns!  This is could be the potential cause of the failure of the RF- MEMS switch for MSRIT project.  Several other users have seen the same issue. Meeting organized to collect all the available data and trouble-shoot the problem. Problem seen since mid-Nov. Sputter tools:  Sputter2 down since early-Dec due to a faulty controller on the Throttle valve. Problem identified as the Norcal-valve controller— Quote received from Singapore~US$2.5k Need a strong push to Tecport for providing the part as part of the remaining spares money ~ US$38k.  Sputter one is up – Need to purchase Al/Cr targets. Quotations received. P.O. requested.

4. Tool issues 4 DRIE:  TOOL DOWN due to Arching in the Busbar area near the ICP Coil.  Same problem seen in June 2014.  SPTS had serviced the machine and cleaned the “blackened” contacts  Tool was operating under reduced power conditions to avoid such arching  Busbar parts were ordered in October, but the process has been slow due to strike and holidays/ICEE conference.  Need to accelerate the Annual maintenance schedule and change the “damaged” busbar parts.  Plan to get operational again in the next couple of weeks … provided all the “ducks” line up and the planets are aligned 

6. PECVD DRIE Anelva Sputter

7. Unit process development started in Aug. –Key challenges in eChannel RIE, Au-seed layer, gold plating, wafer bonding and dicing. Prasiddhi mask ordered to start structural learning. MTRDC project progress 7Sadanand Deshpande, NNFC