1. Transistors (MOSFETs)
MOS Field-Effect
Transistors (MOSFETs) 1

2. sedr42021_0401a.jpg
Figure 4.1 Physical structure of the enhancement-type NMOS transistor: (a) perspective view; (b) cross-section. Typically L = 0.1 to 3 mm, W = 0.2 to 100 mm, and the thickness of the oxide layer (tox) is in the range of 2 to 50 nm.
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3. sedr42021_0402.jpg
Figure 4.2 The enhancement-type NMOS transistor with a positive voltage applied to the gate. An n channel is induced at the top of the substrate beneath the gate.
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4. sedr42021_0403.jpg
Figure 4.3 An NMOS transistor with vGS > Vt and with a small vDS applied. The device acts as a resistance whose value is determined by vGS. Specifically, the channel conductance is proportional to vGS – Vt’ and thus iD is proportional to (vGS – Vt) vDS. Note that the depletion region is not shown (for simplicity).
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5. sedr42021_0404.jpg
Figure 4.4 The iD–vDS characteristics of the MOSFET in Fig. 4.3 when the voltage applied between drain and source, vDS, is kept small. The device operates as a linear resistor whose value is controlled by vGS.
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6. sedr42021_0405.jpg
Figure 4.5 Operation of the enhancement NMOS transistor as vDS is increased. The induced channel acquires a tapered shape, and its resistance increases as vDS is increased. Here, vGS is kept constant at a value > Vt.
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7. sedr42021_0406.jpg
Figure 4.6 The drain current iD versus the drain-to-source voltage vDS for an enhancement-type NMOS transistor operated with vGS > Vt.
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8. sedr42021_0407.jpg
Figure 4.7 Increasing vDS causes the channel to acquire a tapered shape. Eventually, as vDS reaches vGS – Vt’ the channel is pinched off at the drain end. Increasing vDS above vGS – Vt has little effect (theoretically, no effect) on the channel’s shape.
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9. sedr42021_0408.jpg
Figure 4.8 Derivation of the iD–vDS characteristic of the NMOS transistor.
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10. sedr42021_0409.jpg
Figure 4.9 Cross-section of a CMOS integrated circuit. Note that the PMOS transistor is formed in a separate n-type region, known as an n well. Another arrangement is also possible in which an n-type body is used and the n device is formed in a p well. Not shown are the connections made to the p-type body and to the n well; the latter functions as the body terminal for the p-channel device.
Microelectronic Circuits - Fifth Edition Sedra/Smith

11. sedr42021_0410a.jpg
Figure (a) Circuit symbol for the n-channel enhancement-type MOSFET. (b) Modified circuit symbol with an arrowhead on the source terminal to distinguish it from the drain and to indicate device polarity (i.e., n channel). (c) Simplified circuit symbol to be used when the source is connected to the body or when the effect of the body on device operation is unimportant.
Microelectronic Circuits - Fifth Edition Sedra/Smith

12. sedr42021_0411a.jpg
Figure (a) An n-channel enhancement-type MOSFET with vGS and vDS applied and with the normal directions of current flow indicated. (b) The iD–vDS characteristics for a device with k’n (W/L) = 1.0 mA/V2.
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13. sedr42021_0412.jpg
Figure The iD–vGS characteristic for an enhancement-type NMOS transistor in saturation (Vt = 1 V, k’n W/L = 1.0 mA/V2).
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14. sedr42021_0413.jpg
Figure Large-signal equivalent-circuit model of an n-channel MOSFET operating in the saturation region.
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15. sedr42021_0414.jpg
Figure The relative levels of the terminal voltages of the enhancement NMOS transistor for operation in the triode region and in the saturation region.
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16. sedr42021_0415.jpg
Figure Increasing vDS beyond vDSsat causes the channel pinch-off point to move slightly away from the drain, thus reducing the effective channel length (by DL).
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17. sedr42021_0416.jpg
Figure Effect of vDS on iD in the saturation region. The MOSFET parameter VA depends on the process technology and, for a given process, is proportional to the channel length L.
Microelectronic Circuits - Fifth Edition Sedra/Smith

18. sedr42021_0417.jpg
Figure Large-signal equivalent circuit model of the n-channel MOSFET in saturation, incorporating the output resistance ro. The output resistance models the linear dependence of iD on vDS and is given by Eq. (4.22).
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19. sedr42021_0418a.jpg
Figure (a) Circuit symbol for the p-channel enhancement-type MOSFET. (b) Modified symbol with an arrowhead on the source lead. (c) Simplified circuit symbol for the case where the source is connected to the body. (d) The MOSFET with voltages applied and the directions of current flow indicated. Note that vGS and vDS are negative and iD flows out of the drain terminal.
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20. sedr42021_0419.jpg
Figure The relative levels of the terminal voltages of the enhancement-type PMOS transistor for operation in the triode region and in the saturation region.
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21. sedr42021_e0408.jpg
Figure E4.8
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22. sedr42021_tb0401a.jpg
Table 4.1
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23. sedr42021_0420.jpg Figure 4.20 Circuit for Example 4.2.
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24. sedr42021_0421.jpg Figure 4.21 Circuit for Example 4.3.
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25. sedr42021_e0412.jpg
Figure E4.12
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26. sedr42021_0422.jpg Figure 4.22 Circuit for Example 4.4.
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27. sedr42021_0423a.jpg
Figure (a) Circuit for Example 4.5. (b) The circuit with some of the analysis details shown.
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28. sedr42021_0424.jpg Figure 4.24 Circuit for Example 4.6.
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29. sedr42021_0425a.jpg Figure 4.25 Circuits for Example 4.7.
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30. sedr42021_e0416.jpg
Figure E4.16
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31. sedr42021_0426a.jpg
Figure (a) Basic structure of the common-source amplifier. (b) Graphical construction to determine the transfer characteristic of the amplifier in (a).
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32. sedr42021_0426c.jpg
Figure (Continued) (c) Transfer characteristic showing operation as an amplifier biased at point Q.
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33. sedr42021_0427.jpg
Figure Two load lines and corresponding bias points. Bias point Q1 does not leave sufficient room for positive signal swing at the drain (too close to VDD). Bias point Q2 is too close to the boundary of the triode region and might not allow for sufficient negative signal swing.
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34. sedr42021_0428a.jpg Figure 4.28 Example 4.8.
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35. sedr42021_0428b.jpg Figure 4.28 (Continued)
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36. sedr42021_0429.jpg
Figure The use of fixed bias (constant VGS) can result in a large variability in the value of ID. Devices 1 and 2 represent extremes among units of the same type.
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37. sedr42021_0430a.jpg
Figure Biasing using a fixed voltage at the gate, VG, and a resistance in the source lead, RS: (a) basic arrangement; (b) reduced variability in ID; (c) practical implementation using a single supply; (d) coupling of a signal source to the gate using a capacitor CC1; (e) practical implementation using two supplies.
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38. sedr42021_0431.jpg Figure 4.31 Circuit for Example 4.9.
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39. sedr42021_0432.jpg
Figure Biasing the MOSFET using a large drain-to-gate feedback resistance, RG.
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40. sedr42021_0433a.jpg
Figure (a) Biasing the MOSFET using a constant-current source I. (b) Implementation of the constant-current source I using a current mirror.
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41. sedr42021_0434.jpg
Figure Conceptual circuit utilized to study the operation of the MOSFET as a small-signal amplifier.
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42. sedr42021_0435.jpg
Figure Small-signal operation of the enhancement MOSFET amplifier.
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43. sedr42021_0436.jpg
Figure Total instantaneous voltages vGS and vD for the circuit in Fig
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44. sedr42021_0437a.jpg
Figure Small-signal models for the MOSFET: (a) neglecting the dependence of iD on vDS in saturation (the channel-length modulation effect); and (b) including the effect of channel-length modulation, modeled by output resistance ro = |VA| /ID.
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45. sedr42021_0438a.jpg
Figure Example 4.10: (a) amplifier circuit; (b) equivalent-circuit model.
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46. sedr42021_0439.jpg
Figure Development of the T equivalent-circuit model for the MOSFET. For simplicity, ro has been omitted but can be added between D and S in the T model of (d).
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47. sedr42021_0440a.jpg
Figure (a) The T model of the MOSFET augmented with the drain-to-source resistance ro. (b) An alternative representation of the T model.
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48. sedr42021_0441a.jpg
Figure Small-signal equivalent-circuit model of a MOSFET in which the source is not connected to the body.
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49. sedr42021_tb0402a.jpg
Table 4.2
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50. sedr42021_0442.jpg
Figure Basic structure of the circuit used to realize single-stage discrete-circuit MOS amplifier configurations.
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51. sedr42021_e0430a.jpg
Figure E4.30
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52. sedr42021_tb0403a.jpg
Table 4.3
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53. sedr42021_0443a.jpg
Figure (a) Common-source amplifier based on the circuit of Fig (b) Equivalent circuit of the amplifier for small-signal analysis. (c) Small-signal analysis performed directly on the amplifier circuit with the MOSFET model implicitly utilized.
Microelectronic Circuits - Fifth Edition Sedra/Smith

54. sedr42021_0444a.jpg
Figure (a) Common-source amplifier with a resistance RS in the source lead. (b) Small-signal equivalent circuit with ro neglected.
Microelectronic Circuits - Fifth Edition Sedra/Smith

55. sedr42021_0445a.jpg
Figure (a) A common-gate amplifier based on the circuit of Fig (b) A small-signal equivalent circuit of the amplifier in (a). (c) The common-gate amplifier fed with a current-signal input.
Microelectronic Circuits - Fifth Edition Sedra/Smith

56. sedr42021_0446a.jpg
Figure (a) A common-drain or source-follower amplifier. (b) Small-signal equivalent-circuit model. (c) Small-signal analysis performed directly on the circuit. (d) Circuit for determining the output resistance Rout of the source follower.
Microelectronic Circuits - Fifth Edition Sedra/Smith

57. sedr42021_tb0404a.jpg
Table 4.4
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58. sedr42021_tb0404c.jpg Table 4.4 (Continued)
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59. sedr42021_0447a.jpg
Figure (a) High-frequency equivalent circuit model for the MOSFET. (b) The equivalent circuit for the case in which the source is connected to the substrate (body). (c) The equivalent circuit model of (b) with Cdb neglected (to simplify analysis).
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60. sedr42021_0448.jpg
Figure Determining the short-circuit current gain Io /Ii.
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61. sedr42021_tb0405.jpg
Table 4.5
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62. sedr42021_0449a.jpg
Figure (a) Capacitively coupled common-source amplifier. (b) A sketch of the frequency response of the amplifier in (a) delineating the three frequency bands of interest.
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63. sedr42021_0450a.jpg
Figure Determining the high-frequency response of the CS amplifier: (a) equivalent circuit; (b) the circuit of (a) simplified at the input and the output;
Microelectronic Circuits - Fifth Edition Sedra/Smith

64. sedr42021_0450c.jpg
Figure (Continued) (c) the equivalent circuit with Cgd replaced at the input side with the equivalent capacitance Ceq; (d) the frequency response plot, which is that of a low-pass single-time-constant circuit.
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65. sedr42021_0451.jpg
Figure Analysis of the CS amplifier to determine its low-frequency transfer function. For simplicity, ro is neglected.
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66. sedr42021_0452.jpg
Figure Sketch of the low-frequency magnitude response of a CS amplifier for which the three break frequencies are sufficiently separated for their effects to appear distinct.
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67. sedr42021_0453.jpg Figure 4.53 The CMOS inverter.
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68. sedr42021_0454a.jpg
Figure Operation of the CMOS inverter when vI is high: (a) circuit with vI = VDD (logic-1 level, or VOH); (b) graphical construction to determine the operating point; (c) equivalent circuit.
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69. sedr42021_0455a.jpg
Figure Operation of the CMOS inverter when vI is low: (a) circuit with vI = 0 V (logic-0 level, or VOL); (b) graphical construction to determine the operating point; (c) equivalent circuit.
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70. sedr42021_0456.jpg
Figure The voltage transfer characteristic of the CMOS inverter.
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71. sedr42021_0457a.jpg
Figure Dynamic operation of a capacitively loaded CMOS inverter: (a) circuit; (b) input and output waveforms; (c) trajectory of the operating point as the input goes high and C discharges through QN; (d) equivalent circuit during the capacitor discharge.
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72. sedr42021_0458.jpg
Figure The current in the CMOS inverter versus the input voltage.
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73. sedr42021_0459a.jpg
Figure (a) Circuit symbol for the n-channel depletion-type MOSFET. (b) Simplified circuit symbol applicable for the case the substrate (B) is connected to the source (S).
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74. sedr42021_0460a.jpg
Figure The current-voltage characteristics of a depletion-type n-channel MOSFET for which Vt = –4 V and k¢n(W/L) = 2 mA/V2: (a) transistor with current and voltage polarities indicated; (b) the iD–vDS characteristics; (c) the iD–vGS characteristic in saturation.
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75. sedr42021_0461.jpg
Figure The relative levels of terminal voltages of a depletion-type NMOS transistor for operation in the triode and the saturation regions. The case shown is for operation in the enhancement mode (vGS is positive).
Microelectronic Circuits - Fifth Edition Sedra/Smith

76. sedr42021_0462.jpg
Figure Sketches of the iD–vGS characteristics for MOSFETs of enhancement and depletion types, of both polarities (operating in saturation). Note that the characteristic curves intersect the vGS axis at Vt. Also note that for generality somewhat different values of |Vt| are shown for n-channel and p-channel devices.
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77. sedr42021_e0451.jpg
Figure E4.51
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78. sedr42021_e0452.jpg
Figure E4.52
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79. sedr42021_0463.jpg
Figure Capture schematic of the CS amplifier in Example 4.14.
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80. sedr42021_0464.jpg
Figure Frequency response of the CS amplifier in Example 4.14 with CS = 10 mF and CS = 0 (i.e., CS removed).
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81. sedr42021_p04018a.jpg
Figure P4.18
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82. sedr42021_p04033a.jpg
Figure P4.33
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83. sedr42021_p04036.jpg
Figure P4.36
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84. sedr42021_p04037.jpg
Figure P4.37
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85. sedr42021_p04038.jpg
Figure P4.38
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86. sedr42021_p04041.jpg
Figure P4.41
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87. sedr42021_p04042a.jpg
Figure P4.42
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88. sedr42021_p04043a.jpg
Figure P4.43
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89. sedr42021_p04044a.jpg
Figure P4.44
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90. sedr42021_p04045.jpg
Figure P4.45
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91. sedr42021_p04046a.jpg
Figure P4.46
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92. sedr42021_p04047.jpg
Figure P4.47
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93. sedr42021_p04048.jpg
Figure P4.48
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94. sedr42021_p04054.jpg
Figure P4.54
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95. sedr42021_p04061.jpg
Figure P4.61
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96. sedr42021_p04066.jpg
Figure P4.66
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97. sedr42021_p04074.jpg
Figure P4.74
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98. sedr42021_p04075.jpg
Figure P4.75
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99. sedr42021_p04077.jpg
Figure P4.77
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100. sedr42021_p04086.jpg
Figure P4.86
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101. sedr42021_p04087.jpg
Figure P4.87
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102. sedr42021_p04088a.jpg
Figure P4.88
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103. sedr42021_p04097.jpg
Figure P4.97
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104. sedr42021_p04099.jpg
Figure P4.99
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105. sedr42021_p04101.jpg
Figure P4.101
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106. sedr42021_p04104.jpg
Figure P4.104
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107. sedr42021_p04117.jpg
Figure P4.117
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108. sedr42021_p04120.jpg
Figure P4.120
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109. sedr42021_p04121a.jpg
Figure P4.121
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110. sedr42021_p04123.jpg
Figure P4.123
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