1. RIT Senior Design Project 10662 D3 Engineering Camera Platform
Friday November 6, 2009
9:00am to 11:00am
Include new CAD Models/ take out the pictures.

2. Team Members Gregory Hintz (EE) Samuel Skalicky (CE)
Project Manager
Samuel Skalicky (CE)
Lead Engineer, FPGA Board
Jeremy Greene (EE)
Connector Board
Jared Burdick (EE)
Power
Michelle Bard (ME)
Environmental
Tony Perrone (ME)
Physical Design

3. Advisors Scott Reardon (D3 Engineering) Kevin Kearney (D3 Engineering)
Dr. Robert Kremens (RIT-Imaging Science)
Philip Bryan (RIT – Industry Guide)

4. Project Status
Risks
BOM
Analysis
Feasibility
Designs
Test Plans

5. Schedule for the Design Review
Overview
Gregory Hintz
Electrical Discussion
Processor Board and FPGA
Samuel Skalicky
Connector Board, INS System
Jeremy Greene
Mechanical Discussion
System Design
Tony Perrone
Environmental Concerns
Michelle Bard
Include breakdowns and make note of actual times from dry runs

6. What is the Customer Looking for?
Integrate supplied components
Ruggedized Unit
Flight-capable package
Can record and transmit
Capable of processing
The customer desired that we integrate supplied components into an environment-ready, flight-capable package that can record and transmit multi-spectral ground images and associated INS data. This solution should be capable of (if not initially configured for) processing that data in some way, including, but not limited to, compositing images from multiple spectrums and “stamping” image data with real time INS data.

7. Black Box System Model

8. Electronic System

9. Supplied Components Customer Needs Met Integrate supplied components
10MP Visual Band Camera
1.3MP IR Camera
Spatial Sensors
NovAtel OEM Board OEMV3
NovAtel OEM Board OEMV2
Camera Processing Board
Capture data from two cameras
Capture 1fps
Capture 30fps
Capture INS 30/sec
(simultaneously)
External INS units
Data processing (overlay)
Real time viewing
Store full-res. Data during flight
Support NovAtel GNSS board

10. Electronic System

11. Camera Components Customer Needs Met Integrate supplied components
10MP Visual Band Camera
1.3MP IR Camera
Spatial Sensors
NovAtel OEM Board OEMV3
NovAtel OEM Board OEMV2
Camera Processing Board
Capture data from two cameras
Capture 1fps
Capture 30fps
Capture INS 30/sec
(simultaneously)
External INS units
Data processing (overlay)
Real time viewing
Store full-res. Data during flight
Support NovAtel GNSS board

12. Final Output 10mp Camera

13. Electronic System

14. Camera Components Customer Needs Met Integrate supplied components
10MP Visual Band Camera
1.3MP IR Camera
Spatial Sensors
NovAtel OEM Board OEMV3
NovAtel OEM Board OEMV2
Camera Processing Board
Capture data from two cameras
Capture 1fps
Capture 30fps
Capture INS 30/sec
(simultaneously)
External INS units
Data processing (overlay)
Real time viewing
Store full-res. Data during flight
Support NovAtel GNSS board

15. Final Output CameraLink® IR camera

16. Electronic System

17. Spatial Sensing Customer Needs Met Integrate supplied components
10MP Visual Band Camera
1.3MP IR Camera
Spatial Sensors
NovAtel OEM Board OEMV3
NovAtel OEM Board OEMV2
Camera Processing Board
Capture data from two cameras
Capture 1fps
Capture 30fps
Capture INS 30/sec
(simultaneously)
External INS units
Data processing (overlay)
Real time viewing
Store full-res. Data during flight
Support NovAtel GNSS board

18. Output INS data format
# of shot, (FLIGHT INFORMATION, Pitch, ect….) 675, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ,

19. Electronic System

20. Processing elements Customer Needs Met Integrate supplied components
10MP Visual Band Camera
1.3MP IR Camera
Spatial Sensors
NovAtel OEM Board OEMV3
NovAtel OEM Board OEMV2
Camera Processing Board
Capture data from two cameras
Capture 1fps
Capture 30fps
Capture INS 30/sec
(simultaneously)
External INS units
Data processing (overlay)
Real time viewing
Store full-res. Data during flight
Support NovAtel GNSS board

21. OEM Digital Signal Processing Board
Signal Processing already done on Customer Supplied Interface.
Image overlay
Compression
Resolution of Images
Outputs
10/100 Ethernet
S-Video
Software interface available

22. OEM Board

23. Electronic System

24. FPGA Board Diagram

25. FPGA Board to Scale

26. Processing elements Customer Needs Met Integrate supplied components
10MP Visual Band Camera
1.3MP IR Camera
Spatial Sensors
Camera Processing Board
Capture data from two cameras
Capture 1fps
Capture 30fps
Capture INS 30/sec
(simultaneously)
External INS units
Data processing (overlay)
Real time viewing
Store full-res. Data during flight
Support NovAtel GNSS board

27. Processing Elements FPGA Inputs/Outputs Flexible Architecture
Faster Speed
Parallel Processing
DSP
Energy Efficient
Single Pipeline
Easy Implementation
Math based ISA

28. DSP Customer programmable Role in this design Required skills
Encoding/Decoding media
Peripherals
Role in this design
Image compression
Real time streaming of data
INS interface
Required skills
Implementable Knowledge of C
DSP/BIOS

29. FPGA FPGA Selection Quicker time to fabrication
Supreme configurability/Field reprogrammable
Has the I/O needed
Parallel processing

30. FPGA Xilinx Selection Model XC6SLX75T Selection
Resources available to the team
Larger range of choices than other companies
Customer preference
Model XC6SLX75T Selection
Package size (23mm x 23mm)
High speed transceiver count
I/O pin count
Cost effectiveness

31. FPGA Board Diagram

32. Data Flow – Initial Design
Pictures
Camera  FPGA  OEM
INS Data
INS  OEM

33. Data Flow – Final Design
Pictures
Camera  FPGA  OEM
Camera  FPGA  HD
INS Data
INS  OEM  FPGA  HD

34. Data Speeds Image INS IR: 30 images / second Visible :1 image / second
VGA=640x480
9.2 MHz
Visible :1 image / second
10.7MP=3664x2748
10.07 MHz
INS
30 captures / second
1kB=8kb
8000 baud
**Note: baud = bits per second (RS-232)

35. FPGA Pin Speeds
Minimum values
13ns -> 76 MHz
5ns -> 200 MHz

36. System Software Design

37. FPGA Image Controller

38. Image Data Input

39. System Software Design

40. FPGA Central Dispatch

41. External Interfaces and the Connector Board
Interfaces Specified Originally
2x Camera Link camera
2x Gigabit Ethernet camera
Power Supply (9V to 36V)
10/100 Ethernet
External Inertial Navigation System
2x GigE
2x Camera Link
10/100 Ethernet
Power
Supply
External INS
Connector Board
D3 OEM Board

42. External Interfaces and the Connector Board
Final Interfaces Specified
2x Camera Link camera
2x GigE camera
Power Supply (9V to 36V)
10/100 Ethernet
External Inertial Navigation System
RCA output
USB port
Power
Supply
External INS
2x Camera Link
2x GigE
RCA output
10/100 Ethernet
USB port
Connector Panel

43. External Interfaces and the Connector Board
Goal:
All interfaces routed through and mounted on the Connector Board
Reality:
Various different mountings and routings necessary
Goal was to get everything on the Connector Board, if possible.

44. Interface Routing and Connector Mounting
Through the Connector Board
Routed Elsewhere
Board Mount
2x Camera Link camera
2x GigE camera
Panel Mount
Power Supply (9V to 36V)
10/100 Ethernet
External INS
RCA output
USB port
2x Camera Link
External INS
Power Supply
2x Camera Link = nearly full width of Connector Board
Connector Panel

45. Interface Routing and Connector Mounting
Through the Connector Board
Routed Elsewhere
Board Mount
2x Camera Link camera
2x GigE camera
Panel Mount
Power Supply (9V to 36V)
10/100 Ethernet
External INS
RCA output
USB port
GigE mounted on FPGA Board
2x GigE
FPGA Board (bottom view)
Connector Panel

46. Interface Routing and Connector Mounting
Through the Connector Board
Routed Elsewhere
Board Mount
2x Camera Link camera
2x GigE camera
Panel Mount
Power Supply (9V to 36V)
10/100 Ethernet
External INS
RCA output
USB port
RCA
10/100 Ethernet
RCA and 10/100 Ethernet routed directly to D3 OEM Board
10/100
Ethernet
RCA output
D3 OEM Board (top view)
Connector Panel

47. Interface Routing and Connector Mounting
Through the Connector Board
Routed Elsewhere
Board Mount
2x Camera Link camera
2x GigE camera
Panel Mount
Power Supply (9V to 36V)
10/100 Ethernet
External INS
RCA output
USB port
USB port
USB routed directly to internal GNSS receiver
Connector Panel

48. Customer Provided Block Diagram
The Connector Board
Having determined what it needs to do, design could commence
Customer Provided Block Diagram

49. Connector Board Design: Functional Block Diagram

50. Connector Board Design: Scale Diagram

51. Inertial Navigation System (INS)
Determines:
Direction
Roll, pitch & yaw
Velocity
Inertial Measurement Unit (IMU)
Location
Global Navigation Satellite System (GNSS)
Global Positioning System (GPS)
GLONASS

52. Global Navigation Satellite System
Customer Specified
NovAtel OEMV-2 or OEMV-3
RS-232 interface
Different power requirements
OEMV-2: %/-3% VDC
OEMV-3: 4.5 to 18 VDC

53. GNSS Software

54. Small Passenger Aircraft
Chassis Interfaces
Interface to Plane
Small Passenger Aircraft
RIT U.A.V. Airframe “C”
Mountable to a flat plate
Mountable to a flat wooden base
Smaller than a person; Approx 2’ x 2’ x 5’6” tall
Less than 16” x 6.5” x 5” tall
Less than 150lbs (68kg)
Less than 15lbs (6.8kg)

55. Chassis Interfaces Interface to Plane 10.25” Long 6” Wide 6.5” Tall
10.9lbs

56. Chassis Interfaces Interface to Plane Component Weight (lbs)
Electronics
0.91
Electronics Enclosure
3.43
Optics
2.15
Optics Enclosure
4.32
Total
11 lbs (Approximate)

57. Solid State Hard Drive (Not Pictured)
Chassis Interfaces
Solid State Hard Drive (Not Pictured)
Connector Board
NovAtel OEMV-3
D3 OEM Board
FPGA Board

58. Chassis Interfaces

59. Linos Mevis-C Lenses (16 mm)
Chassis Interfaces
MicroStrain IMU
Camera Boards
Linos Mevis-C Lenses (16 mm)

60. Chassis Interfaces

61. Vibration Damping Two sources of need:
Insure structural integrity under vibration
Minimize image distortion
Item 1 must be tested for, but item 2 can be calculated and designed for.

62. Vibration Damping Characterized per RTCA DO-160
Frequency Range: 5 – 500 Hz
Amplitude Range: – 0.1 inches
3 Primary Axes

63. Vibration Damping Image distortion depends on: Aircraft Speed
Aircraft Altitude
Lens Image Angle
Shutter Speed

64. Vibration Damping
Speed induced by vibration taken as derivative of vibration motion profile
Profile: X = A·sin(F·t)
Speed: X’ = A·F·cos(F·t)

65. Speed Distortion (Pixels) Vibration Distortion (Pixels)
Vibration Damping
Maximum Aircraft Speed: 36 m/s
Maximum Vibration Speed: 1.27 m/s
Altitude (ft)
Speed Distortion (Pixels)
Vibration Distortion (Pixels)
1000
0.66
0.0233
1500
0.44
0.0155
2000
0.33
0.0116
5000
0.13
0.0047

66. Environmental Needs Electronics (all temps in C) Optics:
Maintain internal temp within operating temp of components
Electronics (all temps in C)
FPGA
0 < T < 85
Connector Board
0 < T < 70
D3 supplied OEM Board
-40 < T < 85
Electronics Range
0C < T < 70C
Optics:
10 Mp cameras
-40 < 0 < 70
More specs

67. Environmental Needs
Allow for standard Environmental conditions as defined by MIL-STD-810G and DO-160
Temperature Range:
-32C to 45 C (on ground)
Humidity:
90%
“2.2 Basic climatic design type.”
“The area this type applies to includes the most densely populated and heavily industrialized parts of the world as well as the humid tropics…Areas where the basic type applies are more widespread than the hot and cold design types combined. They also include most of the densely populated, highly industrialized sectors of the world. “

68. Power Requirements of Devices
Voltage Line (Volts)
DSP (Amps)
FPGA (Amps)
SATA (Amps)
DDR2 (Amps)
INS (Amps)
Cameras (Amps)
SPI (Amps)
Total Current/Voltage (Amps) 12
4.5 5
0.5
0.42
5.42
3.3
0.104
5.104
2.5
TBD
1.8 1
0.276
0.71
1.986
1.2
Total Current/Device (Amps)
13.5
 18.01
MAX POWER= W

69. Environmental Management: Heat
Major sources of heat generation inside chassis
Hard drive
about the half the heat produced comes from this
Voltage Regulator
FPGA
DSP
Net Heat generated by system can be estimated using the net power input to the system
Net heat gen: have an add up by component

70. Environmental Management: Heat Transfer analysis
Heat Transfer model: assuming a steady state
Radiation
Least efficient mode
Model as black body
From electronics to chassis
From chassis to external environment
Model dependant primarily on surface area of components
q rad
T Chassis
TAmbient
Get rid of all but radiation, put in some charts showing power v. internal temp on ground and at altitude
make sure to address assumptions and why made

71. Environmental Management Heat Transfer: radiation model
Board stack
Chassis wall
q chassis
q board
T chassis
T boards
T ambient
Treat enclosure as a black box radiating heat to the outside air
Neglect Convection
Protected from moving air
Neglect Conduction
Temperature at surface of chassis = temperature inside of chassis
Heat radiating from chassis is 50% of heat radiating from boards (qc = .5qb)
**Assume an efficiency rate of transfer from boards to box
Sources:
Heat Transfer: a practical approach by Yunis A. Cengel
for lapse rate in the troposphere: and
Emissivity coefficients:

72. Environmental Management Heat Transfer: radiation model
Used a ‘double’ radiation model
Radiation from electronics to chassis wall
Radiation from chassis wall to outside environment
Combined the two models into one by assuming an efficiency between the heat transfer rate of the electronics and the chassis wall
External environment
Internal environment
t¥ ground (°C)
Pgen (w)
Tboards Final (°C)
-32
-51.93 5
-23.10 10
-1.78 20
30.04 25
42.79 50
90.74 70
118.75
100
152.00 45
25.06
38.41
50.23
70.61
79.57
116.48
139.88
168.90

73. Environmental Management Heat Transfer: radiation model
‘Safe zone’ between ~ 10 and ~ 30 W

74. Environmental Management : Humidity dew point: should we be concerned with condensation?
Temperature at which water will condense on a surface
Function of ambient temperature and relative humidity
Used to determine whether additional steps should be taken to control temperature/ humidity inside the chassis.
Conclusion: Condensation will not be a big problem
May run into trouble at very high humidities (above 80%)
Dew point is very close to air temperatures
environmental data
dew point solution
relative humidity (%)
t¥ air (°c)
dew point ( C) 1 40 50 80 90
10.652
14.052
21.519
23.459
Dew point, the temperature at which water will condense on a surface, is a function of ambient temperature and relative humidity. Knowing the dew point will tell whether additional steps should be taken to control temperature and/or humidity inside the chassis.

75. condensation control selection matrix
Environmental Management dew point: should we be concerned with condensation?
Some environmental management techniques may be valuable to prevent condensation at high humidities
Main options:
include a heating system to keep temperature inside the chassis above dew point
reduce humidity inside the chassis to lower the dew point inside the chassis
a common method : silica gel packs
condensation control selection matrix
Heater system
silica gel pack
weight
rank
with weight
effective at reducing/preventing condensation 5 2 10
simplicity in manufacturing/implimentation 3 -1 -3 1
reusability
allows for flexability as heat requirements change 4 8
allows for air/water tight enclosure
total: 17 27
From this comparison: a compact, reusable silica gel pack appears to be the appropriate choice.
Source for dew point info: sensor company explaining how to use info from sensors to calculate dew point

76. RIT Senior Design Project 10662 D3 Engineering Camera Platform
Friday November 6, 2009
9:00am to 11:00am
Include new CAD Models/ take out the pictures.

77. RIT Senior Design Project 10662 D3 Engineering Camera Platform
Friday November 6, 2009
9:00am to 11:00am
Include new CAD Models/ take out the pictures.

78. RIT Senior Design Project 10662 D3 Engineering Camera Platform
Friday November 6, 2009
9:00am to 11:00am
Include new CAD Models/ take out the pictures.