1. Presentation Group : 2012 v1 Resistive Bulk prototyping at Cirea 15 June 2012 @ CERN Michel Billant 1

2. Presentation Group : 2012 v1 Process Status of bulk production Coverlay Lamination Development Curing Aspect Gap PCB & Mesh Last delivery @ CEA in May 2012 Tested under 740V  ok

3. Presentation Group : 2012 v1 Q2-2012 In process for CERN : BXY with resistive layer – Training done by Rui end of March 2012 – Production of 5 units 100 x 100 delivery in June – Production of 5 units 600 x 400 delivery in September – Production of 5 units 600 x 1500 delivery beginning of 2013

4. Presentation Group : 2012 v1 RMM Resitive process : Etching the grooves on the external Pcb layer Carbon printing Surface leveling Etching the copper Measurement

5. Presentation Group : 2012 v1 Grooves Etching Wall profile, artwork width adjustment

6. Presentation Group : 2012 v1 Printing Grooves Printed

7. Presentation Group : 2012 v1 Carbon leveling To ensure to have the right and homogeneos thickness

8. Presentation Group : 2012 v1 Etching Remove the copper between Carbon lines Piste Résist. L : 196µm

9. Presentation Group : 2012 v1 Inspection

10. Presentation Group : 2012 v1 Resistance Mesurement

11. Presentation Group : 2012 v1 Results

12. Presentation Group : 2012 v1 Restitive layer Could be produce with an industrial way No main issue detected at this level Increased panel sizes will be produced in September 2012.

13. Presentation Group : 2012 v1 Conclusions Cirea has now the full knowledge for Bulk Micromegas. Restistive layer is starting with good results in small areas. The process has to be improved by using industrial processes, to be done this year.

14. Presentation Group : 2012 v1 14 Contacts : Cirea : Yann Duigou yann.duigou@gepcb.comyann.duigou@gepcb.com Sales : Jean-Pol Thiebaut jean-pol.thiebaut@gepcb.comjean-pol.thiebaut@gepcb.com