1. XFP System and 10G Common Electrical Interface
Dong Zheng BitBlitz Communications
Milpitas, California

2. Agenda XFP modules vs. others Host systems architectures
Implementation examples

3. (Greater Line Card density)
Box-to-Box: Optical Modules
300 pin MSA
Large on Board Footprint
Cost: 20x
x16 Mux I/F
Xenpak
Plug-able
Cost: 4-6x
XAUI I/F
Xpak/X2
Plug-able
Cost: 2x
XAUI I/F
REQUIREMENTS!
Lower Cost
Smaller Form Factor
(Greater Line Card density)
Lower Power
XFP/SFP
Plug-able
Cost: 1x
10G Ser I/F

4. XFP vs. other modules XENPAK XPAK X2 XFP XFP/XENPAK Power (W) 6 4
1.5, 2.5, 3.5, >3.5
~50%
(level 2,3)
Width (mm) 36
18.35
Length (mm)
121
85.4 91 71
Depth
115.2
75.7
77.2
61.7
Notes: * The XFI electrical spec is part of the XFP spec, but is expected to be used elsewhere.
Notes: * The XFI electrical spec is part of the XFP spec, but is expected to be used elsewhere.

5. XFP philosophy: Minimal electrical circuits in module
10GE Applications
Host
Module
XGMII
XAUI
ASIC 3G
SerDes 80 16
XENPAK,
XPAK, X2
XFI
ASIC
XGMII 3G
SerDes
10G
SerDes
XAUI 4 80 16
XFP
Optical
XFP philosophy: Minimal electrical circuits in module

6. 10GE Electrical Interfaces
Speed/wire
No. of wires
Distance
XGMII
312.5Mbps 80 3”
XAUI
3.125Gbps 16
>40”
XFI
Gbps 4
<7”
XFP host design guide line:
XFI 10G interface keeps short
XAUI extends reach distance

7. 10G CEI SR (XFI)
Rate from 9.95Gbps to 11.09Gbps for SONET, 10GE, 10GFC applications
Max recommend host PCB length <200mm, depending on geometry and material
Near-end eye mask
Far-end eye mask

8. Design Example Devices used: 10G SerDes: BBTX100 3G SerDes: BBT3420
Standard FR-4

9. Test Results Note: Far-end eye Near-end mask Potential driving
optics directly

10. Summaries
XFP modules are lower power, smaller form factor, lower cost for higher line card density over competing solutions
10G electrical interface is more challenging compared to XENPAK based modules
Reference system has demonstrated feasibility of the XFP host system, with significant margin on 10G electrical interface.