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Published byKennedy Parsley Modified over 9 years ago
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PMMA & HSQ trend chart December 2012 Sangeeth kallatt
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PMMA sample preparation Substrate : 100 oxide & Si wafer Cleaning : O 2 plasma clean (2000W, 10 min) Spin speed : final rpm 6000 for 40 sec Pre bake: 180 degrees for 3 min Exposure parameters: EHT : 20 Kv Aperture : 10um Working distance: 5mm Development time : 30 sec in MIBK: IPA (1:3)
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50nm line : standard deviation from expected
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100nm line : standard deviation from expected
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200nm line : standard deviation from expected
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PMMA grating patterns for proximity study
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PMMA circles
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Contrast curve for PMMA 950 A2 D 0 = clearing dose ≈ 140 D 100 = dose with resist insoluble ≈ 95 Which gives ϒ = 6.8
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HSQ sample preparation Substrate : Si wafer Cleaning : O 2 plasma clean (2000W, 10 min) Spin speed : final rpm 6000 for 40 sec Pre bake: no pre bake Exposure parameters: EHT : 20 Kv Aperture : 10um Working distance: 5mm Development time : 2 min in 2.36 % TMAH
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HSQ lines
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25 nm HSQ lines: variation of line width with Pitch Pattern size
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50 nm HSQ lines: variation of line width with Pitch Pattern size
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100 nm HSQ lines: variation of line width with Pitch Pattern size
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Patterns for studying proximity effects
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HSQ pillars
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Contrast Curve for HSQ (XR1541-6%) D 0 = dose, negative resist removed ≈ 225 D 100 = dose for negative resist insoluble≈ 260 Which gives ϒ = 16
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