1. SUPERIOR FLUX & MFG. ELECTRONICS PRODUCTS
Superior Flux & Mfg. Co. founded in 1932.
1949 introduced Superior Supersafe® No. 30, first Battelle formula flux.
1995 introduced SyberGelTM and SyberLiquidTM for repair/rework and hand-soldering.

2. PRODUCT LINE Solder Pastes Tacky Fluxes Wave Solder Fluxes
Component Tinning Fluxes
Wire Tinning Fluxes
Hand Solder Fluxes
Copper and Nickel Pre-Cleaners
Saponifier
Descaler
Dross Reduction Powder

3. SOLDER PASTE 3000 Series Conventional No-Clean
4000 Series Synthetic, Low-Residue No-Clean
8000 Series Water-Soluble
9000 Series Rosin Mildly Activated (RMA)
Solders: 63Sn/37Pb
62Sn/36Pb/2Ag
Lead-Free

4. 3000 SERIES NO-CLEAN SOLDER PASTE
Classification: IPC ANSI-J-STD 004, Type ROL0
Meets and exceeds Bellcore standards.
Pin-testable post-solder joints.
Translucent residue.
Capable of printing 12 mil pitch.

5. 4000 SERIES SYNTHETIC NO-CLEAN SOLDER PASTE
Classification: IPC ANSI J-STD-004,
Type REL0.
Meets and exceeds Bellcore standards.
Translucent, protective post-solder residue.
Pin-testable post-solder joints. General residue levels of 2.5 – 3.3%. In proper conditions, can be as low as 1.1%.
Capable of printing 12 mil pitch.

6. 8000 SERIES WATER-SOLUBLE SOLDER PASTE
Passes Bellcore
Passes IPC
Residues are truly water-soluble.
Post-reflow residues can be left on boards for extended time and NOT reduce SIR values.
Post-solder residues do not foam in aqueous cleaning systems.
Capable of printing 12 mil pitch.

7. 9000 SERIES RMA SOLDER PASTE
Exceptional reflow profiling characteristics.
Capable of printing 16 mil pitch.
Superior wetting characteristics.
Residues can be aqueous cleaned using SyberKleen 2000 Saponifier.

8. RECOMMENDED REFLOW PROFILE: 63Sn/37Pb and 62Sn/36Pb/2Ag

9. REFLOW PROFILE FOR LEAD-Free

10. APPLICATION METHODS
Screen printing
Cartridge printing
Dispensing

11. WHAT SETS SUPERIOR SOLDER PASTES APART?
All are non-halide.
All have a minimum 12 hour open-time between printing, placement, and reflow.
All are formulated for high-speed dispensing.
All No-Clean and RMA pastes can be aqueous cleaned in Superior SyberKleen 2000 Saponifier .
NO slumping.
NO tomb-stoning when stencil and reflow profile are properly set.
NO white residues on PCBs.

12. WHAT SETS SUPERIOR SOLDER PASTES APART? (cont.)
Consistent rheology, thixotropy, and viscosity from lot-to-lot.
Consistent, clear, pin-testable residues with all No-Cleans.
Consistent metal-load due to no pre-thinning or post-thinning manufacturing process.
4000 Series Synthetic No-Clean residues act as protective barrier against humidity and outside elements.
8000 Series Water-Soluble residues can be washed any time after reflow. SIR values remain the same when PCBs are cleaned three (3) minutes or three (3) days after reflow.

13. SOLDER PASTE STORAGE Shelf life for all solder pastes extended
with freezer-storage first formulations.
Freezer Storage (0ºC and below): months.
Refrigerator Storage (1-12ºC): months.
Room temperature storage (18-23ºC): 3 months.

14. TACKY FLUXES 4000 Synthetic No-Clean 3000 Conventional No-Clean
8000 Water-Soluble
9500 High Temperature
Applications:
BGA Attachment and Repair
Custom manufacturing applications
Dispensable applications
Preform soldering

15. WAVE SOLDERING FLUXES Flux-types No-Clean Water-Soluble RMA Flux-base
VOC-FREE
Alcohol-based
Applications
63Sn/37Pb, LEAD-Free.

16. WAVE SOLDERING FLUX APPLICATION METHODS
Spray
Foam
Drag
Wave

17. NO-CLEAN WAVE SOLDERING FLUXES
VOC-Free:
No. 420 (Spray or Foam)
No. 425
Alcohol-based
No. 312
No. 315
No. 340
RFE 14Y3N
All No-Clean fluxes classified as:
IPC ANSI J-STD 004 Type ORL0

18. WATER-SOLUBLE WAVE SOLDER FLUXES
Alcohol-based
No. 84
RFE C
VOC-Free
No. 32
All Water-Soluble fluxes classified as:
IPC ANSI J-STD 004 Type ORM1

19. ROSIN FLUXES Type R: No. 97 Type RMA: No. 99 Type RA: No.100
Hi-Temp RA: No. 100HT
Solids content variations are available
for all fluxes.

20. ADDITIONAL PCB ASSEMBLY PROCESS PRODUCTS
SyberGelTM and SyberLiquidTM
Hand solder, repair and rework gel or liquid that act as flux and cleaner.
Superior SyberKleen 2000 Saponifier
Rosin residue removal in aqueous cleaning systems.
Superior Descaler
A descaling solution for removing residual build-up that is standard for in-line and batch aqueous cleaners.
Superior Dross Reducer
Powder for dross and oxidation removal from solder bath to extend solder life.

21. COMPONENT TINNING PRECLEANERS & FLUXES
Lead tinning for semiconductor, component, and fuse leads.
Fluxes formulated for Tin/Lead, Lead-Free, and fusible alloys.
Base Metals:
Copper
Nickel
Alloy 42
Alloy 51
Kovar
Other specialty alloys

22. SEMICONDUCTOR AND COMPONENT LEAD PRE-CLEANERS
Copper Pre-Cleaner
VOC-Free, non-hazardous, OA formulation.
Light, pink color that changes if pH exceeds a 3.5 reading.
Nickel Pre-Cleaner
A high activity nickel cleaner that contains no sulfuric acid.

23. DIFFERENT FLUXES FOR DIFFERENT APPLICATIONS
VOC-FREE, HALIDE
No. 30, No. 30DS, No. 40MM4, No. 43
ALCOHOL-BASED HALIDE
No. 45, No. 48, No. 48S
VOC-FREE, NON-HALIDE
430 Series
ALCOHOL-BASED, NON-HALIDE
No. 435, No :1, No. 91

24. WIRE TINNING FLUXES
No-Clean: Small gage (14-22) automatic or manual cut/strip/tin operations.
VOC-Free: No. 425
Alcohol-based: No. 325, No. 334.
Water-soluble: Large gage (2-12) wires; Copper and brass crimped terminal wires.
VOC-Free: No. 30
Alcohol-based: No. 45
Applications:
Automotive, Industrial, and Appliances.