Download presentation
Presentation is loading. Please wait.
Published byJoana Shellito Modified over 9 years ago
1
Lecture 7 FPGA technology
2
2 Implementation Platform Comparison
3
3 FPGA main components and features Logic block architecture Interconnect architecture Programming technology Power dissipation Reconfiguration model
4
4 FPGA model …….
5
5 Interconnect Network Topologies Island style Row-based Sea-of-gates Hierarchical One-dimensional structures
6
6 Island-Style Architecture
7
7 Row-Based Architecture
8
8 Sea-of-Gates Architecture
9
9 Hierarchical Architecture
10
10 One-Dimensional Architecture
11
11 Logic Cluster Parameters The size of (number of inputs to) a LUT. The number of CLBs in a cluster. The number of inputs to the cluster for use as inputs by the LUTs. The number of clock inputs to a cluster (for use by the registers).
12
12 Studies on the CLB structure Area optimal: 3-4 input LUTs For multiple output LUTs: Optimal area: 4 input LUTs Optimal delay: 5-6 input LUTs 4-input LUT clusters show 10% area efficiency in comparison to single 4-input LUTs
13
13 Programming Technology Volatile (SRAM) Irreversible (Antifuse) EPROM, EEPROM AND FLASH The programming technology affects the FPGA area
14
14 SRAM Programming Technology Configuration storage on SRAM cells Volatile (FPGA has to be reprogrammed on power-up) Large area (SRAM cells) Allows dynamic and partial reconfiguration
15
15 Antifuse Programming Technology Programming element is an antifuse (high impedance (open-circuit) on low voltage, low impedance (connection) on high voltage) Small area Non-volatile (no need for reprogramming on power-up) Irreversible (design errors cannot be corrected)
16
16 EPROM, EEPROM and Flash Programming Technology Non-volatile Reprogramming through exposure to ultraviolet light (EPROM) or electrical signals (EEPROM/Flash) Slower programming than SRAM
17
17 FPGA Power Consumption FPGA power dissipation components: Interconnection network Clock network Input/Output Logic block
18
18 FPGA Power Consumption Breakdown (XC4003)
19
19 Dynamic vs Static Power Consumption Dynamic power consumption is still dominant, even though the static power consumption component increases with the decrease in feature size.
20
20 Reconfiguration Models Static Reconfiguration Dynamic Reconfiguration Single Context Multi-Context Partial Reconfiguration Pipeline Reconfiguration
21
21 Static Reconfiguration Compile-time Reconfiguration Most common approach One configuration per application System must be halted and then restarted with new program
22
22 Dynamic Reconfiguration Run-time Reconfiguration Based on virtual hardware Trade-off between time and space
23
23 Single Context One configuration at a time Programming using a serial bitstream High overhead for small configuration changes Not suitable for run-time reconfiguration
24
24 Multi-Context Multiple memory bits for each programming bit location Multiplexed set of single context devices One context can be reprogrammed when another is active
25
25 Partial Reconfiguration Addresses used to specify the target location of the configuration data Undisturbed portions of the array can continue execution during reconfiguration Reduces the amount of data that must be transferred to the FPGA
26
26 Pipeline Reconfiguration Partial reconfiguration increments of pipeline stages Used in datapath-style computations
27
27 Run-Time Reconfiguration Algorithmic Reconfiguration Architectural Reconfiguration Functional Reconfiguration Fast Configuration Configuration Prefetching Configuration Compression Relocation and Defragmentation in Partially Reconfigurable Systems Configuration Caching
28
28 Algorithmic Reconfiguration Reconfigure the system with an algorithm which performs the same functionality but with different requirements Adapt dynamically to environment or operational changes
29
29 Architectural Reconfiguration Modify hardware topology by reallocating resources to computations
30
30 Functional Reconfiguration Execute different functions on the same resources Time-share resources across computational tasks
31
31 Fast Configuration Reconfigure the device as fast as possible in order to minimize reconfiguration overhead
32
32 Configuration Prefetching Loading a configuration onto a device in advance, in order to overlap reconfiguration with useful computation The challenge is to determine future configurations
33
33 Configuration Compression Minimize the data that must be loaded to the device in multi-context environment
34
34 Configuration Caching Reducing the amount of configuration data that must be transferred to the device The challenge is to determine which configuration to retain and which to flush
35
35 Commercial Fine-Grain Reconfigurable Architectures Xilinx Spartan-3 /Spartan-3L Virtex-4 Virtex-5 Altera Cyclone Cyclone II Stratix II /Stratix II GX Actel Fusion ProASIC3/ ProASICPLUS Axcelerator Varicore Atmel AT40K/AT40KLV AT6000 Quicklogic PolarPro Eclipse II Lattice LatticeECP2 LatticeXP
36
36 Xilinx Spartan-3 CLB Four slices Two logic function generators/slice Two storage elements/slice Interconnect Long lines (one out of every six CLBs) Hex lines (one out of every three CLBs) Double lines (every other CLB) Direct lines (each CLB with its neighbours) Advanced features BlockRAM Dedicated Multipliers Digital Clock Managers Configuration SRAM
37
37 Xilinx Spartan-3
38
38 Xilinx Virtex-4 Three variations (LX, FX, SX) CLB Four slices Two logic function generators/slice Two storage elements/slice Advanced features BlockRAM XtremeDSP slices Digital Clock Managers Additional features in the FX family 8–24 RocketIO Multi-Gigabit serial Transceivers One or Two PowerPC cores Two or Four Tri-MAC Cores Configuration SRAM
39
39 Xilinx Virtex-5 65 nm ExpressFabric 6-input LUTs Interconnect Diagonal symmetric interconnect Advanced features DCM and PLLs BlockRAM DSP48E slices Configuration SRAM Advanced Encryption Standard technology for bitstream protection
40
40 Altera Cyclone/Cyclone II Essentially the same architecture in 130 nm (Cyclone), and 90 nm (Cyclone II) LE (10 per LAB): 4-input LUT Register Carry chain MultiTrack Interconnect Row and column interconnects spanning fixed distances Advanced Features: Embedded Memory PLLs External RAM interfacing Embedded multipliers (Cyclone II only)
41
41 Cyclone Logic Element
42
42 Altera Stratix II/ Stratix II GX Adaptive Logic Modules: MultiTrack Interconnect Advanced Features: TriMatrix Memory
43
43 Adaptive Logic Module
44
44 Review Questions Can you partially reconfigure a single- context FPGA? How often do you need to reconfigure a SRAM configuration memory FPGA device? One design comprising 200 CLBs and one comprising 400 CLBs are to be downloaded on the same device, that doesn’t support dynamic reconfiguration. How big is the size of the second design bitstream in comparison to the first?
Similar presentations
© 2024 SlidePlayer.com. Inc.
All rights reserved.