1. Michael Hoch / EP-AIT1 TPC Resistor Rod

2. Michael Hoch / EP-AIT2 Resistor Chain: Design Constrains  current per resistor chain: 241  A = 25W (total = 100W)  Temperature stability of 0.1degree  So cooling is required !

3. Michael Hoch / EP-AIT3 Liquid Cooling  Tested liquids: Water, Silicon Oil, C 6 F 14,  Result: No thermal problem, but high risk of gas contamination

4. Michael Hoch / EP-AIT4 Gas Cooling  Cooling capability of gases ~1000 times less efficient than liquids ‒H 2 O:  = 998 [kg/m 3 ], cp= 4190 [J/kgC] ‒Air:  =1.18 [kg/m 3 ], cp= 1007 [J/kgC] ‒CO2:  =1.81 [kg/m 3 ], cp= 844 [J/kgC]  Different approach necessary ‒Return cooling path ‒Insulation around the rod

5. Michael Hoch / EP-AIT5 Test Setup  Thermal Box  ‘Return’ Rod:  Cooling Gas: Air

6. Michael Hoch / EP-AIT6 Setup Boundary Conditions  Same dimensions like inner cooling rod  Gas flow: 10m3/h  Box temp: 20degree  Coolant : air

7. Michael Hoch / EP-AIT7 Rod Temperature Sensors  inside rod coolant path: 1-6  Outside surface : 7-11

8. Michael Hoch / EP-AIT8 Gas temp. along the coolant path

9. Michael Hoch / EP-AIT9 Outer Tube Surface Temperatures

10. Michael Hoch / EP-AIT10 Temperatures around the Rod

11. Michael Hoch / EP-AIT11 Rod with Double Wall Insulation

12. Michael Hoch / EP-AIT12 Resistor Rod Validation  Thermal & vibration test with ‘small double wall’ proto type ‒January 2002  HV & System tests with real size resistor rod ‒Start: March 2002

13. Michael Hoch / EP-AIT13 Conclusion  Thermal results of ‘return rod design’ are promising  Small prototyping helped to optimize the assembly  Resistor Rods will be ready in time