1. Marcello Lunardon - ALICE SPD Meeting 04/02/2003 Problems to be studied Test protocol Thermal conductivity tests What next STATUS OF GLUING AT 04.02.2003

2. Marcello Lunardon - ALICE SPD Meeting 04/02/2003 GLUING THE Silicon Pixel Detectors Main problems to be studied: thermal contact mechanical stability with UV glue

3. Marcello Lunardon - ALICE SPD Meeting 04/02/2003 TEST PROTOCOL (I) a) thermal conductivity measurements measurements for about 0.1 mm adhesive thickness  reduction of candidates to 2-3 - b) complete gluing tests spreading the thermal adhesive on windowed kapton-glass samples fixed with UV glue above the cooling tube  glue spreading procedure tests - c) thermal contact reliability tests w.r.t. thermal cycles - test of thermal contact after many thermal cycles (about 5 – 50 °C ) with best candidates and best glue spreading procedure(s)  best candidate(s) selection and definition of gluing procedure d) irradiation tests with best candidate(s) thermal contact reliability test of best candidate(s) after irradiation  final selection of thermal adhesive Thermal adhesive tests

4. Marcello Lunardon - ALICE SPD Meeting 04/02/2003 TEST PROTOCOL (II) a) UV gluing tests - test the gluing strength with kapton-glass samples to be glued on CFSS - tests of ungluing - tests of clip mounting  UV glue quantity and curing time b) irradiation tests - test the UV gluing strength before and after irradiation Mechanical assembly with UV glue

5. Marcello Lunardon - ALICE SPD Meeting 04/02/2003 GlueVendorTypeThermal cond. [W/m°K] Sample quantity Comments Staystik 541Cookson Electronics Thermoplastic adhesive film 3.0Mhigh temperature for curing Micro Faze KAOSFilm 150 micron1.8Mhigh pressure SE 4486Dow CorningSilicon 1 comp.1.59Mshort workability time CGL7018AI Tech.Epoxy4.1MATLAS study SE 4445Dow CorningSilicon 2 comp.1.26MATLAS study AOS 52032AOSNon sil. Grease0.7Svery soft AOS 52022AOSNon sil. Grease0.7Sless soft AOS 52029AOSNon sil. Grease1.68Sless soft AOS 54034AOSSil. Grease2.58Sless soft LIST OF THERMAL CONDUCTIVE ADHESIVES tested and rejected tested and almost rejected in testing not yet tested

6. Marcello Lunardon - ALICE SPD Meeting 04/02/2003 THERMAL CONDUCTIVITY TESTS (I) R FAN D2 INSULATOR GLUE Let be: DISC 1 at T1 DISC 2 at T2 R dissipating a power W x the thickness of the glue A the area of the glue D1 ° PT100 W = k A (T1 -T2) / x k = x W / (T1 - T2)A T from R(PT100) and tables (0.387  / K) °

7. Marcello Lunardon - ALICE SPD Meeting 04/02/2003 THERMAL CONDUCTIVITY TESTS (II) Glue Thickness [micron] Area [cm 2 ] W [W]T1 – T2 [°K] k measured [W/°Km] k nominal [W/°Km]  T/W [°K/W] MICRO FAZE K with 4.6 psi pressure (320 g/cm2) 145 ± 6 9.0 ± 0.422.3 ± 0.39.0 ± 0.1 0.40 ± 0.031.8 MICRO FAZE K with 0.1 psi pressure 150 ± 10 9.0 ± 0.422.5 ± 0.312.5 ± 0.1 0.29 ± 0.021.810 SE 4486 95 ± 9 16.6 ± 0.522.5 0 ±.32.17 ± 0.13 0.59 ± 0.061.593.3 SE 4445 190 ± 10 14.5 ± 123.0 ± 0.35.4 ± 0.2 0.56 ± 0.07 (0.5) 1.263.5 36 ± 6 12 ± 123.0 ± 0.32.6 ± 0.2 0.27 ± 0.06 CGL 7018 60 ± 8 14 ± 123.0 ± 0.31.5 ± 0.2 0.66 ± 0.15 (0.6) 43 expected  T/W for 100 micron thickness assuming a chip with 4 x 12.5 = 50 mm 2 thermal contact window PRELIMINARY RESULTS ( in brakets the ATLAS measurements ) tested and rejected tested and almost rejected in testing

8. Marcello Lunardon - ALICE SPD Meeting 04/02/2003 WHAT NEXT More electronics and mechanics for tests Glue dispenserI&J Fisnar mod. DD305arrived and tested UV glue and UV sourceNorland Prod. Inc. mod. Opticure 3 arrived and tested CF clipsINFN PDfirst version ready HeatersINFN PD – simple circuit with thin FR4 substrate design finalized, to be realized CFSS raw supportINFN PDalmost ready XY automated movement for glue dispenser INFN PD to be fixed (soon) Arm for dispenserINFN PDdesign finalized, to be realized Vacuum support for blades INFN PDto be mounted on CFSS support

9. Marcello Lunardon - ALICE SPD Meeting 04/02/2003 a) thermal conductivity measurements - first measurements: done - new setup for more precise measurements: ready b) complete gluing tests - production of kapton-glass samples with windows: to be realized - XY movement for dispenser: to be fixed c) thermal contact reliability tests w.r.t. thermal cycles - mechanical setup and heaters defined, to be realized d) UV gluing tests - production of kapton-glass samples to be glued on CFSS: to be realized - clips: ready to be glued e) irradiation tests with best candidate(s) - setup for both thermal adhesive and UV glue: to be defined WHAT NEXT: PLANNING